DB101ST-HF Bridge Rectifier Equivalent & Substitute Parts

Part Overview

The DB101ST-HF is a single-phase bridge rectifier manufactured by Comchip Technology, rated for 50 V peak reverse voltage and 1 A average rectified current in a surface mount DBS package. This component is classified as obsolete, necessitating identification of active equivalent parts for ongoing production and maintenance applications. Substitute parts must maintain electrical and mechanical compatibility to ensure direct replacement capability without circuit redesign.

Substiute Parts

DB101ST-HF

Comchip TechnologyIn Stock: 892DB101ST-HF Datasheet

Current PartRFQ

DB101S-HF

Comchip TechnologyIn Stock: 1127DB101S-HF Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the DB101ST-HF is determined by the following critical parameters:

• Diode Type: Single Phase bridge rectifier configuration
• Voltage Rating: 50 V peak reverse voltage (Vrrm)
• Current Rating: 1 A average rectified current (Io)
• Forward Voltage: 1.1 V maximum at 1 A
• Reverse Leakage: 10 µA maximum at 50 V
• Temperature Range: -55°C to 150°C junction temperature
• Package: 4-SMD, Gull Wing surface mount configuration (DBS)

The primary substitute DB101S-HF meets all electrical specifications and maintains identical package geometry. Secondary substitutes (DB101S-G, DF005S-G, DF005S-E3/45) are listed as compatible alternatives within the Comchip Technology product family, subject to verification of identical parameter compliance.

Parameter Comparison

Engineering Selection Recommendations

The DB101S-HF is the manufacturer-recommended substitute for the obsolete DB101ST-HF. Both components are manufactured by Comchip Technology and share identical electrical specifications and package geometry. The DB101S-HF maintains active product status, ensuring availability for procurement and technical support.

Selection of DB101S-HF provides:

• Direct electrical compatibility across all rated parameters
• Identical surface mount package configuration (4-SMD, Gull Wing DBS)
• Consistent operating temperature range (-55°C to 150°C)
• Compliance with ECCN EAR99 and HTSUS 8541.10.0080 classifications
• Established supply chain availability (1037 pieces in stock)

Secondary substitutes (DB101S-G, DF005S-G, DF005S-E3/45) are listed as compatible alternatives within the manufacturer's product family. Confirmation of parameter equivalence is required prior to implementation in production environments.

Frequently Asked Questions (FAQ)

Q: Can DB101S-HF be used as a direct replacement for DB101ST-HF?

A: Yes. The DB101S-HF is the manufacturer-recommended substitute. Both components share identical electrical specifications (50 V, 1 A, 1.1 V forward voltage, 10 µA reverse leakage) and package configuration (4-SMD, Gull Wing DBS). The primary difference is product status: DB101ST-HF is obsolete while DB101S-HF is active.

Q: What are the critical parameters for bridge rectifier substitution?

A: Substitution eligibility requires matching of: peak reverse voltage (50 V), average rectified current (1 A), forward voltage (1.1 V @ 1 A), reverse leakage current (10 µA @ 50 V), operating temperature range (-55°C to 150°C), and package configuration (4-SMD, Gull Wing DBS).

Q: Are the secondary substitutes (DB101S-G, DF005S-G, DF005S-E3/45) equivalent to DB101ST-HF?

A: These components are listed as compatible alternatives within the Comchip Technology product family. Verification of identical electrical and mechanical parameter compliance is required before implementation.

Q: Does the package type affect substitution compatibility?

A: Yes. The DB101ST-HF uses a 4-SMD, Gull Wing DBS surface mount package. Substitute parts must use identical package geometry and pin configuration to ensure PCB compatibility without layout modification.

Q: What is the operating temperature range for these components?

A: Both DB101ST-HF and DB101S-HF operate across -55°C to 150°C junction temperature, suitable for industrial and automotive applications within this thermal envelope.