CD74HC174M96 Equivalent & Substitute Parts

Part Overview

The CD74HC174M96 is a 6-bit D-type flip-flop logic integrated circuit manufactured by Texas Instruments in a 16-SOIC surface mount package. This device functions as a master reset flip-flop with positive edge triggering, operating across a 2V to 6V supply voltage range. The part is currently in active production status with 5102 units in stock.

Substitute parts are necessary when the primary part becomes unavailable, when alternative packaging formats are required for manufacturing processes, or when design revisions call for components from different manufacturers while maintaining functional and electrical compatibility.

Substiute Parts

CD74HC174M96

Texas InstrumentsIn Stock: 5148CD74HC174M96 Datasheet

Current PartRFQ

MC74HC174ADR2G

onsemiIn Stock: 10317MC74HC174ADR2G Datasheet

DirectRFQ

74HC174D,653

NXP SemiconductorsIn Stock: 3507774HC174D,653 Datasheet

MFR RecommendedRFQ

MC74HC174ADG

onsemiIn Stock: 1164MC74HC174ADG Datasheet

MFR RecommendedRFQ

NLV74HC174ADR2G

onsemiIn Stock: 3410NLV74HC174ADR2G Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the CD74HC174M96 is determined by the following critical parameters:

Functional Compatibility Requirements:

• Base product number must be 74HC174
• Type must be D-Type flip-flop
• Number of elements must be 1
• Number of bits per element must be 6
• Output type must be Non-Inverted
• Trigger type must be Positive Edge

Electrical Compatibility Requirements:

• Voltage supply range must encompass 2V to 6V
• Operating temperature range must support -55°C to 125°C minimum
• Clock frequency must be 35 MHz or greater
• Current output specifications (5.2mA high and low) must be met
• Input capacitance must not exceed 10 pF

Physical Compatibility Requirements:

• Package must be 16-SOIC (0.154", 3.90mm Width)
• Mounting type must be Surface Mount

Compliance Requirements:

• RoHS3 compliance required
• Moisture Sensitivity Level 1 required

Substitute parts meeting all these criteria are functionally and electrically interchangeable with the CD74HC174M96 in circuit applications, with differences limited to packaging format (tape & reel versus cut tape) and minor performance variations within specification limits.

Parameter Comparison

Engineering Selection Recommendations

Primary Substitute - MC74HC174ADR2G (onsemi): This part is the recommended direct substitute for the CD74HC174M96. Both devices maintain active product status, full ROHS3 compliance, and identical functional specifications. The MC74HC174ADR2G offers improved propagation delay performance (19 ns versus 28 ns) and lower quiescent current (4 µA versus 8 µA), representing a performance enhancement. The primary difference is packaging format: tape & reel versus cut tape. This part is suitable for high-volume manufacturing processes requiring reel-based component feeding.

Secondary Substitute - 74HC174D,653 (NXP Semiconductors): This NXP part maintains functional compatibility and active product status with the highest available inventory (35059 units). It features superior clock frequency capability (107 MHz versus 35 MHz) and lower input capacitance (4.6 pF versus 10 pF). The operating temperature range is narrower (-40°C to 125°C versus -55°C to 125°C), which may limit use in extended low-temperature applications. Bulk packaging format is suitable for high-volume assembly operations. RoHS compliance status is not specified in available documentation.

Tertiary Substitutes - MC74HC174ADG and NLV74HC174ADR2G (onsemi): Both onsemi parts are marked as obsolete product status. MC74HC174ADG offers improved propagation delay (19 ns) and lower quiescent current (4 µA) but lacks specified packaging information. NLV74HC174ADR2G provides nearly equivalent performance to the primary substitute with 27 ns propagation delay and tape & reel packaging. Obsolete status indicates these parts may face future availability constraints and should be considered only when active alternatives are unavailable.

Selection Priority: For new designs and ongoing production, select MC74HC174ADR2G as the primary substitute. For applications requiring bulk packaging or maximum inventory availability, 74HC174D,653 is acceptable provided the narrower temperature range meets application requirements. Avoid MC74HC174ADG and NLV74HC174ADR2G due to obsolete status unless inventory constraints necessitate their use.

Frequently Asked Questions (FAQ)

Q: Can MC74HC174ADR2G be used as a direct replacement for CD74HC174M96 in existing designs?

A: Yes. Both parts share identical functional specifications, electrical characteristics, and package dimensions (16-SOIC). The primary difference is packaging format: MC74HC174ADR2G uses tape & reel format while CD74HC174M96 uses cut tape. Both are surface mount components with identical pin configurations and electrical performance within specification limits.

Q: What is the difference between cut tape and tape & reel packaging?

A: Cut tape packaging provides individual component strips suitable for manual handling and small-quantity assembly. Tape & reel packaging winds components on continuous reels for automated pick-and-place equipment in high-volume manufacturing. Both formats contain identical components; the difference is in delivery and handling method only.

Q: Why does 74HC174D,653 have a narrower operating temperature range (-40°C to 125°C versus -55°C to 125°C)?

A: Operating temperature range is determined by the manufacturer's characterization and qualification testing. The narrower range indicates NXP's tested performance envelope for this part. Applications requiring operation below -40°C must use parts with -55°C minimum ratings, such as CD74HC174M96 or MC74HC174ADR2G.

Q: Are obsolete parts like MC74HC174ADG still usable in new designs?

A: Obsolete parts carry risk of future unavailability. While MC74HC174ADG remains functionally compatible, manufacturers typically discontinue production and support for obsolete components. New designs should specify active-status parts such as MC74HC174ADR2G or 74HC174D,653 to ensure long-term supply chain reliability.

Q: What does ROHS3 compliance mean for this component?

A: ROHS3 compliance indicates the component meets Restriction of Hazardous Substances Directive requirements, restricting lead, cadmium, mercury, and other hazardous materials. All active substitute parts listed (CD74HC174M96, MC74HC174ADR2G, MC74HC174ADG, and NLV74HC174ADR2G) are ROHS3 compliant. The 74HC174D,653 compliance status is not specified in available documentation.

Q: Can I use 74HC174D,653 in applications requiring -55°C operation?

A: No. The 74HC174D,653 is specified only to -40°C minimum. Applications requiring -55°C operation must use CD74HC174M96, MC74HC174ADR2G, MC74HC174ADG, or NLV74HC174ADR2G, all of which support the full -55°C to 125°C range.

Q: What is Moisture Sensitivity Level (MSL) 1?

A: MSL 1 indicates unlimited shelf life without moisture control requirements. All listed parts carry MSL 1 rating, meaning they do not require special dry-pack storage or baking procedures before assembly, simplifying inventory management and reducing handling costs.

Q: Why does MC74HC174ADR2G show faster propagation delay (19 ns) than CD74HC174M96 (28 ns)?

A: Propagation delay variation within the same base product number (74HC174) reflects manufacturing process differences between Texas Instruments and onsemi. Both values meet the 74HC174 specification. The faster performance of MC74HC174ADR2G represents a performance advantage with no compatibility concerns.