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C8108-04 Equivalent & Substitute Parts
Part Overview
The C8108-04 is an 8-position DIP socket manufactured by Aries Electronics, designed for through-hole mounting applications with wire wrap termination. This component features a 0.3" (7.62mm) row spacing and tin contact finish on phosphor bronze materials. The product is currently obsolete, making identification of functionally equivalent alternatives necessary for ongoing maintenance, repair, and legacy system support.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | C8108-04 |
| Manufacturer | Aries Electronics |
| Category | Sockets for ICs, Transistors |
| Number of Positions | 8 (2 x 4) |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Mounting Type | Through Hole |
| Termination | Wire Wrap |
| Contact Material - Mating | Phosphor Bronze |
| Contact Finish - Mating | Tin |
| Operating Temperature Range | -55°C ~ 105°C |
| Current Rating | 1.5 A |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Product Status | Obsolete |
| RoHS Status | ROHS3 Compliant |
Substitute Part Grouping Explanation
Substitution of the C8108-04 is determined by the following critical parameters that must align for functional equivalence:
Primary Matching Criteria:
- Number of positions: 8 (2 x 4) configuration
- Row spacing: 0.3" (7.62mm)
- Pitch specifications: 0.100" (2.54mm) for both mating and post
- Mounting type: Through hole
- Termination method: Wire wrap
Secondary Compatibility Factors:
- Operating temperature range must encompass or match the original specification
- Contact material and finish must support equivalent electrical performance
- Housing material must provide comparable mechanical stability
- Current rating must meet or exceed application requirements
- Compliance certifications (RoHS3, UL94 V-0) must be maintained
The AR 08-HZW/TN from Assmann WSW Components meets these primary criteria with identical positional configuration, row spacing, and pitch specifications. Differences in contact finish (gold vs. tin), contact material (beryllium copper vs. phosphor bronze), and current rating (3 A vs. 1.5 A) represent enhanced performance characteristics rather than incompatibilities.
Parameter Comparison
| Parameter | C8108-04 (Aries Electronics) | AR 08-HZW/TN (Assmann WSW) |
|---|---|---|
| Number of Positions | 8 (2 x 4) | 8 (2 x 4) |
| Type | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing |
| Pitch - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Mounting Type | Through Hole | Through Hole |
| Termination | Wire Wrap | Wire Wrap |
| Contact Material - Mating | Phosphor Bronze | Beryllium Copper |
| Contact Finish - Mating | Tin | Gold |
| Contact Finish Thickness - Mating | 200.0µin (5.08µm) | Not specified |
| Contact Finish - Post | Tin | Tin |
| Contact Finish Thickness - Post | 200.0µin (5.08µm) | 200.0µin (5.08µm) |
| Operating Temperature Range | -55°C ~ 105°C | -40°C ~ 105°C |
| Current Rating | 1.5 A | 3 A |
| Contact Resistance | Not specified | 4mOhm |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Product Status | Obsolete | Active |
Engineering Selection Recommendations
The AR 08-HZW/TN qualifies as a direct functional substitute for the C8108-04 based on matching mechanical and electrical interface specifications. Both components maintain ROHS3 compliance and UL94 V-0 flammability ratings, ensuring regulatory consistency in legacy system applications.
The AR 08-HZW/TN is currently in active production status, providing supply chain continuity for the obsolete C8108-04. The substitute part delivers enhanced electrical performance through higher current rating (3 A vs. 1.5 A) and gold contact finish on the mating interface, which improves contact reliability and corrosion resistance compared to tin plating.
The operating temperature range of the AR 08-HZW/TN (-40°C ~ 105°C) covers the upper operating limit of the original part. Applications requiring the full -55°C lower temperature specification of the C8108-04 must evaluate whether the -40°C minimum of the substitute meets system requirements.
Frequently Asked Questions (FAQ)
Q: Can the AR 08-HZW/TN directly replace the C8108-04 in existing PCB designs?
A: Yes. Both components share identical positional configuration (8 positions in 2 x 4 arrangement), row spacing (0.3"), pitch specifications (0.100"), mounting type (through hole), and termination method (wire wrap). Pin-to-pin compatibility is complete.
Q: What are the differences in contact materials between these parts?
A: The C8108-04 uses phosphor bronze with tin plating on mating contacts. The AR 08-HZW/TN uses beryllium copper with gold plating on mating contacts. Gold plating provides superior corrosion resistance and lower contact resistance (4mOhm specified for the substitute). Both materials are suitable for DIP socket applications.
Q: Does the higher current rating of the AR 08-HZW/TN affect compatibility?
A: No. The 3 A rating of the AR 08-HZW/TN exceeds the 1.5 A specification of the C8108-04. Higher current capacity does not create incompatibility; it represents enhanced performance margin for the application.
Q: Are there temperature range considerations for substitution?
A: The AR 08-HZW/TN operates from -40°C to 105°C, while the C8108-04 operates from -55°C to 105°C. If your application requires operation below -40°C, the substitute part does not meet the full temperature specification. For applications within -40°C to 105°C, the substitute is fully compatible.
Q: Do both parts meet the same compliance standards?
A: Yes. Both the C8108-04 and AR 08-HZW/TN are ROHS3 compliant and carry UL94 V-0 flammability ratings. Regulatory compliance is maintained with substitution.
Q: What is the packaging difference between these parts?
A: The C8108-04 packaging is not specified in available data. The AR 08-HZW/TN is supplied in tube packaging. Verify packaging requirements for your procurement and assembly processes.
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