CD74HC4352E Equivalent & Substitute Parts

Part Overview

The CD74HC4352E is a 2-circuit IC switch with 4:1 multiplexer/demultiplexer functionality manufactured by Texas Instruments. This through-hole 20-DIP package device features 130Ohm on-state resistance and operates across a wide voltage range (2V–6V single supply or ±1V–5V dual supply). The part is designated as Last Time Buy, indicating end-of-life status. Finding equivalent substitute parts is necessary to ensure design continuity and maintain component availability for new production runs and system updates.

Substiute Parts

CD74HC4352E

Texas InstrumentsIn Stock: 1662CD74HC4352E Datasheet

Current PartRFQ

CD74HC4052M96

Texas InstrumentsIn Stock: 15457CD74HC4052M96 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the CD74HC4352E is based on functional equivalence across the following critical parameters:

• Switch Circuit Type & Configuration: Both main and substitute parts must be SP4T with 4:1 multiplexer/demultiplexer functionality and 2 circuits
• Electrical Performance: On-state resistance of 130Ohm and channel-to-channel matching of 5Ohm ensure signal integrity and crosstalk performance
• Voltage Compatibility: Supply voltage ranges (2V–6V single, ±1V–5V dual) must be maintained for circuit compatibility
• Operating Temperature Range: -55°C to 125°C specification must be met
• Leakage Current: Maximum 200nA leakage current specification must be maintained
• Compliance & Certifications: ROHS3 compliance and REACH unaffected status ensure regulatory alignment

The CD74HC4052M96 qualifies as a direct functional substitute based on these parameters. The primary difference is packaging format: the main part uses through-hole 20-DIP mounting, while the substitute uses surface-mount 16-SOIC. Both parts share identical functional specifications and electrical performance characteristics.

Parameter Comparison

Engineering Selection Recommendations

The CD74HC4052M96 is a functionally equivalent substitute for the CD74HC4352E based on identical electrical specifications and regulatory compliance. Both parts are ROHS3 compliant and REACH unaffected, ensuring regulatory alignment for new designs and production transitions.

The CD74HC4352E is designated Last Time Buy, making the CD74HC4052M96 the appropriate selection for ongoing production requirements. The substitute part is currently Active status with significantly higher inventory availability (15,425 pcs vs. 1,588 pcs).

The primary design consideration is packaging transition from through-hole 20-DIP to surface-mount 16-SOIC. This change requires PCB layout modification and assembly process adjustment but does not affect electrical performance or functional compatibility. The substitute part offers improved bandwidth performance (185MHz vs. 165MHz), providing additional margin for high-frequency signal applications.

Frequently Asked Questions (FAQ)

Q: Can the CD74HC4052M96 directly replace the CD74HC4352E in existing designs?

A: Electrical and functional replacement is direct. PCB layout and assembly process changes are required due to packaging differences (through-hole 20-DIP vs. surface-mount 16-SOIC). Pin-to-pin functional mapping is identical.

Q: What are the key differences between these parts?

A: The primary differences are mounting type and package format. The CD74HC4352E uses through-hole 20-DIP packaging, while the CD74HC4052M96 uses surface-mount 16-SOIC. Electrical specifications, including on-state resistance, voltage ranges, operating temperature, and leakage current, are identical. The substitute offers higher bandwidth (185MHz vs. 165MHz).

Q: Are both parts compliant with current regulatory requirements?

A: Both parts are ROHS3 compliant and REACH unaffected, meeting current regulatory standards for electronic component manufacturing and use.

Q: Why is the CD74HC4352E designated Last Time Buy?

A: Last Time Buy status indicates the manufacturer is discontinuing this product line. The CD74HC4052M96 represents the active product continuation with equivalent functionality in a modern surface-mount package format.

Q: What is the impact of the bandwidth difference (165MHz vs. 185MHz)?

A: The CD74HC4052M96 provides 20MHz additional bandwidth margin. For applications operating below 165MHz, this difference has no practical impact. For high-frequency signal routing applications, the substitute part offers improved performance headroom.

Q: How does the package size change affect circuit design?

A: The 16-SOIC package is significantly smaller than the 20-DIP package (0.154" vs. 0.300" width). This enables more compact PCB layouts and reduces board space requirements. Pin pitch and lead configuration differ, requiring PCB redesign and updated assembly specifications.