CD214A-F1200 Equivalent & Substitute Parts

Part Overview

The CD214A-F1200 is a general-purpose rectifier diode manufactured by Bourns Inc., rated for 200 V DC reverse voltage and 1 A average rectified current in a DO-214AC (SMA) surface mount package. This part is classified as obsolete, necessitating identification of active equivalent alternatives for new designs and ongoing production requirements. Substitute parts must maintain electrical compatibility across voltage, current, and thermal specifications while accommodating available packaging options.

Key Parameters

Parameter	Value	Unit
Voltage - DC Reverse (Vr) (Max)	200	V
Current - Average Rectified (Io)	1	A
Voltage - Forward (Vf) (Max) @ If	950 mV @ 1 A	mV
Speed Classification	Fast Recovery ≤ 500ns, > 200mA (Io)	—
Reverse Recovery Time (trr)	25	ns
Current - Reverse Leakage @ Vr	5	µA @ 200 V
Mounting Type	Surface Mount	—
Package / Case	DO-214AC, SMA	—
Operating Temperature - Junction	-55°C ~ 150°C	°C
RoHS Status	ROHS3 Compliant	—

Substitute Part Grouping Explanation

Substitute parts are grouped based on strict electrical and mechanical compatibility criteria. All candidates must satisfy the following core requirements:

Mandatory Electrical Parameters:

Voltage - DC Reverse (Vr) (Max): 200 V minimum
Current - Average Rectified (Io): 1 A minimum
Forward voltage (Vf) within acceptable operating range
Speed classification: Fast Recovery (≤ 500ns) or Standard Recovery (> 500ns)

Mandatory Mechanical Parameters:

Mounting Type: Surface Mount
Package compatibility: DO-214AC (SMA), DO-214BA (GF1), or 2-SMD configurations
Thermal operating range: Must encompass or exceed -55°C to 150°C minimum

Compliance Requirements:

RoHS3 Compliant status preferred for new designs
REACH compliance status documented

Substitutes are divided into two categories:

Category A - Direct Package Equivalents (DO-214AC/SMA): Parts maintaining identical or pin-compatible packaging with the CD214A-F1200, enabling direct board-level replacement without layout modification.

Category B - Alternative Package Equivalents (DO-214BA/GF1 or 2-SMD): Parts with different surface mount packages that require PCB footprint verification but offer electrical equivalence.

Parameter Comparison

Part Number	Manufacturer	Vr (Max) [V]	Io [A]	Vf (Max) @ 1A [mV]	Speed	trr [ns]	Ir @ Vr [µA]	Package	Tj Range [°C]	Product Status	RoHS
CD214A-F1200	Bourns Inc.	200	1	950	Fast Recovery ≤ 500ns	25	5 @ 200V	DO-214AC (SMA)	-55 ~ 150	Obsolete	ROHS3
CD214A-FS1D	Bourns Inc.	200	1	950	Fast Recovery ≤ 500ns	35	5 @ 200V	2-SMD, No Lead	-65 ~ 175	Active	ROHS3
EGF1D	onsemi	200	1	1000	Fast Recovery ≤ 500ns	50	10 @ 200V	DO-214AC (SMA)	-65 ~ 175	Not For New Designs	ROHS3
EGF1D-E3/5CA	Vishay General Semiconductor - Diodes Division	200	1	1000	Fast Recovery ≤ 500ns	50	5 @ 200V	DO-214BA (GF1)	-65 ~ 175	Active	ROHS3
ES1D-M3/61T	Vishay General Semiconductor - Diodes Division	200	1	920	Fast Recovery ≤ 500ns	25	5 @ 200V	DO-214AC (SMA)	-55 ~ 150	Active	ROHS3
ESH1D-E3/61T	Vishay General Semiconductor - Diodes Division	200	1	900	Fast Recovery ≤ 500ns	25	1 @ 200V	DO-214AC (SMA)	-55 ~ 175	Active	ROHS3
GF1D	Fairchild Semiconductor	200	1	1000	Standard Recovery > 500ns	2000	5 @ 200V	DO-214AC (SMA)	-65 ~ 175	Active	Not Specified
GF1D-E3/67A	Vishay General Semiconductor - Diodes Division	200	1	1100	Standard Recovery > 500ns	2000	5 @ 200V	DO-214BA (GF1)	-65 ~ 175	Active	ROHS3
GF1D/1754	Vishay General Semiconductor - Diodes Division	200	1	1100	Standard Recovery > 500ns	2000	5 @ 200V	DO-214BA (GF1)	-65 ~ 175	Active	RoHS Non-Compliant
STTH102A	STMicroelectronics	200	1	970	Fast Recovery ≤ 500ns	20	1 @ 200V	DO-214AC (SMA)	-55 ~ 175	Active	ROHS3
STTH102AY	STMicroelectronics	200	1	970	Fast Recovery ≤ 500ns	20	1 @ 200V	DO-214AC (SMA)	-40 ~ 175	Active	ROHS3

Engineering Selection Recommendations

For Direct Replacement (DO-214AC/SMA Package):

ES1D-M3/61T and ESH1D-E3/61T are the primary candidates for direct substitution. Both are manufactured by Vishay General Semiconductor - Diodes Division, maintain DO-214AC (SMA) packaging, and are classified as Active products. ES1D-M3/61T provides forward voltage (920 mV @ 1 A) and reverse recovery time (25 ns) closely aligned with the CD214A-F1200 specification. ESH1D-E3/61T offers superior reverse leakage characteristics (1 µA @ 200 V versus 5 µA) and extended upper temperature rating (-55°C ~ 175°C). Both parts are ROHS3 Compliant.

STTH102A and STTH102AY, manufactured by STMicroelectronics, provide fast recovery characteristics (20 ns trr) with low reverse leakage (1 µA @ 200 V). STTH102AY includes automotive-grade qualification and extended lower temperature rating (-40°C ~ 175°C). Both maintain DO-214AC (SMA) packaging and Active product status with ROHS3 compliance.

For Alternative Package Configurations:

CD214A-FS1D, manufactured by Bourns Inc., offers a 2-SMD package configuration with Active product status and ROHS3 compliance. This part maintains electrical equivalence but requires PCB footprint verification prior to implementation.

EGF1D-E3/5CA, manufactured by Vishay General Semiconductor - Diodes Division, provides DO-214BA (GF1) package compatibility with Active product status and ROHS3 compliance. This part is suitable for applications where package footprint flexibility exists.

Parts Not Recommended for New Designs:

EGF1D is classified as "Not For New Designs" and should not be selected for new product development despite electrical compatibility.

GF1D/1754 is RoHS non-compliant and unsuitable for applications requiring regulatory compliance.

GF1D (Fairchild Semiconductor) exhibits standard recovery characteristics (2 µs trr) significantly slower than the CD214A-F1200 fast recovery specification and is not recommended for applications requiring fast switching performance.

Frequently Asked Questions (FAQ)

Q: Can ES1D-M3/61T directly replace CD214A-F1200 on the PCB?

A: Yes. ES1D-M3/61T maintains identical DO-214AC (SMA) packaging and surface mount configuration. No PCB layout modification is required. Electrical parameters are within acceptable tolerance ranges for the CD214A-F1200 application.

Q: What is the primary difference between fast recovery and standard recovery diodes in this comparison?

A: Fast recovery diodes (trr ≤ 500 ns) exhibit shorter reverse recovery time, enabling higher switching frequencies with reduced switching losses. Standard recovery diodes (trr > 500 ns) are suitable for lower frequency applications. The CD214A-F1200 specifies fast recovery characteristics. Substitutes maintaining fast recovery classification (ES1D-M3/61T, ESH1D-E3/61T, STTH102A, STTH102AY) preserve this performance characteristic. GF1D and GF1D-E3/67A employ standard recovery technology and are not suitable for applications requiring fast switching performance.

Q: Why do some substitute parts have different forward voltage specifications?

A: Forward voltage variation reflects manufacturing process differences across semiconductor manufacturers. The CD214A-F1200 specifies 950 mV @ 1 A. Substitute parts range from 900 mV to 1100 mV @ 1 A. These variations remain within acceptable operating margins for general-purpose rectifier applications. Circuit designers must verify forward voltage impact on specific application requirements, particularly in low-voltage or high-efficiency designs.

Q: Is STTH102AY suitable for automotive applications?

A: STTH102AY is designated with automotive-grade qualification and maintains Active product status with ROHS3 compliance. This part is suitable for automotive applications requiring temperature-rated components. Standard STTH102A lacks automotive designation and is classified for general industrial use.

Q: What does RoHS3 compliance indicate?

A: ROHS3 Compliant status indicates conformance to Restriction of Hazardous Substances Directive 3, restricting specified hazardous materials in electrical and electronic equipment. This certification is mandatory for products sold in European Union markets and is increasingly required globally. All recommended substitute parts maintain ROHS3 compliance except GF1D/1754, which is RoHS non-compliant.

Q: Can CD214A-FS1D be used as a substitute despite different packaging?

A: CD214A-FS1D employs 2-SMD packaging versus the CD214A-F1200 DO-214AC configuration. Direct PCB substitution is not possible without footprint redesign. However, electrical specifications are equivalent. This part is suitable only for new PCB designs accommodating 2-SMD footprints.

Q: Why is EGF1D marked "Not For New Designs"?

A: EGF1D is classified as "Not For New Designs" by onsemi, indicating the manufacturer recommends against selecting this part for new product development. This classification typically reflects product lifecycle management decisions. Active alternatives with superior or equivalent specifications are available.

Q: What is the significance of reverse leakage current variation among substitutes?

A: Reverse leakage current (Ir) represents diode leakage in reverse bias condition. The CD214A-F1200 specifies 5 µA @ 200 V. Substitutes range from 1 µA to 10 µA @ 200 V. Lower reverse leakage (1 µA) provides superior performance in high-impedance circuits and reduces standby power consumption. Higher leakage (10 µA) remains acceptable for general-purpose rectification but may impact low-power applications.

Q: Are all substitute parts available in equivalent packaging options?

A: No. Substitute parts are available in three primary package configurations: DO-214AC (SMA), DO-214BA (GF1), and 2-SMD. Direct replacement requires DO-214AC (SMA) packaging. Alternative packages require PCB footprint verification and redesign. Consult component datasheets for specific package dimensions and pin configurations prior to PCB layout implementation.

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