DF2212CUFP24V Equivalent & Substitute Parts

Part Overview

The DF2212CUFP24V is a 16-bit microcontroller from Renesas Electronics Corporation's H8® H8S/2200 series, designed for embedded applications requiring 128KB flash memory and 24MHz operation. This device is currently in Active product status and available in high volume (799 pcs in stock). Identifying equivalent substitute parts becomes necessary when addressing supply chain constraints, packaging preferences, or design phase transitions while maintaining functional and electrical compatibility.

Substiute Parts

DF2212CUFP24V
Renesas Electronics CorporationIn Stock: 843DF2212CUFP24V Datasheet
DF2212CUFP24V
Current Part
DF2212FP24V
Renesas Electronics CorporationIn Stock: 1333DF2212FP24V Datasheet
DF2212FP24V
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Key Parameters

Parameter Value
Manufacturer Renesas Electronics Corporation
Series H8® H8S/2200
Core Processor H8S/2000
Core Size 16-Bit
Speed 24MHz
Program Memory Size 128KB (128K x 8)
Program Memory Type FLASH
RAM Size 12K x 8
Voltage Supply (Vcc/Vdd) 2.7V ~ 3.6V
Number of I/O 37
Data Converters A/D 6x10b
Connectivity SCI, SmartCard, USB
Peripherals DMA, POR, PWM, WDT
Operating Temperature -20°C ~ 75°C (TA)
Package / Case 64-LQFP
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the DF2212CUFP24V is determined by strict equivalence across the following critical parameters:

  • Core Architecture & Performance: H8S/2000 processor, 16-bit core, 24MHz speed
  • Memory Configuration: 128KB FLASH (128K x 8), 12K x 8 RAM
  • Electrical Specifications: 2.7V ~ 3.6V supply voltage range
  • Functional Features: Identical I/O count (37), connectivity options (SCI, SmartCard, USB), and peripheral set (DMA, POR, PWM, WDT)
  • Package Compatibility: 64-LQFP (10x10) form factor, surface mount technology
  • Compliance Standards: ROHS3 compliance, MSL 3 rating

The DF2212FP24V qualifies as a direct substitute based on complete alignment with all electrical and mechanical parameters. The primary distinction lies in packaging format (Tray vs. standard packaging) and product lifecycle status.

Parameter Comparison

Parameter DF2212CUFP24V (Main) DF2212FP24V (Substitute)
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation
Series H8® H8S/2200 H8® H8S/2200
Core Processor H8S/2000 H8S/2000
Core Size 16-Bit 16-Bit
Speed 24MHz 24MHz
Program Memory Size 128KB (128K x 8) 128KB (128K x 8)
Program Memory Type FLASH FLASH
RAM Size 12K x 8 12K x 8
Voltage Supply (Vcc/Vdd) 2.7V ~ 3.6V 2.7V ~ 3.6V
Number of I/O 37 37
Data Converters A/D 6x10b A/D 6x10b
Connectivity SCI, SmartCard, USB SCI, SmartCard, USB
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Operating Temperature -20°C ~ 75°C (TA) -20°C ~ 75°C (TA)
Package / Case 64-LQFP 64-LQFP
Mounting Type Surface Mount Surface Mount
Supplier Device Package 64-LFQFP (10x10) 64-LFQFP (10x10)
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN EAR99 EAR99
HTSUS 8542.31.0001 8542.31.0001
Product Status Active Not For New Designs
Packaging Format Standard Tray
Inventory Availability 799 Pcs 1264 Pcs

Engineering Selection Recommendations

DF2212CUFP24V is the preferred selection for new designs and active development phases. This part carries Active product status from Renesas Electronics Corporation, ensuring long-term availability, ongoing technical support, and compliance with current manufacturing standards. The standard packaging format aligns with typical procurement workflows.

DF2212FP24V serves as a functional equivalent for applications where the primary constraint is component availability or where existing inventory in Tray packaging is acceptable. However, this part is designated "Not For New Designs" by the manufacturer, indicating a transition phase in its product lifecycle. Selection of this substitute should be limited to legacy system maintenance, field replacements, or situations where supply chain continuity is the determining factor.

Both parts maintain identical electrical performance, memory configuration, and compliance certifications (ROHS3, REACH Unaffected, EAR99). The choice between them should be driven by product lifecycle requirements and packaging logistics rather than functional considerations.

Frequently Asked Questions (FAQ)

Q: Can DF2212FP24V be used as a direct replacement for DF2212CUFP24V in new product designs?

A: From an electrical and functional standpoint, yes. Both devices share identical core specifications, memory capacity, I/O configuration, and operating parameters. However, DF2212FP24V carries "Not For New Designs" status, meaning Renesas Electronics Corporation does not recommend it for new development. New designs should prioritize DF2212CUFP24V (Active status) to ensure long-term support and availability.

Q: Are there any differences in pin configuration or package dimensions between these parts?

A: No. Both parts use the 64-LQFP (10x10) package with identical pin assignments, mechanical dimensions, and surface mount compatibility. They are mechanically and electrically interchangeable at the PCB level.

Q: What is the significance of the packaging format difference (standard vs. Tray)?

A: Packaging format affects logistics and handling but does not impact electrical performance or functionality. Standard packaging typically suits general procurement workflows, while Tray packaging is optimized for high-volume automated assembly. The choice depends on manufacturing process requirements and inventory management practices.

Q: Do both parts meet the same compliance and regulatory requirements?

A: Yes. Both DF2212CUFP24V and DF2212FP24V are ROHS3 compliant, REACH unaffected, and classified under ECCN EAR99. They share identical Moisture Sensitivity Level (MSL 3, 168 Hours) and HTSUS classification (8542.31.0001).

Q: Which part should be selected for a legacy system requiring component replacement?

A: Either part is suitable for legacy system maintenance based on functional equivalence. Selection should prioritize availability and cost. DF2212FP24V currently has higher inventory (1264 pcs vs. 799 pcs), making it a practical choice for field replacements where supply is the primary consideration.

Q: Are there any performance differences in speed, memory, or I/O capabilities?

A: No. Both devices operate at 24MHz, provide 128KB FLASH and 12K x 8 RAM, and feature 37 I/O pins with identical connectivity (SCI, SmartCard, USB) and peripheral sets (DMA, POR, PWM, WDT).

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