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DF1508SP-G Bridge Rectifier Equivalent & Substitute Parts
Part Overview
The DF1508SP-G is a single-phase bridge rectifier manufactured by Comchip Technology, rated for 800 V peak reverse voltage and 1.5 A average rectified current. This component is classified as obsolete, necessitating identification of active equivalent and substitute parts for ongoing design requirements and procurement needs. The part is housed in a 4-SMD, Gull Wing surface mount package and operates across a temperature range of -55°C to 150°C.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Diode Type | Single Phase |
| Technology | Standard |
| Voltage - Peak Reverse (Max) | 800 V |
| Current - Average Rectified (Io) | 1.5 A |
| Voltage - Forward (Vf) (Max) @ If | 1.1 V @ 1.5 A |
| Operating Temperature Range | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Package / Case | 4-SMD, Gull Wing |
Substitute Part Grouping Explanation
Substitution of the DF1508SP-G is determined by electrical and mechanical parameter equivalence. All substitute parts must satisfy the following criteria:
Critical Substitution Parameters:
- Diode Type: Single Phase
- Voltage - Peak Reverse (Max): 800 V
- Current - Average Rectified (Io): 1.5 A
- Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 1.5 A
- Operating Temperature Range: -55°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 4-SMD, Gull Wing
Substitute parts are grouped into two categories: manufacturer-recommended active alternatives and parametric equivalents from alternative manufacturers. All identified substitutes maintain electrical performance specifications and physical form factor compatibility with the original DF1508SP-G design.
Parameter Comparison
| Part Number | Manufacturer | Product Status | Voltage - Peak Reverse (Max) | Current - Average Rectified (Io) | Voltage - Forward (Vf) (Max) @ If | Current - Reverse Leakage @ Vr | Operating Temperature | Package / Case | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|
| DF1508SP-G | Comchip Technology | Obsolete | 800 V | 1.5 A | 1.1 V @ 1.5 A | 5 µA @ 800 V | -55°C ~ 150°C | 4-SMD, Gull Wing | Not Specified |
| DF1508S-G | Comchip Technology | Active | 800 V | 1.5 A | 1.1 V @ 1.5 A | 10 µA @ 800 V | -55°C ~ 150°C | 4-SMD, Gull Wing | ROHS3 Compliant |
| DBLS156G C1G | Taiwan Semiconductor Corporation | Active | 800 V | 1.5 A | 1.1 V @ 1.5 A | 2 µA @ 800 V | -55°C ~ 150°C | 4-SMD, Gull Wing | ROHS3 Compliant |
| DBLS156GHC1G | Taiwan Semiconductor Corporation | Active | 800 V | 1.5 A | 1.1 V @ 1.5 A | 2 µA @ 800 V | -55°C ~ 150°C | 4-SMD, Gull Wing | ROHS3 Compliant |
| DF1508S-E3/45 | Vishay General Semiconductor - Diodes Division | Active | 800 V | 1.5 A | 1.1 V @ 1.5 A | 10 µA @ 800 V | -55°C ~ 150°C | 4-SMD, Gull Wing | ROHS3 Compliant |
| DFL1508S-E3/45 | Vishay General Semiconductor - Diodes Division | Active | 800 V | 1.5 A | 1.1 V @ 1.5 A | 5 µA @ 800 V | -55°C ~ 150°C | 4-SMD, Gull Wing | ROHS3 Compliant |
Engineering Selection Recommendations
Manufacturer-Recommended Substitute:
DF1508S-G (Comchip Technology) is the primary recommended substitute. This part is an active product from the original manufacturer, maintaining the same electrical specifications and package form factor as the DF1508SP-G. The DF1508S-G carries ROHS3 compliance and unlimited moisture sensitivity level (MSL 1), supporting modern manufacturing and environmental requirements.
Parametric Equivalents:
DF1508S-E3/45 and DFL1508S-E3/45 (Vishay General Semiconductor - Diodes Division) are parametric equivalents meeting all electrical and mechanical specifications. Both parts are active products with ROHS3 compliance. DFL1508S-E3/45 demonstrates higher inventory availability (10,554 pieces) and matches the original reverse leakage specification of 5 µA @ 800 V.
DBLS156G C1G and DBLS156GHC1G (Taiwan Semiconductor Corporation) are parametric equivalents from an alternative manufacturer. Both maintain full electrical and mechanical compatibility. DBLS156GHC1G carries AEC-Q101 automotive qualification, suitable for applications requiring automotive-grade components.
All substitute parts are active products with established supply chains and compliance certifications, eliminating obsolescence risk associated with the original DF1508SP-G.
Frequently Asked Questions (FAQ)
Q: Can DF1508S-G directly replace DF1508SP-G in existing designs?
A: Yes. DF1508S-G maintains identical electrical specifications (800 V, 1.5 A, 1.1 V forward voltage) and physical package (4-SMD, Gull Wing). The primary difference is product status (active versus obsolete) and compliance certifications (ROHS3). No circuit modifications are required.
Q: What is the difference between DF1508S-E3/45 and DFL1508S-E3/45?
A: Both parts are manufactured by Vishay and meet all electrical and mechanical requirements. The primary distinction is reverse leakage current: DF1508S-E3/45 specifies 10 µA @ 800 V, while DFL1508S-E3/45 specifies 5 µA @ 800 V, matching the original DF1508SP-G specification. DFL1508S-E3/45 also offers significantly higher inventory availability.
Q: Are Taiwan Semiconductor Corporation parts suitable for this application?
A: Yes. DBLS156G C1G and DBLS156GHC1G meet all electrical specifications and package requirements. Both are active products with ROHS3 compliance. DBLS156GHC1G includes AEC-Q101 automotive qualification for applications requiring automotive-grade components.
Q: What does ROHS3 compliance mean for this component?
A: ROHS3 compliance indicates the part meets Restriction of Hazardous Substances Directive requirements, restricting lead, cadmium, mercury, and other hazardous materials. All active substitute parts carry this certification, supporting environmental and regulatory compliance in modern manufacturing.
Q: Is packaging format identical across all substitutes?
A: Yes. All substitute parts use 4-SMD, Gull Wing surface mount packaging, maintaining mechanical and electrical compatibility with existing PCB designs and assembly processes.
Q: What is the significance of MSL 1 (Unlimited) rating?
A: MSL 1 indicates unlimited shelf life without moisture baking requirements, simplifying component storage and handling procedures compared to higher MSL ratings.
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