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C322C104F5G5TA Equivalent & Substitute Parts
Part Overview
The C322C104F5G5TA is a 0.1 µF ceramic capacitor rated at 50V with C0G/NP0 temperature coefficient, manufactured by KEMET as part of the GoldMax 300 Comm C0G series. This radial through-hole component is designed for general-purpose applications requiring stable capacitance across temperature variations. The part is currently active in production with 1087 units in stock. Substitute parts are identified when electrical specifications and mechanical compatibility align with the original component's functional requirements.
Substiute Parts
Key Parameters
| Parameter | Value | Significance for Substitution |
|---|---|---|
| Capacitance | 0.1 µF | Must match exactly |
| Voltage Rating | 50V | Must match or exceed |
| Tolerance | ±1% | Must match or be tighter |
| Temperature Coefficient | C0G, NP0 | Must match exactly |
| Operating Temperature Range | -55°C ~ 125°C | Must match or exceed |
| Mounting Type | Through Hole Radial | Must match for PCB compatibility |
| Lead Spacing | 0.200" (5.08mm) | Must match for PCB hole pattern |
| RoHS Status | ROHS3 Compliant | Must maintain compliance |
Substitute Part Grouping Explanation
Substitute parts for the C322C104F5G5TA are identified based on strict electrical and mechanical parameter matching. The following criteria determine substitution eligibility:
Electrical Parameters (Non-Negotiable):
- Capacitance value: 0.1 µF (exact match required)
- Voltage rating: 50V minimum (exact match in this case)
- Tolerance: ±1% (exact match required)
- Temperature coefficient: C0G/NP0 (exact match required)
- Operating temperature range: -55°C to 125°C (exact match required)
Mechanical Parameters (PCB Compatibility):
- Mounting type: Through-hole radial (exact match required)
- Lead spacing: 0.200" (5.08mm) (exact match required for PCB hole pattern)
- Lead style: Formed leads (acceptable variation: kinked formed leads)
Compliance Parameters:
- RoHS3 compliance status (must be maintained)
- REACH status (must be maintained)
The C333C104F5G5TA qualifies as a substitute because it maintains all critical electrical specifications and lead spacing while accommodating a larger physical envelope and kinked lead style.
Parameter Comparison
| Parameter | C322C104F5G5TA (Main Part) | C333C104F5G5TA (Substitute) | Match Status |
|---|---|---|---|
| Manufacturer | KEMET | KEMET | Identical |
| Capacitance | 0.1 µF | 0.1 µF | Identical |
| Tolerance | ±1% | ±1% | Identical |
| Voltage Rating | 50V | 50V | Identical |
| Temperature Coefficient | C0G, NP0 | C0G, NP0 | Identical |
| Operating Temperature | -55°C ~ 125°C | -55°C ~ 125°C | Identical |
| Mounting Type | Through Hole | Through Hole | Identical |
| Package / Case | Radial | Radial | Identical |
| Lead Spacing | 0.200" (5.08mm) | 0.200" (5.08mm) | Identical |
| Lead Style | Formed Leads | Formed Leads - Kinked | Compatible |
| Size / Dimension | 0.200" L x 0.125" W (5.08mm x 3.18mm) | 0.280" L x 0.160" W (7.11mm x 4.07mm) | Substitute is larger |
| Height - Seated (Max) | 0.260" (6.60mm) | 0.400" (10.16mm) | Substitute is taller |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Identical |
| REACH Status | REACH Unaffected | REACH Unaffected | Identical |
| Product Status | Active | Active | Identical |
Engineering Selection Recommendations
Both the C322C104F5G5TA and C333C104F5G5TA are active production components manufactured by KEMET with identical electrical specifications and compliance certifications. Selection between these parts is determined by physical space constraints on the printed circuit board.
C322C104F5G5TA Selection Criteria:
- Compact form factor required (0.200" L x 0.125" W, 6.60mm max height)
- Space-constrained PCB layouts
- Standard formed lead configuration preferred
C333C104F5G5TA Selection Criteria:
- Larger physical envelope acceptable (0.280" L x 0.160" W, 10.16mm max height)
- Kinked lead style compatible with assembly process
- Both parts maintain identical electrical performance and compliance status
Both parts share the same lead spacing (0.200" / 5.08mm), ensuring PCB hole pattern compatibility. The substitute part's larger dimensions do not affect electrical function and remain within the same product series and compliance framework.
Frequently Asked Questions (FAQ)
Q: Can C333C104F5G5TA replace C322C104F5G5TA in any application?
A: Substitution is valid when PCB layout accommodates the larger physical dimensions (0.280" L x 0.160" W vs. 0.200" L x 0.125" W) and increased seated height (0.400" vs. 0.260"). Lead spacing remains identical at 0.200" (5.08mm), so PCB hole patterns are compatible. Electrical performance is identical.
Q: Are there differences in electrical performance between these parts?
A: No. Both parts have identical capacitance (0.1 µF), tolerance (±1%), voltage rating (50V), temperature coefficient (C0G/NP0), and operating temperature range (-55°C to 125°C). Electrical behavior is equivalent.
Q: What is the difference between "Formed Leads" and "Formed Leads - Kinked"?
A: Both are radial lead configurations suitable for through-hole PCB assembly. The kinked variant (C333C104F5G5TA) has leads bent at an angle, while the standard formed leads (C322C104F5G5TA) are straight. Both accommodate the same 0.200" lead spacing. Lead style selection depends on assembly equipment and PCB design preferences.
Q: Do both parts meet the same compliance standards?
A: Yes. Both C322C104F5G5TA and C333C104F5G5TA are ROHS3 compliant and REACH unaffected, with identical ECCN (EAR99) and HTSUS (8532.24.0060) classifications.
Q: Which part should be selected for space-constrained applications?
A: The C322C104F5G5TA is the appropriate choice for compact layouts due to its smaller footprint (0.200" L x 0.125" W, 6.60mm max height). The C333C104F5G5TA requires additional vertical and horizontal clearance.
Q: Are inventory levels a factor in part selection?
A: Inventory availability may influence procurement decisions. C333C104F5G5TA has 1232 units in stock compared to 1087 units for C322C104F5G5TA. However, part selection should be based on electrical and mechanical compatibility requirements first.
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