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CPF0201B158RE Equivalent & Substitute Parts
Part Overview
The CPF0201B158RE is a 158 Ohms ±0.1% thin film chip resistor manufactured by TE Connectivity Passive Product in the 0201 (0603 Metric) package format. This component is rated for 0.03W (1/32W) power dissipation with a temperature coefficient of ±25ppm/°C and operates across the temperature range of -55°C to 155°C. The part is currently in active production status and is RoHS3 compliant with MSL 1 (Unlimited) moisture sensitivity rating. Substitute parts are identified to provide alternative sourcing options when the primary part number becomes unavailable or when inventory requirements necessitate alternative procurement channels.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Resistance | 158 Ohms |
| Tolerance | ±0.1% |
| Power Rating | 0.03W (1/32W) |
| Composition | Thin Film |
| Temperature Coefficient | ±25ppm/°C |
| Operating Temperature Range | -55°C to 155°C |
| Package / Case | 0201 (0603 Metric) |
| Size / Dimension | 0.023" L x 0.011" W (0.58mm x 0.29mm) |
| Height - Seated (Max) | 0.011" (0.28mm) |
| Number of Terminations | 2 |
| RoHS Status | RoHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution eligibility for the CPF0201B158RE is determined by strict equivalence across all critical electrical and mechanical parameters. The substitute part CPF0201B158RE1 qualifies as a direct equivalent based on the following matching criteria:
Matching Parameters:
- Resistance value: 158 Ohms
- Tolerance: ±0.1%
- Power rating: 0.03W (1/32W)
- Composition: Thin Film
- Temperature coefficient: ±25ppm/°C
- Operating temperature range: -55°C to 155°C
- Package / Case: 0201 (0603 Metric)
- Physical dimensions: 0.023" L x 0.011" W (0.58mm x 0.29mm)
- Height - Seated (Max): 0.011" (0.28mm)
- Number of terminations: 2
- RoHS compliance: RoHS3 Compliant
- Moisture sensitivity level: 1 (Unlimited)
Both parts are manufactured by TE Connectivity Passive Product within the CPF series and maintain identical electrical performance specifications and mechanical form factors.
Parameter Comparison
| Parameter | CPF0201B158RE | CPF0201B158RE1 | Match Status |
|---|---|---|---|
| Manufacturer | TE Connectivity Passive Product | TE Connectivity Passive Product | Identical |
| Series | CPF | CPF | Identical |
| Resistance | 158 Ohms | 158 Ohms | Identical |
| Tolerance | ±0.1% | ±0.1% | Identical |
| Power (Watts) | 0.03W, 1/32W | 0.03W, 1/32W | Identical |
| Composition | Thin Film | Thin Film | Identical |
| Temperature Coefficient | ±25ppm/°C | ±25ppm/°C | Identical |
| Operating Temperature | -55°C ~ 155°C | -55°C ~ 155°C | Identical |
| Package / Case | 0201 (0603 Metric) | 0201 (0603 Metric) | Identical |
| Size / Dimension | 0.023" L x 0.011" W (0.58mm x 0.29mm) | 0.023" L x 0.011" W (0.58mm x 0.29mm) | Identical |
| Height - Seated (Max) | 0.011" (0.28mm) | 0.011" (0.28mm) | Identical |
| Number of Terminations | 2 | 2 | Identical |
| RoHS Status | RoHS3 Compliant | RoHS3 Compliant | Identical |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | Identical |
| Product Status | Active | Active | Identical |
| ECCN | EAR99 | EAR99 | Identical |
| HTSUS | 8533.21.0030 | 8533.21.0030 | Identical |
Engineering Selection Recommendations
The CPF0201B158RE1 is a direct functional and mechanical equivalent to the CPF0201B158RE. Both parts are manufactured by TE Connectivity Passive Product and maintain active production status. Selection between these parts is based on inventory availability and procurement requirements rather than technical performance differentiation.
Both parts satisfy RoHS3 compliance requirements and carry MSL 1 (Unlimited) moisture sensitivity ratings, indicating no special handling or storage constraints. The ECCN classification (EAR99) and HTSUS code (8533.21.0030) are identical for both parts, confirming equivalent regulatory and trade classification status.
Component selection should prioritize availability and lead time considerations. The CPF0201B158RE1 currently maintains higher inventory levels (2502 pieces) compared to the CPF0201B158RE (1021 pieces), which may influence procurement decisions for high-volume applications.
Frequently Asked Questions (FAQ)
Q: Can CPF0201B158RE1 be used as a direct replacement for CPF0201B158RE?
A: Yes. The CPF0201B158RE1 is a direct equivalent. All electrical parameters (resistance, tolerance, power rating, temperature coefficient, operating temperature range) and mechanical specifications (package, dimensions, terminations) are identical. Both parts are manufactured by TE Connectivity Passive Product within the CPF series.
Q: Are there any differences in compliance or regulatory status between these parts?
A: No. Both parts carry identical RoHS3 compliance status, MSL 1 (Unlimited) moisture sensitivity rating, EAR99 ECCN classification, and 8533.21.0030 HTSUS code. Regulatory and compliance requirements are equivalent.
Q: What is the significance of the different part number suffixes?
A: The part numbers CPF0201B158RE and CPF0201B158RE1 represent different manufacturing or distribution batches within the same product specification. The electrical and mechanical specifications remain identical. The suffix variation does not indicate functional differences.
Q: Are these parts suitable for high-precision applications?
A: Both parts feature ±0.1% tolerance and ±25ppm/°C temperature coefficient, making them suitable for precision applications requiring tight resistance tolerances and stable performance across the -55°C to 155°C operating range.
Q: What are the handling requirements for these components?
A: Both parts carry MSL 1 (Unlimited) moisture sensitivity rating, indicating no special moisture control or baking requirements during storage or handling. Standard component handling practices are sufficient.
Q: Can these parts be used interchangeably in PCB assembly?
A: Yes. The identical 0201 (0603 Metric) package format, physical dimensions (0.023" L x 0.011" W), and two-termination configuration ensure mechanical and electrical interchangeability in PCB assembly processes.
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