CLLE1AX7S0G685M050AC Equivalent & Substitute Parts

Part Overview

The CLLE1AX7S0G685M050AC is a 6.8 µF ceramic capacitor manufactured by TDK Corporation, rated for 4V operation with X7S temperature coefficient characteristics. This component is designed for bypass and decoupling applications in surface mount configurations using the 0805 (2012 Metric) package format. The part is currently classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing production support and design continuity.

Substiute Parts

CLLE1AX7S0G685M050AC
TDK CorporationIn Stock: 1118CLLE1AX7S0G685M050AC Datasheet
CLLE1AX7S0G685M050AC
Current Part

Key Parameters

Parameter Value
Manufacturer Part Number CLLE1AX7S0G685M050AC
Manufacturer TDK Corporation
Capacitance 6.8 µF
Tolerance ±20%
Voltage - Rated 4V
Temperature Coefficient X7S
Operating Temperature Range -55°C ~ 125°C
Package / Case 0805 (2012 Metric)
Mounting Type Surface Mount, MLCC
Size / Dimension 0.079" L x 0.049" W (2.00mm x 1.25mm)
Thickness (Max) 0.022" (0.55mm)
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Product Status Obsolete
Applications Bypass, Decoupling

Substitute Part Grouping Explanation

Substitution of the CLLE1AX7S0G685M050AC is determined by the following critical parameters:

Mandatory Matching Criteria:

  • Capacitance value: 6.8 µF
  • Tolerance: ±20%
  • Package format: 0805 (2012 Metric)
  • Mounting type: Surface Mount, MLCC
  • Physical dimensions: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Moisture Sensitivity Level: 1 (Unlimited)

Allowable Variation Parameters:

  • Voltage rating: Substitute must equal or exceed 4V
  • Temperature coefficient: X5R or X7S acceptable for bypass/decoupling applications
  • Operating temperature range: Substitute must support minimum -55°C to 85°C
  • Thickness: Substitute thickness must not exceed 0.055" (1.40mm) for PCB assembly compatibility

The KEMET C0805C685M9PAC7800 meets all mandatory matching criteria and allowable variation parameters, qualifying as a direct functional substitute.

Parameter Comparison

Parameter CLLE1AX7S0G685M050AC (TDK) C0805C685M9PAC7800 (KEMET)
Capacitance 6.8 µF 6.8 µF
Tolerance ±20% ±20%
Voltage - Rated 4V 6.3V
Temperature Coefficient X7S X5R
Operating Temperature Range -55°C ~ 125°C -55°C ~ 85°C
Package / Case 0805 (2012 Metric) 0805 (2012 Metric)
Size / Dimension 0.079" L x 0.049" W (2.00mm x 1.25mm) 0.079" L x 0.049" W (2.00mm x 1.25mm)
Thickness (Max) 0.022" (0.55mm) 0.055" (1.40mm)
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)
Product Status Obsolete Active
RoHS Status Not specified ROHS3 Compliant

Engineering Selection Recommendations

The KEMET C0805C685M9PAC7800 is the qualified substitute for the obsolete TDK CLLE1AX7S0G685M050AC based on the following engineering criteria:

Electrical Compatibility: The substitute maintains identical capacitance (6.8 µF) and tolerance (±20%) specifications. The rated voltage of 6.3V exceeds the original 4V requirement, providing additional design margin. Both components are rated for bypass and decoupling applications.

Physical Compatibility: Both components utilize the 0805 (2012 Metric) package with identical footprint dimensions (0.079" L x 0.049" W). The substitute thickness of 0.055" (1.40mm) is within acceptable PCB assembly tolerances for standard reflow processes.

Regulatory Compliance: The KEMET substitute is ROHS3 compliant and carries REACH Unaffected status, matching the regulatory profile of the original component. Both components have MSL rating of 1 (Unlimited), indicating no moisture sensitivity constraints.

Product Availability: The substitute is classified as Active product status with confirmed inventory (960 Pcs), ensuring long-term supply continuity compared to the obsolete original part.

Frequently Asked Questions (FAQ)

Q: Can the KEMET C0805C685M9PAC7800 be used as a direct replacement in existing PCB designs?

A: Yes. The substitute maintains identical capacitance, tolerance, package dimensions, and footprint specifications. No PCB layout modifications are required for component substitution.

Q: What is the significance of the different temperature coefficients (X7S vs. X5R)?

A: Both X7S and X5R temperature coefficients are acceptable for bypass and decoupling applications. X7S provides a wider operating temperature range (-55°C to 125°C) compared to X5R (-55°C to 85°C). For applications operating within -55°C to 85°C, both coefficients deliver equivalent performance.

Q: Why is the substitute rated for 6.3V when the original is 4V?

A: Higher voltage ratings provide additional design margin and do not negatively impact circuit performance in 4V applications. The substitute can be used in any circuit designed for 4V operation without functional degradation.

Q: Are there any assembly process considerations when switching to the KEMET substitute?

A: The substitute has a maximum thickness of 0.055" (1.40mm) compared to the original 0.022" (0.55mm). Verify that PCB assembly equipment and reflow profiles accommodate this thickness variation. Standard SMT equipment typically handles this thickness range without modification.

Q: What is the MSL rating and why does it matter?

A: Both components have MSL 1 (Unlimited), indicating no moisture sensitivity. These components do not require special moisture control during storage, handling, or assembly, simplifying supply chain management.

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