CDBU0230R-HF Equivalent & Substitute Parts

Part Overview

The CDBU0230R-HF is a Schottky rectifier diode manufactured by Comchip Technology, rated for 30V DC reverse voltage with 200mA average rectified current. This component is designed for surface mount applications in the 0603C/SOD-523F package format. The part maintains Active product status and is RoHS3 compliant with unlimited moisture sensitivity rating (MSL 1).

Equivalent and substitute parts are identified to support design flexibility, supply chain continuity, and manufacturing alternatives while maintaining electrical and mechanical compatibility within specified parameters.

Substiute Parts

CDBU0230R-HF
Comchip TechnologyIn Stock: 2739CDBU0230R-HF Datasheet
CDBU0230R-HF
Current Part
MCL103B-TR
Vishay General Semiconductor - Diodes DivisionIn Stock: 8801MCL103B-TR Datasheet
MCL103B-TR
Parametric Equivalent

Key Parameters

Parameter Value Unit
Technology Schottky
Voltage - DC Reverse (Vr) (Max) 30 V
Current - Average Rectified (Io) 200 mA
Voltage - Forward (Vf) (Max) @ If 600 mV @ 200 mA
Current - Reverse Leakage @ Vr 1 µA @ 10 V
Speed Classification Small Signal ≤ 200mA (Io), Any Speed
Mounting Type Surface Mount
Package / Case 2-SMD, No Lead
Operating Temperature - Junction (Max) 125 °C
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the CDBU0230R-HF is determined by strict equivalence across the following critical parameters:

Electrical Equivalence Criteria:

  • Voltage - DC Reverse (Vr) (Max): 30V minimum
  • Current - Average Rectified (Io): 200mA minimum
  • Voltage - Forward (Vf) (Max) @ If: 600mV @ 200mA maximum
  • Technology: Schottky diode classification

Mechanical Equivalence Criteria:

  • Mounting Type: Surface Mount
  • Package Classification: 2-SMD, No Lead (allows different physical package formats such as 0603C/SOD-523F and MicroMELF, provided pin configuration and footprint compatibility are maintained)

Compliance Criteria:

  • RoHS3 Compliant status
  • MSL 1 (Unlimited) rating
  • Active product status

The MCL103B-TR meets all electrical and compliance requirements and is classified as a parametric equivalent. Physical package differences (0603C/SOD-523F versus MicroMELF) require verification of PCB footprint compatibility during design integration.

Parameter Comparison

Parameter CDBU0230R-HF (Comchip) MCL103B-TR (Vishay) Match Status
Technology Schottky Schottky Equivalent
Voltage - DC Reverse (Vr) (Max) 30 V 30 V Equivalent
Current - Average Rectified (Io) 200 mA 200 mA Equivalent
Voltage - Forward (Vf) (Max) @ If 600 mV @ 200 mA 600 mV @ 200 mA Equivalent
Current - Reverse Leakage @ Vr 1 µA @ 10 V 5 µA @ 20 V Within Specification
Speed Classification Small Signal ≤ 200mA (Io), Any Speed Small Signal ≤ 200mA (Io), Any Speed Equivalent
Mounting Type Surface Mount Surface Mount Equivalent
Package / Case 2-SMD, No Lead 2-SMD, No Lead Equivalent Classification
Supplier Device Package 0603C/SOD-523F MicroMELF Different Physical Format
Operating Temperature - Junction (Max) 125°C 125°C Equivalent
RoHS Status ROHS3 Compliant ROHS3 Compliant Equivalent
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) Equivalent
Product Status Active Active Equivalent

Engineering Selection Recommendations

MCL103B-TR (Vishay General Semiconductor - Diodes Division) is a parametric equivalent to the CDBU0230R-HF. Both components satisfy identical electrical specifications for reverse voltage, rectified current, and forward voltage drop. Both maintain Active product status, RoHS3 compliance, and MSL 1 rating.

The MCL103B-TR carries AEC-Q101 automotive qualification, which provides additional quality assurance documentation. This qualification does not restrict use in non-automotive applications.

Critical Design Consideration: The MCL103B-TR is supplied in MicroMELF package format, while the CDBU0230R-HF uses 0603C/SOD-523F format. These represent different physical package geometries. PCB footprint compatibility must be verified before substitution. Footprint dimensions, lead spacing, and solder pad layout differ between these package types and require design review.

Both parts are RoHS3 compliant and carry unlimited moisture sensitivity rating, eliminating compliance barriers to substitution.

Frequently Asked Questions (FAQ)

Q: Can MCL103B-TR replace CDBU0230R-HF in all applications?

A: MCL103B-TR meets all electrical and compliance specifications of CDBU0230R-HF. However, the physical package format differs (MicroMELF versus 0603C/SOD-523F). PCB footprint compatibility must be confirmed. If the PCB is designed for 0603C/SOD-523F footprint, MCL103B-TR cannot be used without PCB redesign.

Q: What are the key electrical parameters that determine substitution?

A: Substitution is determined by: Voltage - DC Reverse (Vr) of 30V, Current - Average Rectified (Io) of 200mA, Voltage - Forward (Vf) of 600mV @ 200mA, and Schottky technology classification. Both parts match these specifications exactly.

Q: Does the difference in reverse leakage current affect substitution?

A: The CDBU0230R-HF specifies 1µA @ 10V; MCL103B-TR specifies 5µA @ 20V. Both values remain within acceptable Schottky diode performance ranges for this current and voltage class. The difference reflects measurement conditions rather than functional incompatibility.

Q: Are there compliance or certification differences?

A: Both parts are RoHS3 compliant with MSL 1 rating. MCL103B-TR carries AEC-Q101 automotive qualification. This additional qualification does not restrict use in non-automotive designs and does not create incompatibility.

Q: What must be verified before substitution?

A: PCB footprint compatibility is the primary design consideration. The 0603C/SOD-523F and MicroMELF packages have different physical dimensions and lead configurations. Verify that the PCB layout accommodates the MicroMELF package before implementing substitution.

Q: Are both parts currently available?

A: Both CDBU0230R-HF and MCL103B-TR maintain Active product status. Inventory availability should be confirmed with component suppliers for current project timelines.

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