C8051F330-GP Equivalent & Substitute Parts

Part Overview

The C8051F330-GP is an 8-bit microcontroller from Silicon Labs' C8051F33x series, featuring 8KB FLASH program memory, 768 bytes of RAM, and integrated peripherals including SMBus, SPI, and UART connectivity. The device operates at 25MHz with a supply voltage range of 2.7V to 3.6V and is housed in a 20-pin DIP package for through-hole mounting.

This part is classified as Obsolete, making equivalent substitutes necessary for ongoing production and maintenance applications. Substitution is based on matching core processor architecture, memory configuration, peripheral set, electrical specifications, and functional compatibility.

Substiute Parts

C8051F330-GP

Silicon LabsIn Stock: 936C8051F330-GP Datasheet

Current PartRFQ

C8051F330-GM

Silicon LabsIn Stock: 1315C8051F330-GM Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution for the C8051F330-GP is determined by strict equivalence across the following critical parameters:

• Core Architecture: 8051 processor family
• Memory Configuration: 8KB FLASH program memory, 768 bytes RAM
• Clock Speed: 25MHz operation
• Peripheral Set: SMBus, SPI, UART/USART, POR, PWM, Temperature Sensor, Watchdog Timer
• I/O Count: 17 I/O pins
• Voltage Specifications: 2.7V to 3.6V supply range
• Data Conversion: 16-channel 10-bit A/D, 1-channel 10-bit D/A
• Temperature Range: -40°C to 85°C

The C8051F330-GM qualifies as a direct functional equivalent, maintaining identical core specifications while differing only in package form factor (20-MLP surface mount versus 20-DIP through-hole) and product lifecycle status.

Parameter Comparison

Engineering Selection Recommendations

The C8051F330-GM serves as a functional equivalent to the C8051F330-GP for applications requiring identical microcontroller specifications. Both devices share the same base product number (C8051F330) and maintain complete electrical and functional parity across all core parameters.

Selection between these parts is determined by board-level design requirements:

• C8051F330-GP (20-DIP Through-Hole): Suitable for through-hole PCB designs, breadboard prototyping, and legacy board layouts requiring DIP package form factor.
• C8051F330-GM (20-MLP Surface Mount): Required for surface-mount PCB designs, high-density layouts, and modern manufacturing processes utilizing automated pick-and-place assembly.

Both parts carry identical compliance certifications (EAR99, HTSUS 8542.31.0001) and moisture sensitivity ratings (MSL 1). The C8051F330-GM carries RoHS3 compliance and REACH Unaffected status. Both devices are classified outside active production (Obsolete and Not For New Designs respectively), indicating limited future availability.

Frequently Asked Questions (FAQ)

Q: Can C8051F330-GM replace C8051F330-GP in existing designs?

A: Yes, provided the PCB layout accommodates the 20-MLP surface-mount package. The electrical specifications, memory configuration, peripheral set, and functional behavior are identical. Board redesign is required to transition from through-hole to surface-mount form factor.

Q: What is the primary difference between these two parts?

A: The C8051F330-GP uses a 20-pin DIP through-hole package, while the C8051F330-GM uses a 20-pin MLP surface-mount package. All microcontroller specifications remain identical.

Q: Are there any compliance or certification differences?

A: Both parts share the same ECCN (EAR99) and HTSUS codes. The C8051F330-GM includes RoHS3 compliance and REACH Unaffected status. Both carry MSL 1 (Unlimited) moisture sensitivity ratings.

Q: What does "Obsolete" and "Not For New Designs" status mean?

A: These designations indicate that both parts are outside active production. The C8051F330-GP is fully obsolete, while the C8051F330-GM is restricted from new design implementations. Existing inventory may be available, but long-term supply cannot be guaranteed.

Q: Can I use these parts interchangeably on the same PCB?

A: No. The different package types (DIP versus MLP) require different PCB footprints and assembly methods. A specific package variant must be selected during PCB design.