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CDBM220-G Equivalent & Substitute Parts
Part Overview
The CDBM220-G is a Schottky diode manufactured by Comchip Technology, rated for 20 V DC reverse voltage and 2 A average rectified current in a Surface Mount Mini SMA/SOD-123 package. This part is classified as Obsolete, making identification of equivalent and substitute components essential for ongoing design support and procurement continuity. The fast recovery characteristic (≤500ns, >200mA) and low forward voltage drop (500 mV @ 2 A) define its primary application domain in rectification and switching circuits requiring efficient power conversion at moderate voltage levels.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - DC Reverse (Vr) (Max) | 20 | V |
| Current - Average Rectified (Io) | 2 | A |
| Voltage - Forward (Vf) (Max) @ If | 500 mV @ 2 A | mV |
| Speed | Fast Recovery ≤500ns, >200mA (Io) | ns |
| Current - Reverse Leakage @ Vr | 500 µA @ 20 V | µA |
| Capacitance @ Vr, F | 160pF @ 4V, 1MHz | pF |
| Package / Case | SOD-123T | - |
| Operating Temperature - Junction | -55°C ~ 125°C | °C |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | - |
| Technology | Schottky | - |
Substitute Part Grouping Explanation
Substitution of the CDBM220-G is determined by strict equivalence across the following critical parameters:
Primary Substitution Criteria:
- Voltage - DC Reverse (Vr) (Max): Must equal or exceed 20 V
- Current - Average Rectified (Io): Must equal or exceed 2 A
- Technology: Schottky diode
- Mounting Type: Surface Mount
- Speed: Fast Recovery ≤500ns, >200mA (Io)
Secondary Compatibility Factors:
- Forward voltage drop (Vf) at rated current
- Reverse leakage current characteristics
- Operating temperature range
- Package form factor and thermal characteristics
- Moisture sensitivity and compliance certifications
The substitute parts identified are grouped into two categories based on their relationship to the CDBM220-G specifications:
Category 1 - Direct Voltage Rating Match (20 V): SS22S-E3/61T maintains identical voltage and current ratings with equivalent fast recovery performance. Package form differs (DO-214AA/SMB vs. SOD-123T), requiring mechanical and thermal evaluation for specific applications.
Category 2 - Elevated Voltage Rating (40 V): CDBM240-HF provides higher reverse voltage capability (40 V) while maintaining 2 A current rating and identical forward voltage characteristics. This part is suitable for applications where voltage margin is beneficial and package compatibility is maintained.
Parameter Comparison
| Parameter | CDBM220-G | SS22S-E3/61T | CDBM240-HF |
|---|---|---|---|
| Manufacturer | Comchip Technology | Vishay General Semiconductor - Diodes Division | Comchip Technology |
| Voltage - DC Reverse (Vr) (Max) | 20 V | 20 V | 40 V |
| Current - Average Rectified (Io) | 2 A | 2 A | 2 A |
| Voltage - Forward (Vf) (Max) @ If | 500 mV @ 2 A | 550 mV @ 2 A | 500 mV @ 2 A |
| Speed | Fast Recovery ≤500ns, >200mA | Fast Recovery ≤500ns, >200mA | Fast Recovery ≤500ns, >200mA |
| Current - Reverse Leakage @ Vr | 500 µA @ 20 V | 200 µA @ 20 V | 500 µA @ 40 V |
| Capacitance @ Vr, F | 160pF @ 4V, 1MHz | Not specified | 160pF @ 4V, 1MHz |
| Package / Case | SOD-123T | DO-214AA (SMB) | SOD-123T |
| Operating Temperature - Junction | -55°C ~ 125°C | -55°C ~ 150°C | -55°C ~ 125°C |
| Product Status | Obsolete | Active | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
| RoHS Status | Not specified | ROHS3 Compliant | ROHS3 Compliant |
Engineering Selection Recommendations
For Direct Replacement (Same Voltage Rating):
SS22S-E3/61T is an active product from Vishay General Semiconductor - Diodes Division with identical 20 V / 2 A ratings and fast recovery characteristics. This part is ROHS3 compliant and REACH unaffected. The primary consideration is package form: DO-214AA (SMB) versus SOD-123T. The SMB package provides larger footprint and superior thermal dissipation compared to Mini SMA. Forward voltage is 50 mV higher (550 mV vs. 500 mV @ 2 A), which may impact efficiency in power-sensitive applications. Reverse leakage is lower (200 µA vs. 500 µA @ 20 V), providing improved performance in low-current standby conditions. Operating temperature range extends to 150°C, offering thermal margin advantage.
For Voltage-Rated Upgrade:
CDBM240-HF is an active Comchip Technology product with 40 V reverse voltage rating while maintaining 2 A current and 500 mV forward voltage characteristics. Package form (SOD-123T) is identical to the original CDBM220-G, enabling direct PCB footprint compatibility. ROHS3 compliance and REACH unaffected status align with modern regulatory requirements. The elevated voltage rating provides design margin for transient overvoltage conditions without performance degradation. This part is recommended when PCB layout constraints or thermal considerations favor the Mini SMA package form.
Compliance and Availability:
Both substitute parts carry MSL 1 (Unlimited) moisture sensitivity, matching the original part. ECCN and HTSUS classifications are identical across all three parts. Current inventory levels are substantial for both active substitutes (10,100 pcs for CDBM240-HF; 30,400 pcs for SS22S-E3/61T), supporting production continuity.
Frequently Asked Questions (FAQ)
Q: Can SS22S-E3/61T be used as a direct pin-for-pin replacement for CDBM220-G?
A: No. While electrical ratings are equivalent (20 V / 2 A), the package forms differ fundamentally. CDBM220-G uses SOD-123T (Mini SMA), while SS22S-E3/61T uses DO-214AA (SMB). SMB is a larger package with different lead geometry and spacing. PCB layout modification is required. Thermal characteristics also differ due to package size variation.
Q: What is the significance of the 50 mV forward voltage difference between SS22S-E3/61T (550 mV) and CDBM220-G (500 mV)?
A: At 2 A rated current, the 50 mV difference represents approximately 100 mW additional power dissipation in the diode. For applications with tight thermal budgets or high-frequency switching, this may require thermal analysis. For low-frequency rectification or applications with adequate thermal design margin, this difference is typically acceptable.
Q: Is CDBM240-HF suitable for circuits designed for 20 V operation?
A: Yes. CDBM240-HF is rated for 40 V maximum reverse voltage, which exceeds the 20 V requirement. The part will operate safely in 20 V circuits with improved voltage margin. No circuit modification is required. The 40 V rating provides protection against transient overvoltage events that may occur in switching power supplies or inductive load switching scenarios.
Q: What are the thermal implications of switching from SOD-123T to DO-214AA (SMB) package?
A: DO-214AA (SMB) package provides larger die area and superior thermal coupling to the PCB compared to SOD-123T (Mini SMA). For identical power dissipation, SMB package will operate at lower junction temperature. This is advantageous for high-current or high-frequency applications. However, SMB requires larger PCB footprint and may not fit space-constrained designs.
Q: Are both substitute parts suitable for high-temperature applications?
A: SS22S-E3/61T supports operating temperature to 150°C, providing 25°C additional margin compared to CDBM220-G (125°C). CDBM240-HF maintains the same 125°C maximum as the original part. For applications approaching 125°C junction temperature, SS22S-E3/61T offers thermal design advantage.
Q: What compliance certifications should be verified for procurement?
A: Both active substitute parts are ROHS3 compliant and REACH unaffected. Both carry MSL 1 (Unlimited) moisture sensitivity. ECCN and HTSUS classifications are identical to the original CDBM220-G. Verify specific customer or regional compliance requirements (automotive AEC-Q101, military MIL-PRF, etc.) if applicable to your application, as these are not specified in the provided data.
Q: Can CDBM240-HF and SS22S-E3/61T be used interchangeably in the same design?
A: No. These parts have different package forms (SOD-123T vs. DO-214AA), different manufacturers, and different thermal characteristics. Selection must be based on specific circuit requirements: use CDBM240-HF for footprint compatibility with original design; use SS22S-E3/61T only if PCB layout can accommodate SMB package and thermal performance is acceptable.
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