CMD95-21VGC/TR9 Equivalent & Substitute Parts Reference

Part Overview

The CMD95-21VGC/TR9 is a green LED indication component manufactured by Visual Communications Company (VCC) in a 2-SMD surface mount package with yoke bend lead configuration. This discrete LED operates at a forward voltage of 2.1V with a luminous intensity of 19.5mcd, featuring a clear round domed lens with 1.70mm diameter and 25° viewing angle. The component is classified as obsolete, necessitating identification of active equivalent and substitute parts for ongoing design requirements and procurement continuity.

Substiute Parts

CMD95-21VGC/TR9

Visual Communications Company - VCCIn Stock: 1197CMD95-21VGC/TR9 Datasheet

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HLMP-6505

Broadcom LimitedIn Stock: 960251HLMP-6505 Datasheet

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HLMP-6505-L0011

Broadcom LimitedIn Stock: 3623HLMP-6505-L0011 Datasheet

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HLMP-6505-L001L

Broadcom LimitedIn Stock: 911HLMP-6505-L001L Datasheet

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HLMP-6505-L0021

Broadcom LimitedIn Stock: 2483HLMP-6505-L0021 Datasheet

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HLMP-6505-L0031

Broadcom LimitedIn Stock: 1815HLMP-6505-L0031 Datasheet

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HLMP6505AGR

onsemiIn Stock: 980HLMP6505AGR Datasheet

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HLMP6505AYR

Everlight Electronics Co LtdIn Stock: 1168HLMP6505AYR Datasheet

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HLMP6505AZR

Everlight Electronics Co LtdIn Stock: 6309HLMP6505AZR Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the CMD95-21VGC/TR9 is determined by strict alignment of the following electrical and mechanical parameters:

Critical Matching Parameters:

• Color: Green
• Lens Transparency: Clear
• Voltage - Forward (Vf) Typical: 2.1V (±0.1V tolerance acceptable)
• Lens Style: Round with Domed Top
• Mounting Type: Surface Mount
• Package Configuration: 2-SMD format

Secondary Compatibility Parameters:

• Wavelength - Peak: 565nm to 570nm range
• Viewing Angle: 25° to 28° range
• Lens Size: 1.70mm to 1.91mm diameter range
• Height (Max): 2.44mm to 2.92mm range
• Millicandela Rating: Minimum 12mcd (higher ratings acceptable for direct replacement)

Substitute parts are grouped by lead configuration type: Yoke Bend (direct package match), Gull Wing (alternative SMD configuration), Z-Bend (alternative SMD configuration), and Axial Through-Hole (alternative mounting type). The HLMP-6505 series from Broadcom Limited represents the primary active equivalent family, with variants accommodating different lead geometries and packaging formats.

Parameter Comparison

Engineering Selection Recommendations

Primary Substitute - Yoke Bend Configuration (Direct Package Match):

HLMP-6505-L0021 from Broadcom Limited is the recommended direct substitute for CMD95-21VGC/TR9. This part maintains identical package geometry (2-SMD, Yoke Bend), surface mount mounting type, and forward voltage specification (2.1V). The component is in active production status with ROHS3 compliance, addressing the obsolescence and regulatory compliance limitations of the original part. The higher millicandela rating (40mcd versus 19.5mcd) provides improved luminous intensity while maintaining optical compatibility. Moisture sensitivity level is improved to 2A (4 Weeks) from the original MSL 3 rating.

Alternative Substitute - Yoke Bend Configuration (Active Status, Extended MSL):

HLMP6505AYR from Everlight Electronics Co Ltd provides an alternative yoke bend configuration with active product status and unlimited moisture sensitivity level (MSL 1). Forward voltage is specified at 2V (within acceptable tolerance of 2.1V). This part is suitable for applications requiring extended shelf life and reduced moisture handling constraints. Millicandela rating of 12mcd is lower than the original specification but remains within functional parameters for indication applications.

Alternative Substitute - Z-Bend Configuration (Lowest Profile):

HLMP-6505-L0031 from Broadcom Limited offers a Z-Bend surface mount configuration with the lowest maximum height (2.44mm versus 2.82mm original). This variant is applicable for space-constrained PCB layouts while maintaining 2.1V forward voltage and ROHS3 compliance. The bottom entry mounting characteristic accommodates specific board design requirements.

Alternative Substitute - Gull Wing Configuration (Alternative SMD Lead Style):

HLMP-6505-L0011 from Broadcom Limited provides gull wing lead geometry as an alternative surface mount option. This configuration maintains 2.1V forward voltage and ROHS3 compliance with active product status. Selection of this variant is appropriate when gull wing lead geometry is preferred for specific assembly equipment or design requirements.

Compliance Consideration:

All recommended Broadcom Limited and Everlight Electronics substitutes achieve ROHS3 compliance, addressing the non-compliant status of the obsolete CMD95-21VGC/TR9. This compliance upgrade is mandatory for new designs and procurement in regulated markets.

Frequently Asked Questions (FAQ)

Q: Can HLMP-6505-L0021 be used as a direct replacement for CMD95-21VGC/TR9 without PCB redesign?

A: Yes. HLMP-6505-L0021 maintains identical package configuration (2-SMD, Yoke Bend), surface mount mounting type, and forward voltage (2.1V). No PCB layout modifications are required. The component footprint and lead geometry are compatible with the original design.

Q: What is the significance of the higher millicandela rating in HLMP-6505-L0021 (40mcd versus 19.5mcd)?

A: The higher luminous intensity provides increased brightness for the same forward current. In indication applications, this allows either reduced current operation for equivalent brightness or improved visibility at the original current level. Circuit current limiting resistor values may require adjustment if brightness consistency is critical to the application.

Q: Are there differences in wavelength between the original part and substitutes?

A: The original CMD95-21VGC/TR9 specifies 570nm peak wavelength, while Broadcom HLMP-6505 series and Everlight substitutes specify 565nm peak wavelength. Both wavelengths fall within the green spectrum and are visually indistinguishable in indication applications. The 5nm difference does not affect functional compatibility.

Q: What is the impact of MSL rating differences between the original part (MSL 3) and substitutes (MSL 2A or MSL 1)?

A: Lower MSL ratings indicate improved moisture resistance and extended shelf life. MSL 2A (4 Weeks) and MSL 1 (Unlimited) provide superior moisture handling compared to MSL 3 (168 Hours). This is advantageous for supply chain logistics and inventory management. No negative impact on application performance results from improved MSL ratings.

Q: Can HLMP6505AYR be used in applications requiring ROHS3 compliance?

A: Yes. HLMP6505AYR from Everlight Electronics is ROHS3 compliant. This part addresses both the obsolescence of CMD95-21VGC/TR9 and regulatory compliance requirements. The forward voltage specification of 2V is within acceptable tolerance of the original 2.1V specification.

Q: What are the key differences between yoke bend, gull wing, and Z-bend lead configurations?

A: Yoke Bend (HLMP-6505-L0021) features symmetrical lead geometry suitable for standard SMD assembly. Gull Wing (HLMP-6505-L0011) provides angled leads for alternative assembly equipment compatibility. Z-Bend (HLMP-6505-L0031) offers the lowest profile (2.44mm) for space-constrained applications with bottom entry mounting. Selection depends on PCB design constraints and assembly equipment capabilities.

Q: Is the viewing angle difference (25° original versus 28° substitutes) significant for indication applications?

A: The 3° difference in viewing angle is negligible for standard indication applications. Both angles provide wide-angle visibility suitable for panel-mounted indicators. The difference becomes relevant only in applications requiring precise optical field control, which is uncommon for discrete LED indication components.

Q: Can through-hole variants like HLMP-6505-L001L be used as substitutes?

A: HLMP-6505-L001L is a through-hole axial component with right-angle bend configuration. This part is not suitable as a direct substitute for the surface mount CMD95-21VGC/TR9 without significant PCB redesign. Through-hole mounting requires different footprint patterns and assembly processes. This variant is applicable only when through-hole mounting is required by design specification.