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CAR0805-1MB1 Equivalent & Substitute Parts
Part Overview
The CAR0805-1MB1 is a 1 MOhm ±0.1% thin film chip resistor in 0805 (2012 Metric) package rated at 0.1W (1/10W) power dissipation. Manufactured by Riedon, this component is actively produced and ROHS3 compliant with unlimited moisture sensitivity rating (MSL 1). Substitute parts are necessary to address supply availability, lead time requirements, or specific application needs such as automotive qualification or enhanced power ratings.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Resistance | 1 MOhm |
| Tolerance | ±0.1% |
| Power Rating | 0.1W (1/10W) |
| Package | 0805 (2012 Metric) |
| Composition | Thin Film |
| Temperature Coefficient | ±25ppm/°C |
| Operating Temperature Range | -55°C ~ 155°C |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution eligibility is determined by the following mandatory parameters:
- Resistance value: 1 MOhm (exact match required)
- Tolerance: ±0.1% (exact match required)
- Package: 0805 (2012 Metric) (exact match required)
- Composition: Thin Film (exact match required)
- Temperature Coefficient: ±25ppm/°C or tighter (±15ppm/°C acceptable)
- Operating Temperature Range: Minimum -55°C ~ 155°C (extended ranges acceptable)
- RoHS Status: ROHS3 Compliant (required)
- Moisture Sensitivity Level: MSL 1 (required)
Substitute parts are categorized as Direct or Upgrade based on power rating. Direct substitutes maintain 0.1W (1/10W) rating. Upgrade substitutes provide higher power ratings (0.125W or 0.26W) while maintaining all other electrical and mechanical specifications, offering enhanced thermal performance in the same footprint.
Parameter Comparison
| Part Number | Manufacturer | Resistance | Tolerance | Power (W) | Temp Coeff (ppm/°C) | Op Temp Range | Height Max (mm) | Features |
|---|---|---|---|---|---|---|---|---|
| CAR0805-1MB1 | Riedon | 1 MOhm | ±0.1% | 0.1 | ±25 | -55 ~ 155°C | 0.65 | — |
| CPF0805B1M0E1 | TE Connectivity | 1 MOhm | ±0.1% | 0.1 | ±25 | -55 ~ 155°C | 0.65 | — |
| RNCF0805BTE1M00 | Stackpole Electronics | 1 MOhm | ±0.1% | 0.125 | ±25 | -55 ~ 155°C | 0.65 | Automotive AEC-Q200 |
| AT0805BRD071ML | YAGEO | 1 MOhm | ±0.1% | 0.125 | ±25 | -55 ~ 155°C | 0.60 | Anti-Sulfur, AEC-Q200, Moisture Resistant |
| CRT0805-BY-1004ELF | Bourns Inc. | 1 MOhm | ±0.1% | 0.125 | ±25 | -55 ~ 155°C | 0.65 | Current Sense |
| MCU08050D1004BP100 | Vishay Beyschlag | 1 MOhm | ±0.1% | 0.125 | ±25 | -55 ~ 125°C | 0.55 | Anti-Sulfur |
| RG2012P-105-B-T5 | Susumu | 1 MOhm | ±0.1% | 0.125 | ±25 | -55 ~ 155°C | 0.50 | Anti-Sulfur, AEC-Q200 |
| RP73D2A1M0BTDF | TE Connectivity | 1 MOhm | ±0.1% | 0.125 | ±15 | -55 ~ 155°C | 0.65 | — |
| RP73F2A1M0BTDF | TE Connectivity | 1 MOhm | ±0.1% | 0.125 | ±25 | -55 ~ 155°C | 0.65 | — |
| RT0805BRD071ML | YAGEO | 1 MOhm | ±0.1% | 0.125 | ±25 | -55 ~ 155°C | 0.60 | — |
| TNPW08051M00BEEA | Vishay Dale | 1 MOhm | ±0.1% | 0.26 | ±25 | -55 ~ 175°C | 0.55 | Anti-Sulfur, AEC-Q200, Moisture Resistant |
Engineering Selection Recommendations
Direct Substitute (Equivalent Power Rating): CPF0805B1M0E1 from TE Connectivity maintains identical electrical and mechanical specifications to the CAR0805-1MB1, including 0.1W power rating and ±25ppm/°C temperature coefficient. Both are ROHS3 compliant with MSL 1 rating and -55°C to 155°C operating range. This part is suitable for direct replacement without design modification.
Upgrade Substitutes (Enhanced Power Rating): All upgrade substitutes provide 0.125W or higher power dissipation while maintaining 1 MOhm ±0.1% resistance, 0805 package, and thin film composition. These parts are electrically and mechanically compatible with the original specification.
RNCF0805BTE1M00, AT0805BRD071ML, RG2012P-105-B-T5, and TNPW08051M00BEEA carry automotive AEC-Q200 qualification, suitable for applications requiring automotive-grade reliability. AT0805BRD071ML and TNPW08051M00BEEA include anti-sulfur and moisture-resistant features with extended operating temperature to 175°C.
RP73D2A1M0BTDF offers tighter temperature coefficient (±15ppm/°C) compared to the standard ±25ppm/°C, providing superior stability across temperature variations.
MCU08050D1004BP100 operates to 125°C maximum, which is 30°C below the original specification. Selection requires verification that application maximum temperature does not exceed 125°C.
Frequently Asked Questions (FAQ)
Q: Can I use a substitute part with higher power rating than the original CAR0805-1MB1? A: Yes. Upgrade substitutes with 0.125W or 0.26W ratings are electrically and mechanically compatible. Higher power ratings provide enhanced thermal performance in identical 0805 footprints. No design modification is required.
Q: What is the difference between Direct and Upgrade substitutes? A: Direct substitutes (CPF0805B1M0E1) match the original 0.1W power rating exactly. Upgrade substitutes provide higher power ratings (0.125W or 0.26W) while maintaining all other specifications. Selection depends on thermal requirements and available board space.
Q: Are all substitute parts ROHS3 compliant? A: Yes. All listed substitute parts are ROHS3 compliant with MSL 1 (unlimited) moisture sensitivity rating, matching the original CAR0805-1MB1 compliance status.
Q: Which substitute offers the best temperature stability? A: RP73D2A1M0BTDF provides ±15ppm/°C temperature coefficient, tighter than the standard ±25ppm/°C. This offers superior resistance stability across the -55°C to 155°C operating range.
Q: Can I use MCU08050D1004BP100 if my application operates above 125°C? A: No. MCU08050D1004BP100 is rated to 125°C maximum, which is 30°C below the original CAR0805-1MB1 specification of 155°C. Use only if application maximum temperature does not exceed 125°C.
Q: What is the significance of AEC-Q200 qualification? A: AEC-Q200 is automotive-grade qualification indicating the part meets automotive reliability and performance standards. Parts with this rating (RNCF0805BTE1M00, AT0805BRD071ML, RG2012P-105-B-T5, TNPW08051M00BEEA) are suitable for automotive applications requiring enhanced reliability.
Q: Does package height variation affect PCB assembly? A: Package heights range from 0.50mm to 0.65mm. Verify that your PCB assembly process and reflow profile accommodate the selected part's maximum height. Consult assembly documentation if height-critical applications are involved.
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