DF2329VF25IV Equivalent & Substitute Parts

Part Overview

The DF2329VF25IV is a 16-bit microcontroller from Renesas Electronics Corporation's H8® H8S/2300 series, featuring 384KB FLASH memory and operating at 25MHz. This device is classified as Active product status and is suitable for embedded applications requiring moderate processing capability with integrated peripherals including SCI, SmartCard connectivity, DMA, PWM, and watchdog timer functionality.

Identifying equivalent and substitute parts becomes necessary when the primary part number reaches end-of-life status, experiences supply constraints, or when design requirements permit functional alternatives. The DF2329VF25IV maintains full compatibility with its identified substitute through identical core electrical and mechanical specifications.

Key Parameters

Parameter	Value
Core Processor	H8S/2000
Core Size	16-Bit
Speed	25MHz
Program Memory Size	384KB (384K x 8)
Program Memory Type	FLASH
RAM Size	32K x 8
Voltage Supply (Vcc/Vdd)	2.7V ~ 3.6V
Number of I/O	86
Data Converters	A/D 8x10b; D/A 2x8b
Operating Temperature	-40°C ~ 85°C (TA)
Package / Case	128-BFQFP (14x20)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the DF2329VF25IV is determined by strict equivalence across the following critical parameters:

Core processor architecture (H8S/2000)
Core bit width (16-Bit)
Operating frequency (25MHz)
Program memory capacity and type (384KB FLASH)
RAM capacity (32K x 8)
Supply voltage range (2.7V ~ 3.6V)
I/O pin count (86)
Data converter specifications (A/D 8x10b; D/A 2x8b)
Operating temperature range (-40°C ~ 85°C)
Package type and dimensions (128-BFQFP 14x20)
Mounting technology (Surface Mount)

The DF2329BVF25WV meets all substitution criteria through identical electrical and mechanical specifications. Differences in packaging format (Tray vs. standard packaging) and product status classification do not affect functional interchangeability in circuit design and application deployment.

Parameter Comparison

Parameter	DF2329VF25IV	DF2329BVF25WV
Manufacturer	Renesas Electronics Corporation	Renesas Electronics Corporation
Series	H8® H8S/2300	H8® H8S/2300
Core Processor	H8S/2000	H8S/2000
Core Size	16-Bit	16-Bit
Speed	25MHz	25MHz
Program Memory Size	384KB (384K x 8)	384KB (384K x 8)
Program Memory Type	FLASH	FLASH
RAM Size	32K x 8	32K x 8
Voltage Supply (Vcc/Vdd)	2.7V ~ 3.6V	2.7V ~ 3.6V
Number of I/O	86	86
Data Converters	A/D 8x10b; D/A 2x8b	A/D 8x10b; D/A 2x8b
Connectivity	SCI, SmartCard	SCI, SmartCard
Peripherals	DMA, POR, PWM, WDT	DMA, POR, PWM, WDT
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Package / Case	128-BFQFP (14x20)	128-BFQFP (14x20)
Mounting Type	Surface Mount	Surface Mount
RoHS Status	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)	3 (168 Hours)
REACH Status	REACH Unaffected	REACH Unaffected

Engineering Selection Recommendations

The DF2329VF25IV is designated as Active product status, indicating continued manufacturer support and availability for new designs. The DF2329BVF25WV is classified as Not For New Designs, reflecting its transition toward end-of-life status.

For new design implementations, the DF2329VF25IV is the primary selection. Both parts maintain ROHS3 compliance and REACH Unaffected status, satisfying environmental and regulatory requirements for industrial and commercial applications.

The DF2329BVF25WV remains functionally equivalent and suitable for legacy system maintenance, field replacements, and applications where existing inventory or supply chain constraints necessitate alternative sourcing. Packaging format differences (Tray for DF2329BVF25WV) do not affect circuit-level performance or pin compatibility.

Frequently Asked Questions (FAQ)

Q: Are DF2329VF25IV and DF2329BVF25WV pin-compatible?

A: Yes. Both devices feature identical 128-BFQFP package geometry (14x20mm) with 86 I/O pins in the same configuration. Direct socket substitution is supported without PCB redesign.

Q: What is the difference between the two part numbers?

A: The primary differences are product status classification and packaging format. DF2329VF25IV is Active; DF2329BVF25WV is Not For New Designs. Both share identical electrical specifications, memory configuration, and operating parameters.

Q: Can DF2329BVF25WV be used in new designs?

A: Functionally, yes. However, the Not For New Designs status indicates reduced manufacturer support and potential supply discontinuation. New designs should prioritize DF2329VF25IV for long-term availability and support.

Q: Are there supply voltage or temperature rating differences?

A: No. Both parts operate across 2.7V to 3.6V supply range and -40°C to 85°C temperature range. Electrical operating specifications are identical.

Q: What does ROHS3 Compliant mean for these parts?

A: Both devices comply with Restriction of Hazardous Substances (RoHS) Directive 3, restricting specified hazardous materials in their composition. This certification is required for many industrial and consumer applications.

Q: Is the Moisture Sensitivity Level (MSL) rating the same?

A: Yes. Both parts carry MSL 3 rating with 168-hour floor life, requiring controlled storage and handling conditions during manufacturing and assembly processes.

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