DB2J31700L Equivalent & Substitute Parts

Part Overview

The DB2J31700L is a Schottky diode manufactured by Panasonic Electronic Components, rated for 30 V DC reverse voltage and 1 A average rectified current in a surface mount SMini2-F5-B package. This component is discontinued at DiGi Electronics, necessitating identification of functionally equivalent alternatives from active manufacturers. Substitute parts must maintain electrical performance characteristics including forward voltage, reverse recovery time, and thermal ratings to ensure direct replacement capability in existing circuit designs.

Substiute Parts

DB2J31700L

Panasonic Electronic ComponentsIn Stock: 43950DB2J31700L Datasheet

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CUS10F30,H3F

Toshiba Semiconductor and StorageIn Stock: 171218CUS10F30,H3F Datasheet

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RB550VAM-30TR

Rohm SemiconductorIn Stock: 455302RB550VAM-30TR Datasheet

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SS1030HEWS_R1_00001

Panjit International Inc.In Stock: 16116SS1030HEWS_R1_00001 Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the DB2J31700L is determined by strict equivalence across the following electrical and mechanical parameters:

Primary Equivalence Criteria:

• Technology: Schottky diode
• Voltage - DC Reverse (Vr) (Max): 30 V
• Current - Average Rectified (Io): 1 A
• Voltage - Forward (Vf) (Max) @ If: 520 mV @ 1 A (or lower)
• Speed: Fast Recovery ≤ 500ns, > 200mA (Io)
• Mounting Type: Surface Mount
• RoHS Compliance: RoHS Compliant or ROHS3 Compliant
• Moisture Sensitivity Level (MSL): 1 (Unlimited)

All identified substitute parts meet these core electrical specifications. Package variations (SC-90/SOD-323F, SC-76/SOD-323, 2-SMD Flat Lead, SOD-323HE) are physically compatible with surface mount assembly processes. Operating temperature ratings of substitute parts equal or exceed the DB2J31700L maximum junction temperature of 125°C.

Parameter Comparison

Engineering Selection Recommendations

CUS10F30,H3F (Toshiba Semiconductor and Storage): Active product status with ROHS3 compliance and unlimited MSL rating. Forward voltage of 500 mV @ 1 A is 20 mV lower than the DB2J31700L, resulting in reduced power dissipation. Reverse leakage current of 50 µA @ 30 V is lower than the original part. Package SC-76/SOD-323 is compatible with surface mount assembly. Operating temperature maximum of 125°C matches the DB2J31700L specification.

RB550VAM-30TR (Rohm Semiconductor): Active product status with ROHS3 compliance and unlimited MSL rating. Forward voltage of 520 mV @ 1 A matches the DB2J31700L specification. Reverse leakage current of 30 µA @ 10 V is the lowest among all substitutes. Operating temperature maximum of 150°C exceeds the DB2J31700L by 25°C, providing thermal margin. Package TUMD2M (2-SMD Flat Lead) is compatible with surface mount assembly. Highest inventory availability at 455,200 pieces.

SS1030HEWS_R1_00001 (Panjit International Inc.): Active product status with ROHS3 compliance and unlimited MSL rating. Forward voltage of 520 mV @ 1 A matches the DB2J31700L specification. Reverse leakage current of 100 µA @ 30 V matches the original part. Operating temperature range of −40°C to 150°C provides extended low-temperature operation. Package SC-90/SOD-323F is identical to the DB2J31700L package designation, ensuring direct mechanical compatibility.

Frequently Asked Questions (FAQ)

Q: Can the CUS10F30,H3F replace the DB2J31700L in all applications?

A: The CUS10F30,H3F meets all primary electrical equivalence criteria. The 20 mV lower forward voltage reduces power dissipation, which is beneficial in most applications. Package compatibility with surface mount assembly is confirmed. Verify circuit design does not depend on the specific forward voltage characteristic of the original part.

Q: What is the primary difference between the RB550VAM-30TR and the DB2J31700L?

A: The RB550VAM-30TR provides identical electrical performance with forward voltage of 520 mV @ 1 A and fast recovery characteristics. The primary difference is the higher maximum operating temperature of 150°C versus 125°C for the DB2J31700L, and the package format (TUMD2M 2-SMD Flat Lead versus SMini2-F5-B). Both are surface mount compatible.

Q: Is the SS1030HEWS_R1_00001 a direct mechanical replacement?

A: The SS1030HEWS_R1_00001 uses the SC-90/SOD-323F package, which is identical to the DB2J31700L package designation. This ensures direct mechanical compatibility with existing PCB layouts and assembly processes. Electrical specifications match the original part.

Q: Do all substitute parts have the same moisture sensitivity level?

A: All substitute parts have MSL 1 (Unlimited) rating, identical to the DB2J31700L. This indicates no moisture sensitivity restrictions for storage, handling, or assembly processes.

Q: Which substitute part has the lowest reverse leakage current?

A: The RB550VAM-30TR has the lowest reverse leakage current at 30 µA @ 10 V. The CUS10F30,H3F has 50 µA @ 30 V, while both the DB2J31700L and SS1030HEWS_R1_00001 have 100 µA at their respective test voltages.

Q: Are all substitute parts RoHS compliant?

A: All substitute parts are RoHS compliant. The DB2J31700L carries RoHS Compliant status, while the three substitute parts carry ROHS3 Compliant status, which represents the current RoHS directive revision.

Q: What is the inventory status of each substitute part?

A: CUS10F30,H3F has 171,200 pieces in stock. RB550VAM-30TR has 455,200 pieces in stock (highest availability). SS1030HEWS_R1_00001 has 16,100 pieces in stock. All are available as new original stock.