CMF55205R00FKBF Equivalent & Substitute Parts

Part Overview

The CMF55205R00FKBF is a 205 Ohm, 1/2W metal film through-hole resistor manufactured by Vishay Dale. This axial component features flame retardant coating and moisture resistance, designed for applications requiring precision resistive elements in through-hole configurations. The part maintains Active product status and is available in bulk packaging with 708 pieces in current inventory. Substitute parts are identified to address packaging availability, compliance requirements, and inventory optimization while maintaining electrical and mechanical compatibility.

Substiute Parts

CMF55205R00FKBF

Vishay DaleIn Stock: 773CMF55205R00FKBF Datasheet

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CMF55205R00FHEB

Vishay DaleIn Stock: 6895CMF55205R00FHEB Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the CMF55205R00FKBF is determined by the following critical parameters:

• Resistance Value: 205 Ohms (exact match required)
• Tolerance: ±1% (exact match required)
• Power Rating: 0.5W / 1/2W (exact match required)
• Composition: Metal Film (exact match required)
• Package Type: Axial (exact match required)
• Operating Temperature Range: -55°C to 175°C (exact match required)
• Physical Dimensions: 0.090" Dia x 0.240" L (exact match required)
• Terminations: 2 (exact match required)

The identified substitute part CMF55205R00FHEB meets all critical electrical and mechanical parameters. Differences exist only in packaging format (Cut Tape vs. Bulk), temperature coefficient specification, and regulatory compliance status, which do not affect functional interchangeability in circuit applications.

Parameter Comparison

Engineering Selection Recommendations

CMF55205R00FKBF is suitable for applications where bulk packaging is preferred and RoHS non-compliance is acceptable. Current inventory of 708 pieces supports moderate-volume production runs.

CMF55205R00FHEB is the preferred selection for designs requiring ROHS3 compliance and REACH unaffected status. The Cut Tape packaging format accommodates automated assembly processes. Superior inventory availability (6878 pieces) ensures supply continuity for extended production schedules. The improved temperature coefficient (±50ppm/°C vs. ±100ppm/°C) provides enhanced stability across the operating temperature range.

Both parts are electrically and mechanically identical in circuit function and board layout compatibility.

Frequently Asked Questions (FAQ)

Q: Can CMF55205R00FHEB replace CMF55205R00FKBF in existing designs?

A: Yes. Both parts are functionally equivalent. They share identical resistance, tolerance, power rating, composition, package type, physical dimensions, and operating temperature range. The substitute part is a direct replacement with no circuit modifications required.

Q: What is the difference between Bulk and Cut Tape packaging?

A: Bulk packaging supplies loose components suitable for manual assembly or small-scale production. Cut Tape packaging provides components on continuous tape, optimized for automated pick-and-place assembly equipment. Both formats contain the same component.

Q: Does the temperature coefficient difference affect circuit performance?

A: The temperature coefficient difference (±100ppm/°C vs. ±50ppm/°C) indicates the rate of resistance change across temperature extremes. CMF55205R00FHEB exhibits lower drift, providing improved stability. For most applications within the -55°C to 175°C range, both parts perform equivalently. Applications requiring maximum precision across extreme temperature variations benefit from the lower coefficient of the substitute part.

Q: Why is RoHS compliance important?

A: ROHS3 compliance indicates the part meets Restriction of Hazardous Substances regulations, restricting lead and other hazardous materials. CMF55205R00FHEB compliance supports regulatory requirements in markets where RoHS certification is mandatory.

Q: Are there any board layout or footprint differences?

A: No. Both parts share identical physical dimensions (0.090" Dia x 0.240" L) and axial package configuration. PCB footprints and assembly procedures are identical.