CSD23203W P-Channel MOSFET Equivalent & Substitute Parts

Part Overview

The CSD23203W is an active P-Channel MOSFET manufactured by Texas Instruments, part of the NexFET™ series. This device is rated for 8V drain-to-source voltage with 3A continuous drain current and is housed in a 6-DSBGA surface mount package measuring 1x1.5mm. The component dissipates a maximum of 750mW and operates across the temperature range of -55°C to 150°C (junction temperature). The CSD23203W is ROHS3 compliant with MSL 1 (unlimited moisture sensitivity level) and REACH unaffected status, making it suitable for industrial and commercial applications requiring compact, high-efficiency switching solutions.

Identifying equivalent and substitute parts is necessary when the primary part number becomes unavailable, when supply chain optimization is required, or when design flexibility is needed while maintaining identical electrical and mechanical performance characteristics.

Substiute Parts

CSD23203W

Texas InstrumentsIn Stock: 20348CSD23203W Datasheet

Current PartRFQ

CSD23203WT

Texas InstrumentsIn Stock: 40184CSD23203WT Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the CSD23203W are determined by strict equivalence across all critical electrical and mechanical parameters. The substitution logic is based on the following criteria:

Electrical Parameters (Must Match Exactly):

• Drain to Source Voltage (Vdss): 8V
• Continuous Drain Current (Id) @ 25°C: 3A
• On-Resistance (Rds On Max): 19.4mOhm @ 1.5A, 4.5V
• Gate Threshold Voltage (Vgs(th) Max): 1.1V @ 250µA
• Gate Charge (Qg Max): 6.3nC @ 4.5V
• Input Capacitance (Ciss Max): 914pF @ 4V
• Maximum Gate Voltage (Vgs Max): -6V
• Power Dissipation (Max): 750mW

Mechanical Parameters (Must Match Exactly):

• Package Type: 6-DSBGA (1x1.5)
• Mounting Type: Surface Mount
• Supplier Device Package: 6-DSBGA (1x1.5)

Compliance & Status (Must Match):

• Manufacturer: Texas Instruments
• Series: NexFET™
• Product Status: Active
• RoHS Status: ROHS3 Compliant
• Moisture Sensitivity Level: 1 (Unlimited)
• REACH Status: REACH Unaffected

Parts meeting all these criteria are classified as parametric equivalents and direct substitutes.

Parameter Comparison

Engineering Selection Recommendations

The CSD23203WT is a direct parametric equivalent to the CSD23203W. Both devices are manufactured by Texas Instruments within the NexFET™ series and share identical electrical specifications, mechanical packaging, and compliance certifications.

Selection Basis:

Both parts maintain Active product status, ensuring long-term availability and manufacturer support. Both are ROHS3 compliant and REACH unaffected, meeting environmental and regulatory requirements for industrial and commercial applications. The MSL 1 (unlimited) rating for both parts indicates minimal moisture sensitivity, reducing handling and storage constraints.

The CSD23203WT may be selected as a substitute when the CSD23203W is unavailable or when supply chain optimization requires component sourcing from alternative inventory channels. Current inventory levels show CSD23203WT at 40,079 pieces compared to CSD23203W at 20,300 pieces, providing greater availability for high-volume production requirements.

No electrical performance degradation or functional compromise occurs when substituting CSD23203WT for CSD23203W in existing circuit designs. PCB layout, thermal management, and gate drive circuitry require no modification.

Frequently Asked Questions (FAQ)

Q: Can CSD23203WT be used as a direct replacement for CSD23203W in production designs?

A: Yes. The CSD23203WT is a parametric equivalent with identical electrical characteristics, package type, and compliance certifications. No circuit modifications are required.

Q: Are there differences in gate drive requirements between CSD23203W and CSD23203WT?

A: No. Both devices have identical gate threshold voltage (1.1V @ 250µA), gate charge (6.3nC @ 4.5V), and input capacitance (914pF @ 4V). Gate drive circuitry specifications remain unchanged.

Q: Do thermal management considerations differ between these parts?

A: No. Both devices have identical power dissipation ratings (750mW maximum) and operating temperature ranges (-55°C to 150°C junction temperature). PCB thermal design and heat dissipation strategies are interchangeable.

Q: What is the significance of the packaging designation 6-DSBGA (1x1.5)?

A: This indicates a 6-pin ultra-fine ball grid array package with 1mm x 1.5mm footprint dimensions. Both CSD23203W and CSD23203WT use this identical package, ensuring PCB footprint compatibility without layout modifications.

Q: Are moisture handling procedures identical for both parts?

A: Yes. Both parts carry MSL 1 (unlimited) rating, indicating they are not moisture sensitive. Standard handling procedures apply without special desiccant or baking requirements.

Q: Can these parts be mixed in the same production batch?

A: Yes. Electrical and mechanical equivalence permits interchangeable use within the same assembly process. No separate qualification or testing is required when substituting between these parts.

Q: What compliance certifications apply to both CSD23203W and CSD23203WT?

A: Both parts are ROHS3 compliant and REACH unaffected. ECCN classification is EAR99 for both devices. HTSUS code 8541.21.0095 applies to both parts.