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CBR08C309C5GAC Equivalent & Substitute Parts
Part Overview
The CBR08C309C5GAC is a 3 pF ceramic capacitor manufactured by KEMET, designed for RF and microwave applications requiring high-frequency performance. This surface-mount multilayer ceramic capacitor (MLCC) operates across a temperature range of -55°C to 125°C and is specified for 50V rated voltage with C0G/NP0 temperature coefficient characteristics. The part is currently active in production with 1098 units in stock. Equivalent and substitute parts are identified to support design flexibility, inventory management, and application-specific voltage or tolerance requirements.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Capacitance | 3 pF |
| Tolerance | ±0.25pF |
| Voltage - Rated | 50V |
| Temperature Coefficient | C0G, NP0 |
| Operating Temperature Range | -55°C ~ 125°C |
| Package / Case | 0805 (2012 Metric) |
| Mounting Type | Surface Mount, MLCC |
| Series | CBR-SMD RF C0G |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution of the CBR08C309C5GAC is determined by strict equivalence in the following parameters: capacitance value (3 pF), package type (0805/2012 Metric), mounting technology (Surface Mount MLCC), temperature coefficient (C0G/NP0), and operating temperature range (-55°C ~ 125°C). Substitute parts must maintain these core electrical and mechanical specifications.
Two substitute parts are identified within the KEMET CBR-SMD RF C0G series:
CBR08C309B5GAC: Maintains identical capacitance, voltage rating (50V), package, and temperature range. Tolerance is tightened to ±0.1pF compared to the main part's ±0.25pF specification.
CBR08C309BAGAC: Maintains identical capacitance, tolerance (±0.1pF), package, and temperature range. Voltage rating is increased to 250V compared to the main part's 50V specification.
All substitute parts share the same base product number (CBR08C), series designation, RoHS3 compliance, and MSL rating, confirming compatibility within the product family.
Parameter Comparison
| Parameter | CBR08C309C5GAC (Main) | CBR08C309B5GAC (Substitute) | CBR08C309BAGAC (Substitute) |
|---|---|---|---|
| Manufacturer | KEMET | KEMET | KEMET |
| Capacitance | 3 pF | 3 pF | 3 pF |
| Tolerance | ±0.25pF | ±0.1pF | ±0.1pF |
| Voltage - Rated | 50V | 50V | 250V |
| Temperature Coefficient | C0G, NP0 | C0G, NP0 | C0G, NP0 |
| Operating Temperature | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C |
| Package / Case | 0805 (2012 Metric) | 0805 (2012 Metric) | 0805 (2012 Metric) |
| Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) | 0.079" L x 0.049" W (2.00mm x 1.25mm) | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| Thickness (Max) | 0.037" (0.95mm) | 0.037" (0.95mm) | 0.037" (0.95mm) |
| Mounting Type | Surface Mount, MLCC | Surface Mount, MLCC | Surface Mount, MLCC |
| Series | CBR-SMD RF C0G | CBR-SMD RF C0G | CBR-SMD RF C0G |
| Product Status | Active | Active | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
| REACH Status | REACH Unaffected | REACH Unaffected | REACH Unaffected |
Engineering Selection Recommendations
All three parts—CBR08C309C5GAC, CBR08C309B5GAC, and CBR08C309BAGAC—are active products manufactured by KEMET and carry ROHS3 compliance and REACH Unaffected status, confirming regulatory alignment for current production use.
CBR08C309B5GAC is a direct substitute when tighter capacitance tolerance (±0.1pF versus ±0.25pF) is required within the same 50V voltage specification. This part is suitable for applications where improved tolerance performance enhances circuit stability without modifying voltage requirements.
CBR08C309BAGAC is a substitute when elevated voltage rating (250V versus 50V) is required while maintaining the 3 pF capacitance value and improved ±0.1pF tolerance. This part is suitable for applications operating at higher voltage levels or requiring voltage margin in the circuit design.
All substitute parts maintain identical package geometry (0805/2012 Metric), thermal operating range (-55°C ~ 125°C), and surface-mount assembly compatibility, ensuring mechanical and thermal interchangeability on PCB layouts designed for the main part.
Frequently Asked Questions (FAQ)
Q: Can CBR08C309B5GAC replace CBR08C309C5GAC in all applications?
A: CBR08C309B5GAC is electrically compatible as a direct substitute. Both parts share identical capacitance (3 pF), voltage rating (50V), package (0805), and temperature coefficient (C0G/NP0). The primary difference is improved tolerance (±0.1pF versus ±0.25pF), which enhances capacitance accuracy. No circuit redesign is required.
Q: When should CBR08C309BAGAC be used instead of the main part?
A: CBR08C309BAGAC is selected when the application circuit operates at voltages exceeding 50V or when design margin for voltage transients requires higher voltage rating. The 250V rating provides additional safety margin. Capacitance value and package remain identical, so PCB layout compatibility is maintained.
Q: Are all three parts mechanically interchangeable?
A: Yes. All three parts use the 0805 (2012 Metric) package with identical dimensions (0.079" L x 0.049" W, 2.00mm x 1.25mm) and maximum thickness (0.037", 0.95mm). Surface-mount assembly processes and PCB footprints are identical.
Q: What is the significance of C0G/NP0 temperature coefficient?
A: C0G/NP0 designation indicates minimal capacitance variation across the operating temperature range (-55°C ~ 125°C). This characteristic is critical for RF and microwave applications where frequency stability and circuit performance depend on stable capacitance values.
Q: Are there compliance or regulatory differences between the three parts?
A: No. All three parts carry identical compliance certifications: ROHS3 Compliant, REACH Unaffected, and MSL 1 (Unlimited). Regulatory status is equivalent across all substitute options.
Q: What does MSL 1 (Unlimited) mean for handling and storage?
A: MSL 1 indicates the lowest moisture sensitivity level. These parts do not require special moisture-controlled storage or baking procedures prior to assembly, simplifying inventory management and reducing handling constraints.
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