DF2212UFP24V Equivalent & Substitute Parts

Part Overview

The DF2212UFP24V is a 16-bit microcontroller from Renesas Electronics Corporation's H8S/2200 series, featuring 128KB FLASH memory, 12KB RAM, and a 24MHz core processor. This device is classified as Active product status and is suitable for embedded applications requiring moderate processing capability with integrated connectivity options including SCI, SmartCard, and USB interfaces.

Identifying equivalent and substitute parts is necessary when the primary part number becomes unavailable, when alternative packaging options are required, or when design flexibility demands component alternatives that maintain functional and electrical compatibility within the same product family.

Substiute Parts

DF2212UFP24V

Renesas Electronics CorporationIn Stock: 1077DF2212UFP24V Datasheet

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DF2212FP24V

Renesas Electronics CorporationIn Stock: 1333DF2212FP24V Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the DF2212UFP24V is determined by strict equivalence across the following critical parameters:

• Processor Architecture: H8S/2000 core with 16-bit instruction set
• Memory Configuration: 128KB FLASH program memory and 12KB RAM
• Operating Frequency: 24MHz clock speed
• Electrical Specifications: 2.7V to 3.6V supply voltage range
• Peripheral Set: Identical connectivity (SCI, SmartCard, USB) and integrated peripherals (DMA, POR, PWM, WDT)
• I/O Count: 37 input/output pins
• Package Type: 64-LQFP surface mount package (10x10mm)
• Environmental Compliance: ROHS3 compliance and MSL 3 rating

The DF2212FP24V qualifies as a direct substitute based on matching all electrical, functional, and mechanical parameters. The primary distinction is packaging format (Tray versus standard packaging) and product lifecycle status.

Parameter Comparison

Engineering Selection Recommendations

The DF2212FP24V is functionally and electrically equivalent to the DF2212UFP24V across all critical parameters. Both devices maintain identical electrical specifications, memory configurations, peripheral sets, and environmental compliance ratings (ROHS3 and MSL 3).

The primary consideration for component selection is product lifecycle status. The DF2212UFP24V carries Active status, indicating ongoing manufacturer support and suitability for new designs. The DF2212FP24V is designated as Not For New Designs, which reflects its position in the product lifecycle but does not affect functional compatibility or electrical performance.

Packaging format differs between the two parts: DF2212UFP24V uses standard packaging while DF2212FP24V is supplied in Tray format. This distinction affects handling, storage, and assembly processes but does not impact electrical or functional characteristics.

Selection between these parts should be based on design phase requirements and supply chain availability. For new product development, the Active-status DF2212UFP24V is the preferred choice. The DF2212FP24V remains suitable for applications where component availability or cost considerations justify its use, provided that the Not For New Designs status aligns with project lifecycle requirements.

Frequently Asked Questions (FAQ)

Q: Are DF2212UFP24V and DF2212FP24V pin-compatible?

A: Yes. Both devices use the 64-LQFP package with identical pin assignments, electrical characteristics, and functional specifications. No PCB redesign is required for substitution.

Q: What does "Not For New Designs" mean for the DF2212FP24V?

A: This designation indicates the part is in the mature or end-of-life phase of its product lifecycle. It remains fully functional and compliant with all specifications but may have limited long-term availability. Renesas recommends the Active-status DF2212UFP24V for new product development.

Q: Can I use DF2212FP24V in place of DF2212UFP24V in existing designs?

A: Yes. The electrical and functional parameters are identical. Substitution is valid from a technical standpoint. Verify packaging format compatibility with your assembly process, as the Tray packaging may differ from your current supply chain.

Q: Are there differences in memory or processing capability between these parts?

A: No. Both parts feature identical 128KB FLASH memory, 12KB RAM, 24MHz processor speed, and peripheral configurations. Memory and processing capability are equivalent.

Q: Do both parts meet the same environmental and compliance standards?

A: Yes. Both DF2212UFP24V and DF2212FP24V are ROHS3 compliant with MSL 3 rating (168 Hours). Environmental specifications and compliance certifications are identical.

Q: What is the difference between standard packaging and Tray packaging?

A: Tray packaging is a bulk handling format used for high-volume assembly operations. Standard packaging typically refers to individual or smaller quantity formats. Both formats contain identical components; the difference is in presentation and handling for manufacturing processes.

Q: Can I mix DF2212UFP24V and DF2212FP24V in the same production run?

A: Yes, from a functional and electrical standpoint. However, verify that your assembly and quality control processes accommodate both packaging formats, as handling and traceability procedures may differ.