Equivalent & Substitute Parts for DF3024F25V

Part Overview

The DF3024F25V is a 16-bit H8/300H microcontroller manufactured by Renesas Electronics Corporation, featuring 128KB FLASH memory and a 25MHz clock speed in a 100-QFP package. This device is classified as obsolete, making equivalent and substitute parts necessary for new designs, production continuity, and system upgrades. Substitute parts must maintain functional compatibility across core processor architecture, memory capacity, I/O count, and package form factor while meeting modern compliance standards.

Substiute Parts

DF3024F25V
Renesas Electronics CorporationIn Stock: 1002DF3024F25V Datasheet
DF3024F25V
Current Part
R5F111PGAFB#30
Renesas Electronics CorporationIn Stock: 1274R5F111PGAFB#30 Datasheet
R5F111PGAFB#30
Similar
MSP430F6726IPZ
Texas InstrumentsIn Stock: 2304MSP430F6726IPZ Datasheet
MSP430F6726IPZ
Similar

Key Parameters

Parameter DF3024F25V
Core Processor H8/300H
Core Size 16-Bit
Speed 25MHz
Program Memory Size 128KB (128K x 8)
Program Memory Type FLASH
RAM Size 4K x 8
Number of I/O 70
Voltage Supply (Vcc/Vdd) 3V ~ 3.6V
Package / Case 100-BFQFP (14x14)
Mounting Type Surface Mount
Operating Temperature -20°C ~ 75°C
RoHS Status ROHS3 Compliant
Product Status Obsolete

Substitute Part Grouping Explanation

Substitute parts for the DF3024F25V are selected based on the following critical parameters that determine functional compatibility:

Core Selection Criteria:

  • 16-bit core processor architecture
  • 128KB FLASH program memory (128K x 8)
  • Minimum 70 I/O pins
  • Surface mount 100-pin QFP package (14x14mm footprint)
  • Operating voltage range compatibility (3V ~ 3.6V minimum overlap)
  • Clock speed at or above 24MHz
  • ROHS3 compliance and modern product status

The two substitute parts listed below meet these electrical and mechanical requirements while offering active product status and enhanced feature sets suitable for modern applications.

Parameter Comparison

Parameter DF3024F25V R5F111PGAFB#30 MSP430F6726IPZ
Manufacturer Renesas Electronics Renesas Electronics Texas Instruments
Core Size 16-Bit 16-Bit 16-Bit
Speed 25MHz 24MHz 25MHz
Program Memory Size 128KB (128K x 8) 128KB (128K x 8) 128KB (128K x 8)
Program Memory Type FLASH FLASH FLASH
RAM Size 4K x 8 12K x 8 8K x 8
Number of I/O 70 73 72
Voltage Supply (Vcc/Vdd) 3V ~ 3.6V 1.6V ~ 3.6V 1.8V ~ 3.6V
Data Converters (A/D) 8x10b 13x8/12b 8x10b, 2x24b
Data Converters (D/A) 2x8b 2x8b Not specified
Package / Case 100-BFQFP (14x14) 100-LQFP (14x14) 100-LQFP (14x14)
Mounting Type Surface Mount Surface Mount Surface Mount
Operating Temperature -20°C ~ 75°C -40°C ~ 85°C -40°C ~ 85°C
Product Status Obsolete Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
MSL Rating 3 (168 Hours) 3 (168 Hours) 3 (168 Hours)

Engineering Selection Recommendations

R5F111PGAFB#30 (Renesas RL78/L1C Series)

This substitute maintains Renesas ecosystem compatibility and is recommended for designs requiring minimal architectural migration. The RL78/L1C core operates at 24MHz, meeting the speed requirement with a 1MHz reduction from the original. It provides enhanced RAM (12K x 8 versus 4K x 8), three additional I/O pins (73 versus 70), and extended operating temperature range (-40°C to 85°C). The lower minimum supply voltage (1.6V) offers greater flexibility. Active product status ensures long-term availability and support. Package compatibility is maintained with 100-LQFP form factor on identical 14x14mm footprint.

MSP430F6726IPZ (Texas Instruments MSP430F6xx Series)

This substitute provides cross-manufacturer compatibility and is suitable for designs open to architectural change. The MSP430 CPUXV2 core matches the original 25MHz speed specification and maintains 128KB FLASH capacity. It delivers superior I/O count (72 versus 70) and enhanced RAM (8K x 8 versus 4K x 8). The device includes advanced peripherals such as DMA and brown-out detection not present in the original. Extended operating temperature range (-40°C to 85°C) and lower minimum supply voltage (1.8V) provide operational advantages. Active product status ensures production continuity. Package compatibility is maintained with 100-LQFP form factor on identical 14x14mm footprint.

Both substitutes are ROHS3 compliant with MSL rating 3 (168 Hours), meeting modern regulatory and environmental requirements.

Frequently Asked Questions (FAQ)

Q: Can R5F111PGAFB#30 and MSP430F6726IPZ be used interchangeably with DF3024F25V?

A: Both parts meet the core electrical and mechanical substitution criteria: 16-bit architecture, 128KB FLASH memory, 70+ I/O pins, 100-pin QFP package, and compatible supply voltage ranges. However, they represent different processor families (RL78 and MSP430 respectively) with distinct instruction sets and peripheral architectures. Direct code compatibility is not guaranteed. Firmware porting and validation are required for each substitute.

Q: What are the key differences in package compatibility?

A: The original DF3024F25V uses 100-BFQFP packaging, while both substitutes use 100-LQFP packaging. Both are 14x14mm surface mount packages with 100 pins. Pin pitch and footprint are identical, allowing PCB reuse without layout modification. Verify pinout mapping during design integration.

Q: Why does R5F111PGAFB#30 operate at 24MHz instead of 25MHz?

A: The RL78/L1C series maximum clock speed is 24MHz. This 1MHz reduction is within typical system tolerance for most applications. If precise 25MHz operation is critical, MSP430F6726IPZ maintains the original speed specification.

Q: Are there supply voltage considerations when substituting?

A: The original DF3024F25V requires 3V ~ 3.6V supply. Both substitutes accept this range and extend it downward (R5F111PGAFB#30 to 1.6V, MSP430F6726IPZ to 1.8V). Existing 3V ~ 3.6V power supplies are compatible with both substitutes without modification.

Q: What is the impact of increased RAM on system design?

A: R5F111PGAFB#30 provides 12K x 8 RAM (versus 4K x 8 original), and MSP430F6726IPZ provides 8K x 8 RAM. Increased RAM capacity allows larger data buffers and more complex algorithms without external memory. This is a functional enhancement requiring no design changes.

Q: How do operating temperature ranges affect application suitability?

A: The original DF3024F25V operates -20°C to 75°C. Both substitutes extend this to -40°C to 85°C, providing wider environmental tolerance. Applications requiring the original narrower range remain compatible; applications requiring extended temperature operation benefit from the substitutes.

Q: Is firmware modification required when switching to a substitute part?

A: Yes. While electrical and mechanical compatibility is maintained, the processor cores are architecturally distinct. Firmware must be ported to the target processor family, including instruction set translation, peripheral driver adaptation, and functional validation. No automatic code conversion is possible.

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