DF2238BTF13V Equivalent & Substitute Parts

Part Overview

The DF2238BTF13V is a 16-bit microcontroller from Renesas Electronics Corporation's H8® H8S/2200 series, featuring 256KB FLASH memory and operating at 13MHz. This device is classified as Active product status and is suitable for embedded applications requiring moderate processing capability with integrated analog and digital peripherals.

Identifying equivalent and substitute parts becomes necessary when the primary part number reaches end-of-life status, experiences supply constraints, or when design requirements permit functional alternatives within the same product family. The DF2238BTF13V maintains compatibility with substitute variants that share identical core specifications while potentially differing in packaging configuration.

Substiute Parts

DF2238BTF13V
Renesas Electronics CorporationIn Stock: 1115DF2238BTF13V Datasheet
DF2238BTF13V
Current Part
DF2238BFA13V
Renesas Electronics CorporationIn Stock: 1063DF2238BFA13V Datasheet
DF2238BFA13V
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Key Parameters

Parameter Value
Core Processor H8S/2000
Core Size 16-Bit
Speed 13MHz
Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH
RAM Size 16K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V
Number of I/O 72
Data Converters A/D 8x10b; D/A 2x8b
Connectivity I2C, SCI, SmartCard
Peripherals POR, PWM, WDT
Operating Temperature -20°C ~ 75°C (TA)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the DF2238BTF13V is determined by strict equivalence across the following critical parameters:

  • Core processor architecture (H8S/2000)
  • Core bit width (16-Bit)
  • Operating frequency (13MHz)
  • Program memory capacity and type (256KB FLASH)
  • RAM capacity (16K x 8)
  • Supply voltage range (3V ~ 5.5V)
  • I/O count (72 pins)
  • Integrated peripheral set (I2C, SCI, SmartCard, POR, PWM, WDT)
  • Data converter specifications (A/D 8x10b; D/A 2x8b)
  • Operating temperature range (-20°C ~ 75°C)
  • RoHS and environmental compliance status

Variations in package type and form factor do not affect functional substitution when all electrical and logical specifications remain identical. The DF2238BFA13V qualifies as a substitute based on complete alignment with these parameters.

Parameter Comparison

Parameter DF2238BTF13V (Main) DF2238BFA13V (Substitute)
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation
Series H8® H8S/2200 H8® H8S/2200
Core Processor H8S/2000 H8S/2000
Core Size 16-Bit 16-Bit
Speed 13MHz 13MHz
Program Memory Size 256KB (256K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
RAM Size 16K x 8 16K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V
Number of I/O 72 72
Data Converters A/D 8x10b; D/A 2x8b A/D 8x10b; D/A 2x8b
Connectivity I2C, SCI, SmartCard I2C, SCI, SmartCard
Peripherals POR, PWM, WDT POR, PWM, WDT
Operating Temperature -20°C ~ 75°C (TA) -20°C ~ 75°C (TA)
Mounting Type Surface Mount Surface Mount
Supplier Device Package 100-TQFP (12x12) 100-QFP (14x14)
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours)
Product Status Active Not For New Designs

Engineering Selection Recommendations

The DF2238BTF13V is the preferred selection for new designs due to its Active product status, ensuring long-term availability and manufacturer support. This part number should be the primary choice for all new development projects.

The DF2238BFA13V functions as a direct functional equivalent but carries a "Not For New Designs" designation. This substitute is applicable only in legacy system maintenance, repair operations, or situations where existing inventory must be utilized. The substitute maintains identical electrical performance and peripheral functionality but differs in physical package dimensions (100-QFP 14x14 versus 100-TQFP 12x12).

Both parts maintain ROHS3 compliance and identical environmental certifications, ensuring regulatory equivalence. Selection between these variants should be driven by PCB layout constraints and existing design documentation rather than functional capability.

Frequently Asked Questions (FAQ)

Q: Can DF2238BFA13V be used as a direct replacement for DF2238BTF13V in existing designs?

A: Functional substitution is possible due to identical core specifications, memory configuration, and peripheral set. However, the package footprint differs (100-QFP 14x14 versus 100-TQFP 12x12), requiring PCB layout verification and potential redesign of the component placement area.

Q: What is the primary difference between these two part numbers?

A: The primary difference is the package type and form factor. The DF2238BTF13V uses a 100-TQFP package with 12x12mm dimensions, while the DF2238BFA13V uses a 100-QFP package with 14x14mm dimensions. All electrical specifications, memory capacity, and peripheral functionality remain identical.

Q: Why is DF2238BFA13V marked as "Not For New Designs"?

A: This designation indicates the part is in a mature or declining phase of its product lifecycle. Renesas Electronics recommends using the DF2238BTF13V for new development projects to ensure long-term availability and continued manufacturer support.

Q: Are there any compliance or certification differences between these parts?

A: No. Both parts maintain identical RoHS3 compliance, REACH status, and Moisture Sensitivity Level (MSL 3, 168 Hours). Environmental and regulatory certifications are equivalent.

Q: What considerations apply when switching from DF2238BTF13V to DF2238BFA13V?

A: PCB layout modification is the primary consideration due to package dimension differences. The larger 100-QFP footprint (14x14mm) requires verification of available board space and potential rerouting of signal traces. Electrical performance and firmware compatibility remain unchanged.

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