CQ330H Hall Effect Current Sensor - Equivalent & Substitute Parts

Part Overview

The CQ330H is a coreless Hall Effect current sensor manufactured by Asahi Kasei Microdevices (AKM) designed for AC/DC current measurement applications. This sensor provides open-loop, bidirectional current sensing with a 42A measurement range and ratiometric voltage output. The CQ330H is classified as obsolete, making identification of suitable substitute components necessary for ongoing design support and production continuity.

Substiute Parts

CQ330H

Asahi Kasei Microdevices/AKMIn Stock: 1007CQ330H Datasheet

Current PartRFQ

CZ3704

Asahi Kasei Microdevices/AKMIn Stock: 3046CZ3704 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the CQ330H is based on the following critical parameters that define functional equivalence:

Primary Substitution Criteria:

• Sensor technology: Hall Effect, open-loop topology
• Measurement capability: AC/DC bidirectional current sensing
• Output interface: Ratiometric voltage output
• Supply voltage compatibility: 4.5V to 5.5V operation
• Single-channel configuration
• Surface mount packaging with compatible pinout
• RoHS3 compliance and equivalent regulatory certifications

The CZ3704 qualifies as a manufacturer-recommended substitute despite differences in current range, sensitivity, and package form factor, as it maintains the core functional architecture and supply voltage requirements necessary for system-level compatibility.

Parameter Comparison

Engineering Selection Recommendations

The CZ3704 is the manufacturer-recommended substitute for the obsolete CQ330H. Both components are manufactured by Asahi Kasei Microdevices and maintain ROHS3 compliance with identical moisture sensitivity classifications.

Design Considerations:

The CZ3704 provides higher current sensing capability (54A versus 42A) and improved linearity (±0.13% versus ±0.6%), making it suitable for applications requiring the CQ330H's performance envelope. The substitute operates across an extended temperature range (-40°C to 105°C versus -40°C to 90°C), providing broader environmental compatibility.

Package geometry differs between the two components: the CQ330H uses 24-LSSOP packaging while the CZ3704 employs 16-PowerSOIC packaging. This difference requires PCB layout modification and potential schematic adjustments to accommodate the different pin configuration and physical dimensions.

The CZ3704 exhibits higher supply current consumption (25mA maximum versus 11mA) and slightly longer response time (1µs versus 0.5µs). Sensitivity differs at 40mV/A compared to the original 50mV/A, necessitating signal conditioning circuit adjustments in applications with fixed gain amplification stages.

Frequently Asked Questions (FAQ)

Q: Can the CZ3704 directly replace the CQ330H without PCB modifications?

A: No. The CZ3704 uses a different package type (16-PowerSOIC versus 24-LSSOP) with different pinout and physical dimensions. PCB layout redesign is required.

Q: What are the key electrical differences between these sensors?

A: The CZ3704 provides higher current range (54A versus 42A), improved linearity (±0.13% versus ±0.6%), and extended operating temperature range (-40°C to 105°C versus -40°C to 90°C). Sensitivity is lower at 40mV/A compared to 50mV/A, and supply current is higher at 25mA maximum.

Q: Are both components RoHS compliant?

A: Yes. Both the CQ330H and CZ3704 are ROHS3 compliant with identical moisture sensitivity levels (2A, 4 weeks).

Q: Why is the CQ330H classified as obsolete?

A: The CQ330H has reached end-of-life status. Asahi Kasei Microdevices recommends the CZ3704 as the active replacement for new designs and production continuity.

Q: What supply voltage is required for both sensors?

A: Both sensors operate with supply voltage in the range of 4.5V to 5.5V, ensuring compatibility in this regard.

Q: How does the package difference affect circuit design?

A: The CZ3704's 16-PowerSOIC package is physically larger (0.303" width versus 0.220") and has a different lead configuration. Signal routing, thermal management, and board space allocation must be reassessed during redesign.