DF2238ATE13V Equivalent & Substitute Parts

Part Overview

The DF2238ATE13V is a 16-bit H8S/2200 microcontroller manufactured by Renesas Electronics Corporation, featuring 256KB FLASH program memory, 16KB RAM, and 72 I/O pins in a 100-TQFP surface mount package. This device integrates I2C, SCI, and SmartCard connectivity with integrated analog-to-digital and digital-to-analog converters. The product is classified as Obsolete, necessitating identification of functionally equivalent alternatives for ongoing system support and new design considerations.

Substiute Parts

DF2238ATE13V

Renesas Electronics CorporationIn Stock: 849DF2238ATE13V Datasheet

Current PartRFQ

DF2238BFA13V

Renesas Electronics CorporationIn Stock: 1063DF2238BFA13V Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the DF2238ATE13V is determined by strict equivalence across the following critical parameters:

• Core Processor Architecture: H8S/2000 core
• Memory Configuration: 256KB FLASH program memory and 16KB RAM
• Processing Speed: 13MHz operation
• I/O Count: 72 I/O pins
• Voltage Supply Range: 3V ~ 5.5V
• Data Conversion Capability: A/D 8x10b and D/A 2x8b
• Connectivity Interfaces: I2C, SCI, SmartCard support
• Peripheral Features: POR, PWM, WDT
• Operating Temperature Range: -20°C ~ 75°C
• Base Product Number: DF2238

The DF2238BFA13V qualifies as a substitute based on identical core specifications, memory, speed, I/O configuration, voltage range, data converters, connectivity, peripherals, and temperature range. The difference lies in package designation (100-QFP versus 100-TQFP) and product status classification.

Parameter Comparison

Engineering Selection Recommendations

Both the DF2238ATE13V and DF2238BFA13V are classified as discontinued products. The DF2238ATE13V carries Obsolete status, while the DF2238BFA13V is designated Not For New Designs. Both devices maintain ROHS3 compliance and identical functional specifications across all critical parameters.

Selection between these parts is determined by PCB layout and assembly process requirements. The DF2238ATE13V uses 100-TQFP packaging, while the DF2238BFA13V uses 100-BFQFP (14x14) packaging. Both packages are surface mount with equivalent pin counts and I/O configurations. The choice depends on existing board design constraints and manufacturing capabilities.

For applications requiring continued support of H8S/2200 architecture, both parts are functionally interchangeable provided PCB footprint and assembly process accommodate the respective package designations.

Frequently Asked Questions (FAQ)

Q: Can DF2238BFA13V replace DF2238ATE13V in existing designs?

A: Yes, provided the PCB footprint accommodates the 100-BFQFP (14x14) package. All functional parameters, memory configuration, I/O count, voltage supply range, and peripheral features are identical. Assembly process compatibility with the substitute package must be confirmed.

Q: What is the difference between 100-TQFP and 100-BFQFP packaging?

A: Both are 100-pin surface mount packages with identical pin counts and I/O configurations. The primary difference is package geometry and thermal characteristics. The BFQFP designation indicates a bumpered or different lead frame design. Pin-to-pin compatibility exists, but PCB footprint design must match the specific package variant.

Q: Are both parts suitable for new designs?

A: No. The DF2238ATE13V is classified as Obsolete, and the DF2238BFA13V is classified as Not For New Designs. Both products are discontinued by Renesas Electronics Corporation. New designs should evaluate current-generation H8S or alternative microcontroller families from Renesas.

Q: What compliance certifications apply to both parts?

A: Both the DF2238ATE13V and DF2238BFA13V are ROHS3 compliant and REACH unaffected. Both carry ECCN classification EAR99 and HTSUS code 8542.31.0001. Moisture sensitivity level is 3 (168 hours) for both variants.

Q: Are there any differences in electrical performance between the two parts?

A: No. Core processor, clock speed, memory size, I/O configuration, voltage supply range, data converter specifications, connectivity interfaces, and peripheral features are identical. Performance differences, if any, would be limited to thermal characteristics related to package design.