CLC1001IST6X Equivalent & Substitute Parts

Part Overview

The CLC1001IST6X is a voltage feedback amplifier manufactured by MaxLinear, Inc., housed in a SOT-23-6 surface mount package. This single-circuit operational amplifier is designed for high-speed applications with a gain bandwidth product of 2.1 GHz and a slew rate of 410 V/µs. The device operates across a supply voltage range of 4 V to 12 V and is rated for temperatures from -40°C to 125°C.

The CLC1001IST6X has reached obsolete product status. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure supply chain reliability, and support ongoing production requirements for applications currently utilizing this component.

Substiute Parts

CLC1001IST6X

MaxLinear, Inc.In Stock: 20340CLC1001IST6X Datasheet

Current PartRFQ

OPA846IDBVT

Texas InstrumentsIn Stock: 1731OPA846IDBVT Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the CLC1001IST6X is evaluated based on the following critical parameters that define functional equivalence:

Functional Topology: Both the main part and substitute must be single-circuit voltage feedback amplifiers to maintain circuit behavior and design compatibility.

Frequency Performance: The gain bandwidth product and slew rate determine high-speed signal handling capability. Substitute parts must meet or exceed the specified performance envelope to ensure signal integrity in existing applications.

Electrical Characteristics: Input bias current, input offset voltage, supply current, and output current capability must fall within acceptable ranges to prevent circuit performance degradation.

Supply Voltage Compatibility: The operating supply voltage range must encompass the original specification to ensure operation across all intended power supply configurations.

Thermal Operating Range: The substitute must support the full temperature range or a compatible subset to maintain reliability in the target application environment.

Package and Mounting: Surface mount technology and pin-compatible or functionally equivalent packaging are required for direct board-level substitution.

The OPA846IDBVT from Texas Instruments qualifies as a substitute based on these criteria, with documented differences noted in the parameter comparison table below.

Parameter Comparison

Engineering Selection Recommendations

Product Status Consideration: The CLC1001IST6X is classified as obsolete, making long-term supply unavailable. The OPA846IDBVT maintains active product status with Texas Instruments, ensuring continued availability and manufacturing support.

Compliance and Certifications: Both parts carry EAR99 ECCN classification and HTSUS code 8542.33.0001. The OPA846IDBVT is RoHS3 compliant and REACH unaffected, meeting current regulatory requirements for electronic component procurement.

Electrical Performance Trade-offs: The OPA846IDBVT exhibits superior input bias current (10 µA versus 30 µA) and lower input offset voltage (150 µV versus 350 µV), resulting in improved precision characteristics. The substitute provides higher slew rate (625 V/µs versus 410 V/µs) but lower gain bandwidth product (1.75 GHz versus 2.1 GHz). Output current capability is reduced (80 mA versus 130 mA).

Supply Voltage Compatibility: The OPA846IDBVT minimum supply voltage is 5 V, compared to 4 V for the CLC1001IST6X. Applications operating at 4 V supply require verification of compatibility.

Temperature Range Limitation: The OPA846IDBVT upper operating temperature is 85°C, versus 125°C for the original part. Applications requiring operation above 85°C require alternative solutions.

Package Consideration: The OPA846IDBVT uses SOT-23-5 packaging versus SOT-23-6 for the original part. Pin count reduction from 6 to 5 pins requires circuit board redesign and layout modification.

Frequently Asked Questions (FAQ)

Q: Can the OPA846IDBVT directly replace the CLC1001IST6X without circuit board modification?

A: No. The OPA846IDBVT uses SOT-23-5 packaging with 5 pins, while the CLC1001IST6X uses SOT-23-6 packaging with 6 pins. Circuit board redesign is required to accommodate the different pin configuration and footprint.

Q: What is the impact of the reduced output current capability in the OPA846IDBVT?

A: The OPA846IDBVT provides 80 mA output current per channel compared to 130 mA in the CLC1001IST6X. Applications requiring output currents exceeding 80 mA must be re-evaluated or require additional output buffering stages.

Q: Is the OPA846IDBVT suitable for applications operating at 4 V supply voltage?

A: No. The OPA846IDBVT minimum supply voltage is 5 V. Applications requiring 4 V operation must use alternative components or modify power supply architecture to meet the 5 V minimum requirement.

Q: How does the lower gain bandwidth product of the OPA846IDBVT affect high-frequency performance?

A: The OPA846IDBVT gain bandwidth product is 1.75 GHz versus 2.1 GHz for the CLC1001IST6X. Applications operating near the upper frequency limits of the original part require verification that the reduced bandwidth remains acceptable for the intended signal bandwidth and gain configuration.

Q: What are the implications of the reduced maximum operating temperature?

A: The OPA846IDBVT is rated to 85°C maximum, compared to 125°C for the CLC1001IST6X. Applications requiring operation above 85°C ambient temperature or with internal power dissipation pushing junction temperature above 85°C require alternative component selection.

Q: Does the improved input offset voltage of the OPA846IDBVT provide design benefits?

A: Yes. The OPA846IDBVT input offset voltage is 150 µV compared to 350 µV for the original part, and input bias current is 10 µA versus 30 µA. These improvements reduce DC error and drift in precision analog circuits, potentially allowing relaxed external offset trimming requirements.

Q: What is the significance of the different moisture sensitivity levels?

A: The CLC1001IST6X has MSL 1 (unlimited shelf life), while the OPA846IDBVT has MSL 2 (1-year shelf life). The substitute requires more stringent moisture control during storage and handling to prevent moisture absorption that could cause solder joint failures during reflow.