CDV30FF103FO3 10000 pF Mica Capacitor 1 kV Radial Equivalent & Substitute Parts

Part Overview

The CDV30FF103FO3 is a 10000 pF mica capacitor manufactured by Cornell Dubilier Electronics (CDE) rated for 1 kV operation. This through-hole radial component is designed for general-purpose applications requiring high reliability and stable capacitance across the operating temperature range of -55°C to 125°C. The part is currently active in production with 752 units in stock. Identification of equivalent and substitute parts is necessary to ensure design flexibility, manage supply chain continuity, and address component availability across different procurement channels.

Substiute Parts

CDV30FF103FO3

Cornell Dubilier Electronics (CDE)In Stock: 854CDV30FF103FO3 Datasheet

Current PartRFQ

CDV30FF103FO3F

Cornell Dubilier Electronics (CDE)In Stock: 1109CDV30FF103FO3F Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the CDV30FF103FO3 is determined by strict equivalence across the following critical parameters:

• Capacitance Value: 10000 pF (exact match required)
• Tolerance: ±1% (exact match required)
• Voltage Rating: 1 kV (exact match required)
• Dielectric Material: Mica (exact match required)
• Mounting Configuration: Through-hole radial (exact match required)
• Lead Spacing: 0.437" / 11.10 mm (exact match required)
• Physical Envelope: 0.819" L x 0.421" W x 0.909" H max (exact match required)
• Operating Temperature Range: -55°C to 125°C (exact match required)

The substitute part CDV30FF103FO3F maintains identical electrical and mechanical specifications to the primary part, with the distinction residing in regulatory compliance status.

Parameter Comparison

Engineering Selection Recommendations

CDV30FF103FO3 is suitable for applications where RoHS non-compliance is acceptable and REACH-affected materials are permitted by design specifications or regulatory requirements.

CDV30FF103FO3F is the appropriate selection for designs requiring RoHS3 compliance and REACH-unaffected material composition. This variant maintains full electrical and mechanical compatibility while satisfying enhanced environmental and regulatory standards.

Both parts are active products from Cornell Dubilier Electronics with established supply availability. Selection between these two variants depends solely on the regulatory compliance requirements of the end application and target market.

Frequently Asked Questions (FAQ)

Q: Are CDV30FF103FO3 and CDV30FF103FO3F electrically interchangeable?

A: Yes. Both parts have identical capacitance (10000 pF), tolerance (±1%), voltage rating (1 kV), and operating temperature range (-55°C to 125°C). They are direct electrical equivalents.

Q: Can these parts be used interchangeably on the same PCB?

A: Yes. Both parts share identical physical dimensions (0.819" L x 0.421" W), lead spacing (0.437" / 11.10 mm), and maximum seated height (0.909" / 23.10 mm). They are mechanically compatible for through-hole radial mounting.

Q: What is the primary difference between these two part numbers?

A: The primary difference is regulatory compliance. CDV30FF103FO3F is RoHS3 compliant and REACH unaffected, while CDV30FF103FO3 is RoHS non-compliant and REACH affected. Electrical and mechanical specifications are identical.

Q: Which part should be selected for new designs?

A: Selection depends on the application's regulatory requirements. For designs targeting markets with RoHS3 and REACH compliance mandates, CDV30FF103FO3F is the appropriate choice. For applications without such requirements, either part is suitable based on availability and cost considerations.

Q: Are there any performance differences between these parts?

A: No. Both parts are manufactured by Cornell Dubilier Electronics within the CDV30 series and maintain identical electrical performance characteristics, temperature stability, and reliability specifications.

Q: What is the lead spacing tolerance for PCB design?

A: The lead spacing is 0.437" (11.10 mm). This dimension is identical for both part variants and should be used for PCB footprint design.