CD4013BF3A Equivalent & Substitute Parts

Part Overview

The CD4013BF3A is a dual D-type flip-flop logic integrated circuit manufactured by Texas Instruments, part of the 4000B CMOS logic series. This device provides two independent D-type flip-flops with set and reset functions, complementary outputs, and positive edge triggering. The CD4013BF3A is currently in active production status and is widely used in digital logic applications requiring state storage and sequential control functions. Identifying equivalent substitute parts is necessary to ensure design flexibility, manage supply chain continuity, and accommodate different packaging or inventory requirements while maintaining electrical and functional compatibility.

Substiute Parts

CD4013BF3A

Texas InstrumentsIn Stock: 4831CD4013BF3A Datasheet

Current PartRFQ

CD4013BE

Texas InstrumentsIn Stock: 55394CD4013BE Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the CD4013BF3A are determined by strict equivalence in the following core electrical and functional parameters:

Mandatory Matching Criteria:

• Series designation (4000B CMOS logic family)
• Functional type (dual D-type flip-flop)
• Number of elements (2) and bits per element (1)
• Output configuration (complementary outputs)
• Trigger mechanism (positive edge triggered)
• Clock frequency capability (24 MHz)
• Propagation delay specification (90 ns @ 15V, 50pF)
• Supply voltage range (3V to 18V)
• Output current capability (6.8 mA high and low)
• Operating temperature range (-55°C to 125°C)
• Compliance certifications (ROHS3, EAR99)

Allowable Variation Parameters:

• Package type (CDIP vs. DIP)
• Quiescent current (within CMOS logic specifications)
• Mounting configuration (through-hole variants)
• Supplier packaging format (tube, reel, etc.)

The CD4013BE qualifies as a direct substitute based on identical electrical specifications and functional characteristics, with the primary difference being package configuration.

Parameter Comparison

Engineering Selection Recommendations

CD4013BE as Direct Substitute:

The CD4013BE is a valid direct substitute for the CD4013BF3A based on complete electrical and functional equivalence. Both devices are manufactured by Texas Instruments, belong to the active 4000B CMOS logic series, and maintain identical specifications for all critical parameters including clock frequency, propagation delay, supply voltage range, output current, and operating temperature range.

Compliance and Certification:

Both the CD4013BF3A and CD4013BE carry ROHS3 compliance certification and EAR99 export classification, ensuring regulatory compatibility in equivalent applications.

Package Consideration:

The primary distinction between these parts is packaging format. The CD4013BF3A uses 14-CDIP (ceramic dual in-line package) while the CD4013BE uses 14-DIP (plastic dual in-line package). Both maintain identical 0.300" (7.62mm) pitch and through-hole mounting configuration, making them mechanically compatible on standard PCB layouts designed for 14-pin DIP footprints.

Quiescent Current Difference:

The CD4013BE exhibits lower quiescent current (4 µA) compared to the CD4013BF3A (20 µA). This represents an improvement in power efficiency and does not create substitution barriers, as the lower current consumption is a beneficial characteristic in equivalent applications.

Selection Basis:

Choose the CD4013BE when plastic DIP packaging is acceptable and lower quiescent current is advantageous. Retain the CD4013BF3A when ceramic package construction is specifically required for environmental or reliability considerations.

Frequently Asked Questions (FAQ)

Q: Can the CD4013BE replace the CD4013BF3A in existing designs?

A: Yes. The CD4013BE is electrically and functionally equivalent to the CD4013BF3A. Both devices provide identical D-type flip-flop functionality, clock frequency, propagation delay, supply voltage range, and output current specifications. The primary difference is package material (plastic DIP versus ceramic CDIP), which does not affect electrical performance in standard through-hole PCB applications.

Q: What is the difference between 14-CDIP and 14-DIP packaging?

A: Both packages maintain identical pin pitch (0.300" / 7.62mm) and through-hole mounting configuration. The CDIP designation indicates ceramic dual in-line package construction, while DIP indicates plastic dual in-line package construction. From a PCB layout perspective, both packages are mechanically compatible with standard 14-pin DIP footprints. The choice between them depends on environmental requirements, cost considerations, and specific application reliability standards.

Q: Why does the CD4013BE have lower quiescent current than the CD4013BF3A?

A: The CD4013BE specifies 4 µA quiescent current while the CD4013BF3A specifies 20 µA. This difference reflects manufacturing process variations and characterization conditions within the CMOS logic family. The lower quiescent current in the CD4013BE represents improved power efficiency and does not indicate reduced functionality or compatibility. Both values remain within acceptable CMOS logic specifications.

Q: Are both parts currently available in production?

A: Yes. Both the CD4013BF3A and CD4013BE are listed as active products by Texas Instruments. The CD4013BE maintains significantly higher inventory availability (55,300 pieces) compared to the CD4013BF3A (4,809 pieces), making it a practical alternative when supply considerations are relevant.

Q: Do both parts meet the same compliance standards?

A: Yes. Both the CD4013BF3A and CD4013BE are ROHS3 compliant and carry EAR99 export classification. They are equivalent from a regulatory and compliance perspective.

Q: Can these parts be used interchangeably on the same PCB?

A: Yes, provided the PCB footprint accommodates both 14-pin DIP and 14-CDIP packages. Since both packages share identical pin pitch and through-hole mounting configuration, they are mechanically interchangeable on standard DIP footprints. Verify that the PCB design does not impose specific package material requirements before substitution.