D0840-42 Equivalent & Substitute Parts Reference

Part Overview

The D0840-42 is a 40-position DIP socket manufactured by Harwin Inc., designed for through-hole mounting applications requiring gold-plated mating contacts and wire wrap termination. This component features a 0.6" (15.24mm) row spacing configuration with beryllium copper mating contacts and brass wire wrap posts. The D0840-42 is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing design support and production continuity.

Substiute Parts

D0840-42

Harwin Inc.In Stock: 701D0840-42 Datasheet

Current PartRFQ

D0820-42

Harwin Inc.In Stock: 715D0820-42 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the D0840-42 is constrained by the following critical parameters that must remain consistent:

• Pitch - Mating (0.100" / 2.54mm): Determines compatibility with standard DIP integrated circuits
• Contact Finish - Mating (Gold): Required for reliable electrical contact and corrosion resistance
• Contact Material - Mating (Beryllium Copper): Ensures proper contact force and durability
• Mounting Type (Through Hole): Defines PCB assembly method
• Termination (Wire Wrap): Specifies post configuration and soldering approach
• Operating Temperature Range (-55°C ~ 125°C): Establishes thermal performance envelope
• Current Rating (1 A): Sets maximum current capacity per contact

The D0820-42 is identified as a substitute part within the same D0 series from Harwin Inc. However, this substitute differs in position count (20 vs. 40) and row spacing (0.3" vs. 0.6"), making it suitable only for applications where the lower pin count and reduced row spacing are compatible with the target DIP package footprint.

Parameter Comparison

Engineering Selection Recommendations

The D0840-42 is obsolete, necessitating alternative component identification for new production and ongoing support. The D0820-42 shares identical electrical and thermal specifications, including contact materials, finishes, current rating, and operating temperature range. Both components maintain ROHS3 compliance and UL94 V-0 flammability ratings.

The primary distinction between these components is positional capacity and row spacing. The D0820-42 accommodates 20 positions with 0.3" row spacing, compared to the D0840-42's 40 positions with 0.6" row spacing. Selection of the D0820-42 as a substitute is contingent upon the target application requiring a 20-position DIP socket with the corresponding reduced row spacing. Applications requiring the full 40-position configuration with 0.6" row spacing cannot use the D0820-42 without circuit redesign.

The D0820-42 maintains active product status, ensuring ongoing availability and supply chain continuity compared to the obsolete D0840-42.

Frequently Asked Questions (FAQ)

Q: Can the D0820-42 directly replace the D0840-42 in existing designs?

A: Direct replacement is not possible without circuit modification. The D0820-42 is a 20-position socket with 0.3" row spacing, while the D0840-42 is a 40-position socket with 0.6" row spacing. Substitution requires that the target DIP integrated circuit package matches the 20-position, 0.3" row spacing configuration.

Q: What electrical parameters remain identical between these components?

A: Both components share identical mating contact pitch (0.100" / 2.54mm), contact materials (beryllium copper for mating, brass for posts), contact finishes (gold for mating, tin for posts), operating temperature range (-55°C ~ 125°C), current rating (1 A per contact), and contact resistance (10mOhm).

Q: Are there compliance or regulatory differences between the D0840-42 and D0820-42?

A: Both components are ROHS3 compliant, UL94 V-0 rated, and classified as Moisture Sensitivity Level 1 (unlimited). Compliance profiles are equivalent.

Q: Why is the D0840-42 listed as obsolete?

A: The D0840-42 has reached end-of-life status with Harwin Inc. The D0820-42 remains in active production, providing a path for design continuity in applications compatible with the 20-position configuration.

Q: What is the significance of the 0.6" versus 0.3" row spacing difference?

A: Row spacing determines the physical footprint and compatibility with specific DIP package outlines. A 0.6" row spacing accommodates standard 40-pin DIP packages, while 0.3" row spacing is used for 20-pin DIP packages. These are not interchangeable without corresponding changes to the PCB layout and target integrated circuit selection.