CDBD2050-HF Equivalent & Substitute Parts

Part Overview

The CDBD2050-HF is a Schottky diode array manufactured by Comchip Technology, configured as 1 pair common cathode with 50V reverse voltage rating and 20A average rectified current per diode. The device is packaged in TO-263-3 (D2PAK) surface mount configuration with fast recovery characteristics (≤500ns). This part is classified as obsolete, making identification of equivalent substitute components necessary for ongoing design support and procurement continuity.

Substiute Parts

CDBD2050-HF

Comchip TechnologyIn Stock: 1193CDBD2050-HF Datasheet

Current PartRFQ

MBRS2550CTHMNG

Taiwan Semiconductor CorporationIn Stock: 1027MBRS2550CTHMNG Datasheet

MFR RecommendedRFQ

SRS1650HMNG

Taiwan Semiconductor CorporationIn Stock: 868SRS1650HMNG Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the CDBD2050-HF must satisfy the following mandatory criteria:

Electrical Parameters (Required Match or Upgrade):

• Diode configuration: 1 pair common cathode
• Technology: Schottky
• Voltage - DC Reverse (Vr) (Max): ≥50V
• Current - Average Rectified (Io) (per Diode): ≥20A
• Speed: Fast recovery ≤500ns, >200mA (Io)
• Operating temperature range: -55°C to 150°C minimum

Mechanical Parameters (Required Match):

• Mounting type: Surface mount
• Package: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

Environmental Parameters (Required Match or Better):

• Moisture sensitivity level: MSL 1 or better

The substitute parts identified below meet or exceed all mandatory electrical and mechanical parameters while maintaining functional equivalence in circuit applications.

Parameter Comparison

Engineering Selection Recommendations

MBRS2550CTHMNG (Primary Substitute)

The MBRS2550CTHMNG is an active product from Taiwan Semiconductor Corporation that exceeds the electrical requirements of the CDBD2050-HF. It provides 25A current rating versus the original 20A specification, offering 25% additional current capacity within the same package footprint. This part carries automotive-grade qualification (AEC-Q101) and ROHS3 compliance, providing enhanced reliability documentation and regulatory alignment. The reverse leakage current is improved at 200µA compared to 500µA in the original part. All mechanical and thermal parameters are identical to the CDBD2050-HF.

SRS1650HMNG (Secondary Substitute)

The SRS1650HMNG is an active product from Taiwan Semiconductor Corporation suitable for applications where the 20A current requirement can be met with a 16A-rated device. This part provides superior forward voltage characteristics at 700mV @ 8A compared to the original 750mV @ 10A specification. Like the MBRS2550CTHMNG, it carries automotive-grade qualification (AEC-Q101) and ROHS3 compliance. The reverse leakage current matches the original specification at 500µA. This substitute is appropriate for designs with current margins or where lower forward voltage drop is beneficial.

Both substitute parts maintain identical package configuration, thermal operating range, and moisture sensitivity classification as the obsolete CDBD2050-HF, ensuring direct PCB compatibility without layout modifications.

Frequently Asked Questions (FAQ)

Q: Can MBRS2550CTHMNG be used as a direct replacement for CDBD2050-HF?

A: Yes. The MBRS2550CTHMNG meets all mandatory electrical and mechanical parameters. It provides equal or superior performance in all specified characteristics while maintaining identical package geometry (TO-263-3, D2PAK). The higher current rating (25A vs 20A) and improved reverse leakage (200µA vs 500µA) represent performance enhancements.

Q: What is the difference between MBRS2550CTHMNG and SRS1650HMNG?

A: Both are active Schottky diode arrays with 1 pair common cathode configuration in TO-263-3 packaging. The primary difference is current rating: MBRS2550CTHMNG provides 25A (exceeds original 20A requirement), while SRS1650HMNG provides 16A (below original requirement). Forward voltage characteristics differ: MBRS2550CTHMNG at 900mV @ 25A versus SRS1650HMNG at 700mV @ 8A. Selection depends on circuit current requirements and thermal considerations.

Q: Are there any package compatibility concerns with these substitutes?

A: No. All three parts use identical TO-263-3 (D2PAK) surface mount packaging with 2 leads plus tab configuration. PCB footprints, solder pad layouts, and thermal interface characteristics are equivalent. No design modifications are required for package substitution.

Q: What is the significance of AEC-Q101 qualification on the substitute parts?

A: AEC-Q101 is an automotive industry qualification standard for discrete semiconductors. Both substitute parts carry this qualification, indicating they have undergone rigorous reliability testing and quality assurance protocols. The original CDBD2050-HF does not specify this qualification. AEC-Q101 qualification provides enhanced traceability and reliability documentation suitable for automotive and high-reliability applications.

Q: Can SRS1650HMNG be used if the circuit requires 20A operation?

A: No. The SRS1650HMNG is rated for 16A average rectified current per diode, which is below the 20A requirement of the original CDBD2050-HF. Using this part in a 20A application would exceed its rated current capacity and compromise reliability. The MBRS2550CTHMNG is the appropriate choice for maintaining or exceeding the original 20A specification.

Q: What is the impact of forward voltage differences between these parts?

A: Forward voltage differences affect power dissipation and thermal performance. The MBRS2550CTHMNG exhibits 900mV @ 25A, while the original CDBD2050-HF is specified at 750mV @ 10A. These measurements are taken at different current levels, making direct comparison complex. The SRS1650HMNG at 700mV @ 8A shows lower forward voltage at its rated current. Circuit thermal analysis should account for these differences in high-current applications.

Q: Are moisture sensitivity levels equivalent across all three parts?

A: Yes. All three parts are classified as MSL 1 (Unlimited), indicating no moisture sensitivity restrictions. Storage, handling, and reflow soldering procedures are identical across all three components.