C8051F823-GS Equivalent & Substitute Parts

Part Overview

The C8051F823-GS is an 8-bit microcontroller from Silicon Labs' C8051F82x series, featuring an 8051 core processor operating at 25MHz with 8KB FLASH program memory and 512 bytes of RAM. The device integrates SMBus (2-Wire/I2C), SPI, and UART/USART connectivity interfaces, along with essential peripherals including Power-On Reset (POR), Pulse Width Modulation (PWM), and Watchdog Timer (WDT) functionality.

This part carries a Last Time Buy product status, indicating that Silicon Labs has discontinued or will discontinue production. Organizations currently using the C8051F823-GS in active designs or requiring additional inventory must identify functionally compatible alternatives to ensure long-term supply chain continuity and support for ongoing manufacturing operations.

Substiute Parts

C8051F823-GS

Silicon LabsIn Stock: 971C8051F823-GS Datasheet

Current PartRFQ

LPC812M101JDH16FP

NXP USA Inc.In Stock: 2254LPC812M101JDH16FP Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the C8051F823-GS requires evaluation of microcontroller compatibility based on the following critical parameters:

Electrical Compatibility Criteria:

• Supply voltage range must encompass or match the 1.8V ~ 3.6V operating window
• Operating temperature range must support the required thermal envelope (-40°C ~ 85°C minimum)
• Connectivity interfaces (I2C/SMBus, SPI, UART/USART) must be present to maintain protocol compatibility
• Peripheral functions (POR, PWM, WDT) must be available for equivalent system functionality

Mechanical Compatibility Criteria:

• Package type and pin count must align with existing PCB layouts (16-pin configuration)
• Surface mount mounting type must be maintained for manufacturing process compatibility

Regulatory & Compliance Criteria:

• RoHS3 compliance status must be verified
• ECCN and HTSUS classifications must be consistent for supply chain and export control purposes

The LPC812M101JDH16FP from NXP USA Inc. is identified as a substitute part. While this device employs a different processor architecture (ARM Cortex-M0+ versus 8051), it satisfies the electrical and mechanical substitution criteria through equivalent or superior specifications in memory capacity, I/O count, connectivity interfaces, and operating parameters.

Parameter Comparison

Engineering Selection Recommendations

The LPC812M101JDH16FP qualifies as a functional substitute for the C8051F823-GS based on the following engineering criteria:

Supply Voltage Compatibility: Both devices operate within the identical 1.8V ~ 3.6V supply voltage range, eliminating the need for power supply circuit modifications.

Connectivity Interface Alignment: The substitute part provides I2C, SPI, and UART/USART interfaces, maintaining protocol compatibility with existing system designs. SMBus operation is achievable through I2C protocol implementation on the LPC812M101JDH16FP.

Peripheral Feature Parity: Essential peripherals including POR, PWM, and WDT are present on the substitute device. The LPC812M101JDH16FP additionally integrates Brown-out Detect/Reset functionality, providing enhanced power supply monitoring.

Memory and Performance Enhancement: The substitute part provides doubled FLASH memory (16KB versus 8KB) and increased RAM capacity (4K x 8 versus 512 x 8), supporting more complex firmware implementations. Operating speed is increased from 25MHz to 30MHz.

Regulatory Compliance: Both devices maintain ROHS3 compliance and share identical ECCN and HTSUS classifications, ensuring consistent supply chain and export control treatment.

Product Status Advantage: The LPC812M101JDH16FP carries Active product status, guaranteeing long-term availability and manufacturer support, contrasting with the Last Time Buy status of the C8051F823-GS.

Package Consideration: The substitute employs a 16-TSSOP package (0.173", 4.40mm width) versus the 16-SOIC package (0.154", 3.90mm width) of the main part. PCB layout modifications are required to accommodate the different package footprint and pin pitch.

Frequently Asked Questions (FAQ)

Q: Can the LPC812M101JDH16FP directly replace the C8051F823-GS without firmware modifications?

A: Direct pin-for-pin replacement is not possible due to different package types (16-TSSOP versus 16-SOIC) and processor architectures (ARM Cortex-M0+ versus 8051). PCB layout redesign and firmware porting are required. However, the substitute part's enhanced memory and I/O capabilities support equivalent or expanded functionality.

Q: Are the supply voltage requirements identical between these devices?

A: Yes. Both the C8051F823-GS and LPC812M101JDH16FP operate within the 1.8V ~ 3.6V supply voltage range. Existing power supply circuits require no modification.

Q: What is the impact of the different package types on PCB design?

A: The C8051F823-GS uses a 16-SOIC package with 0.154" width, while the LPC812M101JDH16FP uses a 16-TSSOP package with 0.173" width. These packages have different footprints and pin pitches, requiring complete PCB layout redesign. Component placement, trace routing, and via positioning must be recalculated for the new package geometry.

Q: Does the LPC812M101JDH16FP support SMBus protocol?

A: The LPC812M101JDH16FP integrates I2C interface capability. SMBus operation is achievable through I2C protocol implementation, as SMBus is a subset of I2C with additional timing and electrical specifications. Firmware implementation must ensure compliance with SMBus timing requirements.

Q: What are the advantages of the substitute part's increased memory capacity?

A: The LPC812M101JDH16FP provides 16KB FLASH (versus 8KB) and 4K x 8 RAM (versus 512 x 8). This increased memory capacity supports more complex firmware implementations, larger data tables, and expanded application functionality without external memory requirements.

Q: Is the extended operating temperature range of the LPC812M101JDH16FP (-40°C ~ 105°C) beneficial?

A: The substitute part's extended upper temperature limit (105°C versus 85°C) provides additional thermal margin for applications operating in elevated ambient conditions or with high component power dissipation. This specification advantage does not introduce compatibility issues for designs operating within the original -40°C ~ 85°C range.

Q: What is the significance of the different Moisture Sensitivity Levels?

A: The C8051F823-GS carries MSL 3 (168 hours), while the LPC812M101JDH16FP carries MSL 1 (unlimited). MSL 1 indicates superior moisture resistance and eliminates the need for bake-out procedures prior to reflow soldering. This represents an improvement in manufacturing process robustness and component shelf-life management.

Q: Are both devices RoHS3 compliant?

A: Yes. Both the C8051F823-GS and LPC812M101JDH16FP are ROHS3 compliant, ensuring consistency with environmental and regulatory requirements across supply chains and end-use markets.