CD74AC157E-NG Equivalent & Substitute Parts

Part Overview

The CD74AC157E-NG is a Data Selector/Multiplexer integrated circuit featuring a 4 x 2:1 configuration manufactured by Texas Instruments. This component is classified as obsolete, which necessitates identification of active equivalent parts for ongoing design requirements and production continuity. The CD74AC157E-NG operates as a single-supply logic device suitable for applications requiring multiplexing of four independent 2-to-1 data paths.

Substiute Parts

CD74AC157E-NG

Texas InstrumentsIn Stock: 1010CD74AC157E-NG Datasheet

Current PartRFQ

CD74AC157M96

Texas InstrumentsIn Stock: 2723CD74AC157M96 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the CD74AC157E-NG is determined by strict equivalence across the following critical parameters:

Functional Equivalence Criteria:

• Circuit configuration: 4 x 2:1 multiplexer topology
• Independent circuits: 1
• Output current capability: 24mA high and low
• Voltage supply source: Single supply operation
• Supply voltage range: 1.5V ~ 5.5V
• Operating temperature range: -55°C ~ 125°C
• Series family: 74AC logic family
• RoHS compliance: ROHS3 Compliant

The primary difference between the main part and its substitute lies in the mounting technology and packaging format. The CD74AC157E-NG utilizes through-hole mounting in a 16-DIP package, while the substitute employs surface-mount technology in a 16-SOIC package. Both variants maintain identical electrical specifications and functional performance, enabling direct functional substitution when PCB assembly methods are compatible.

Parameter Comparison

Engineering Selection Recommendations

The CD74AC157M96 serves as the active equivalent for the obsolete CD74AC157E-NG. Both components are manufactured by Texas Instruments within the 74AC logic family and maintain identical electrical specifications across all functional parameters. The CD74AC157M96 holds active product status, ensuring continued availability and manufacturing support.

Selection between these parts depends on PCB assembly methodology:

Through-Hole Assembly: The CD74AC157E-NG remains suitable for through-hole PCB designs. However, given its obsolete status, long-term availability cannot be assured.

Surface-Mount Assembly: The CD74AC157M96 is the appropriate selection for surface-mount PCB designs. This part is currently in active production with 2700 units in stock, providing supply continuity and manufacturing support.

Both parts comply with ROHS3 requirements and operate across the identical voltage and temperature ranges. The functional performance and electrical characteristics are equivalent, permitting direct substitution when the PCB assembly process accommodates the package format change.

Frequently Asked Questions (FAQ)

Q: Can the CD74AC157M96 directly replace the CD74AC157E-NG in existing designs?

A: Functional replacement is direct when PCB assembly methods are compatible. The CD74AC157M96 is a surface-mount component in a 16-SOIC package, while the CD74AC157E-NG is a through-hole component in a 16-DIP package. Electrical specifications and performance are identical. PCB layout and assembly process must accommodate the different package format.

Q: What are the key parameters that define substitution eligibility?

A: Substitution is determined by equivalence in circuit configuration (4 x 2:1), output current capability (24mA), supply voltage range (1.5V ~ 5.5V), operating temperature range (-55°C ~ 125°C), and series family (74AC). Both parts meet these criteria.

Q: Why is the CD74AC157E-NG listed as obsolete?

A: The CD74AC157E-NG has been discontinued by Texas Instruments. The CD74AC157M96 represents the active equivalent in the product line, ensuring ongoing availability and manufacturing support.

Q: Are there compliance differences between the two parts?

A: Both parts are ROHS3 compliant. The CD74AC157M96 carries an MSL rating of 1 (Unlimited), indicating minimal moisture sensitivity for surface-mount components. The CD74AC157E-NG lists MSL as Not Applicable, typical for through-hole components.

Q: What packaging format differences exist?

A: The CD74AC157E-NG is supplied in bulk packaging suitable for through-hole assembly. The CD74AC157M96 is supplied in Tape & Reel (TR) format, standard for automated surface-mount assembly processes.

Q: Are the pin configurations identical?

A: Both components are 16-pin packages with identical functional pin assignments within their respective package types (DIP and SOIC). Pin-to-pin functional correspondence is maintained.