DF2329VF25V Equivalent & Substitute Parts

Part Overview

The DF2329VF25V is a 16-bit H8S/2300 microcontroller manufactured by Renesas Electronics Corporation, featuring 384KB FLASH memory, 32KB RAM, and 86 I/O pins in a 128-QFP package. This component is classified as Obsolete, making identification of compatible substitute parts essential for ongoing system support and component procurement.

The necessity to identify equivalent parts stems from the product's obsolete status, which restricts availability through standard distribution channels and may impact long-term supply chain reliability for applications currently utilizing this microcontroller.

Substiute Parts

DF2329VF25V

Renesas Electronics CorporationIn Stock: 1228DF2329VF25V Datasheet

Current PartRFQ

DF2329BVF25V

Renesas Electronics CorporationIn Stock: 2268DF2329BVF25V Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the DF2329VF25V is determined by strict equivalence across the following critical parameters:

• Core processor architecture (H8S/2000)
• Core size (16-Bit)
• Operating frequency (25MHz)
• Program memory capacity and type (384KB FLASH)
• RAM capacity (32K x 8)
• Supply voltage range (2.7V ~ 3.6V)
• I/O pin count (86)
• Peripheral feature set (DMA, POR, PWM, WDT)
• Data converter specifications (A/D 8x10b; D/A 2x8b)
• Package type and pin configuration (128-BFQFP 14x20)
• Operating temperature range (-20°C ~ 75°C)

The DF2329BVF25V meets all substitution criteria as it maintains identical electrical specifications, memory configuration, peripheral functionality, and package geometry. The primary distinction is packaging format (Tray vs. standard packaging) and product lifecycle status.

Parameter Comparison

Engineering Selection Recommendations

The DF2329BVF25V serves as a direct functional equivalent to the DF2329VF25V, with identical electrical and mechanical specifications. Both components maintain ROHS3 compliance and REACH unaffected status, satisfying regulatory requirements for industrial and commercial applications.

Selection between these parts should be based on:

• Product lifecycle considerations: DF2329VF25V is classified as Obsolete, while DF2329BVF25V is designated Not For New Designs, indicating extended but limited availability
• Packaging requirements: DF2329BVF25V is supplied in Tray format, which may affect procurement workflows and inventory management
• Supply chain availability: Current inventory levels and procurement lead times from authorized distributors
• Compliance documentation requirements: Both parts maintain equivalent regulatory certifications

For applications requiring long-term component availability and support, evaluation of alternative H8S/2300 series microcontrollers with active product status should be considered as part of comprehensive design review.

Frequently Asked Questions (FAQ)

Q: Can DF2329BVF25V be used as a direct replacement for DF2329VF25V in existing designs?

A: Yes. The DF2329BVF25V is electrically and mechanically equivalent to the DF2329VF25V. All functional parameters, memory configuration, peripheral features, I/O count, voltage specifications, and package geometry are identical. The primary difference is packaging format (Tray) and product lifecycle status.

Q: What is the significance of the product status difference between these parts?

A: DF2329VF25V is classified as Obsolete, indicating discontinued production and limited availability. DF2329BVF25V is designated Not For New Designs, indicating production has ceased but existing inventory may remain available. Neither status affects functional compatibility; the distinction impacts procurement strategy and long-term supply chain planning.

Q: Are there any compatibility concerns with the 128-BFQFP package format?

A: No. Both parts use identical 128-BFQFP (14x20) package geometry with 86 I/O pins in the same configuration. PCB footprints, pin assignments, and mechanical mounting requirements are equivalent.

Q: Do both parts meet the same regulatory and compliance standards?

A: Yes. Both DF2329VF25V and DF2329BVF25V maintain ROHS3 compliance and REACH unaffected status. Moisture sensitivity level (MSL 3, 168 Hours) is identical for both components.

Q: What is the difference between standard packaging and Tray packaging?

A: Tray packaging refers to the delivery format for surface mount components. DF2329BVF25V is supplied in Tray format, which affects handling, storage, and automated assembly processes. This distinction does not impact electrical performance or functional compatibility.

Q: Should new designs use either of these microcontrollers?

A: No. Both components are classified as Obsolete or Not For New Designs. New designs should evaluate active H8S/2300 series alternatives or consider migration to current-generation Renesas microcontroller families to ensure long-term support and availability.