DAC8562FRUZ Equivalent & Substitute Parts

Part Overview

The DAC8562FRUZ is a 12-bit digital-to-analog converter manufactured by Analog Devices Inc., packaged in a 20-TSSOP surface mount configuration. This component features an internal voltage reference, parallel data interface, and buffered voltage output suitable for data acquisition applications. The part is currently classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and new design implementations.

Substiute Parts

DAC8562FRUZ
Analog Devices Inc.In Stock: 1020DAC8562FRUZ Datasheet
DAC8562FRUZ
Current Part
AD5512AACPZ-REEL7
Analog Devices Inc.In Stock: 1640AD5512AACPZ-REEL7 Datasheet
AD5512AACPZ-REEL7
Similar
AD5681RBCPZ-RL7
Analog Devices Inc.In Stock: 4976AD5681RBCPZ-RL7 Datasheet
AD5681RBCPZ-RL7
Similar
DAC8562FSZ
Analog Devices Inc.In Stock: 3328DAC8562FSZ Datasheet
DAC8562FSZ
Similar

Key Parameters

Parameter DAC8562FRUZ
Resolution (Bits) 12
Number of D/A Converters 1
Output Type Voltage - Buffered
Data Interface Parallel
Reference Type Internal
Voltage Supply (Analog) 5V
Voltage Supply (Digital) 5V
INL/DNL (LSB) ±0.75, ±0.75
Architecture R-2R
Settling Time 16µs (Typ)
Operating Temperature -40°C ~ 85°C
Package 20-TSSOP
Mounting Type Surface Mount

Substitute Part Grouping Explanation

Substitution for the DAC8562FRUZ is determined by the following critical parameters: 12-bit resolution, single D/A converter configuration, buffered voltage output, and R-2R architecture. The three identified substitute parts maintain these core functional characteristics while varying in data interface type, package configuration, and supply voltage flexibility.

DAC8562FSZ provides direct functional equivalence with identical electrical specifications and R-2R architecture, differing only in package format (20-SOIC versus 20-TSSOP). This substitute maintains parallel data interface, internal reference, and 5V supply requirements.

AD5512AACPZ-REEL7 and AD5681RBCPZ-RL7 represent architectural alternatives that preserve 12-bit resolution and buffered output but introduce design trade-offs in interface type, package size, and supply voltage range. These parts require evaluation against specific application requirements.

Parameter Comparison

Parameter DAC8562FRUZ DAC8562FSZ AD5512AACPZ-REEL7 AD5681RBCPZ-RL7
Resolution (Bits) 12 12 12 12
Number of D/A Converters 1 1 1 1
Output Type Voltage - Buffered Voltage - Buffered Voltage - Unbuffered Voltage - Buffered
Data Interface Parallel Parallel SPI, DSP SPI
Reference Type Internal Internal External External, Internal
Voltage Supply (Analog) 5V 5V 2.7V ~ 5.5V 2.7V ~ 5.5V
Voltage Supply (Digital) 5V 5V 2.7V ~ 5.5V 2.7V ~ 5.5V
INL/DNL (LSB) ±0.75, ±0.75 ±0.75, ±0.75 ±0.5, ±0.5 ±1 (Max), ±1 (Max)
Architecture R-2R R-2R R-2R String DAC
Settling Time 16µs (Typ) 16µs (Typ) 1µs (Typ) 7µs
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 125°C -40°C ~ 105°C
Package 20-TSSOP 20-SOIC 16-LFCSP (3x3) 8-LFCSP-UD (2x2)
Product Status Obsolete Active Active Active

Engineering Selection Recommendations

DAC8562FSZ is the primary substitute for direct replacement applications. This part maintains identical electrical performance, R-2R architecture, parallel interface, and 5V supply specifications. The only difference is package format (20-SOIC versus 20-TSSOP), which may require PCB layout modification but does not affect functional compatibility. This part is currently in active production status with RoHS3 compliance.

AD5681RBCPZ-RL7 is suitable for applications where reduced package footprint and extended supply voltage range (2.7V ~ 5.5V) are advantageous. This part operates as an active product in the nanoDAC+ series with RoHS3 compliance. The SPI interface requires firmware modification compared to the parallel interface of the original part. Settling time of 7µs is acceptable for most applications, though slower than the original 16µs specification.

AD5512AACPZ-REEL7 offers the fastest settling time (1µs) and widest operating temperature range (-40°C ~ 125°C) but features unbuffered output and external reference requirement. This part is suitable only for applications where these characteristics align with system design requirements. SPI/DSP interface necessitates control logic redesign.

Frequently Asked Questions (FAQ)

Q: Can DAC8562FSZ be used as a direct drop-in replacement for DAC8562FRUZ?

A: DAC8562FSZ maintains identical electrical specifications and functionality. The 20-SOIC package differs from the 20-TSSOP package, requiring PCB layout modification. No firmware or control logic changes are necessary.

Q: What are the key differences between the substitute parts?

A: DAC8562FSZ preserves the parallel interface and internal reference of the original part. AD5681RBCPZ-RL7 uses SPI interface with flexible internal/external reference and reduced package size. AD5512AACPZ-REEL7 requires external reference and SPI/DSP interface but provides fastest settling time.

Q: Which substitute part has the best compatibility with existing designs?

A: DAC8562FSZ offers the highest compatibility, requiring only PCB layout changes due to package format difference. All other electrical and functional parameters remain identical.

Q: Are all substitute parts RoHS compliant?

A: DAC8562FSZ, AD5512AACPZ-REEL7, and AD5681RBCPZ-RL7 are all RoHS3 compliant. The original DAC8562FRUZ compliance status is not specified in available documentation.

Q: What is the impact of changing from parallel to SPI interface?

A: Substitution with AD5681RBCPZ-RL7 or AD5512AACPZ-REEL7 requires firmware modification to implement SPI communication protocol. Hardware control lines must be redesigned accordingly.

Q: Can these parts operate at supply voltages other than 5V?

A: DAC8562FRUZ and DAC8562FSZ require fixed 5V supply. AD5681RBCPZ-RL7 and AD5512AACPZ-REEL7 support 2.7V ~ 5.5V supply range, enabling operation in lower-voltage systems.

Q: What are the package footprint implications?

A: DAC8562FSZ uses 20-SOIC (0.295" width). AD5512AACPZ-REEL7 uses 16-LFCSP (3x3). AD5681RBCPZ-RL7 uses 8-LFCSP-UD (2x2), the smallest footprint. Package selection depends on PCB space constraints and thermal management requirements.

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