Request Quote
(Ships tomorrow)
C2012JB1C685K085AC Equivalent & Substitute Parts
Part Overview
The C2012JB1C685K085AC is a 6.8 µF ±10% 16V ceramic capacitor manufactured by TDK Corporation in the 0805 (2012 Metric) package. This surface mount multilayer ceramic capacitor (MLCC) features low ESL characteristics and JB temperature coefficient, suitable for general purpose applications. The part is designated as Last Time Buy, indicating limited availability and the necessity to identify equivalent alternatives for ongoing production requirements.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Capacitance | 6.8 µF |
| Tolerance | ±10% |
| Voltage - Rated | 16V |
| Temperature Coefficient | JB |
| Operating Temperature Range | -25°C ~ 85°C |
| Package / Case | 0805 (2012 Metric) |
| Mounting Type | Surface Mount, MLCC |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution of the C2012JB1C685K085AC is determined by the following critical parameters:
Primary Substitution Criteria:
- Capacitance value: 6.8 µF (fixed requirement)
- Tolerance: ±10% (fixed requirement)
- Package / Case: 0805 (2012 Metric) (fixed requirement)
- Mounting Type: Surface Mount, MLCC (fixed requirement)
Secondary Substitution Parameters (allow variation):
- Voltage Rating: 16V or higher (uprating acceptable)
- Temperature Coefficient: JB, X5R, X6S, or X7S (different coefficients with different temperature ranges)
- Thickness: 0.039" (1.00mm) or 0.057" (1.45mm) (space-dependent)
- Packaging Format: Cut Tape (CT) or Tape & Reel (TR) (procurement-dependent)
Substitute parts maintain identical capacitance, tolerance, and package dimensions while allowing voltage uprating and temperature coefficient variation based on application requirements.
Parameter Comparison
| Part Number | Manufacturer | Capacitance | Voltage | Temp Coeff | Temp Range | Thickness | Packaging | Status |
|---|---|---|---|---|---|---|---|---|
| C2012JB1C685K085AC | TDK | 6.8 µF | 16V | JB | -25°C ~ 85°C | 0.039" (1.00mm) | Cut Tape | Last Time Buy |
| C2012JB1C685K125AC | TDK | 6.8 µF | 16V | JB | -25°C ~ 85°C | 0.057" (1.45mm) | Tape & Reel | Last Time Buy |
| C2012JB1E685K125AC | TDK | 6.8 µF | 25V | JB | -25°C ~ 85°C | 0.057" (1.45mm) | Cut Tape | Last Time Buy |
| C2012JB1V685K125AC | TDK | 6.8 µF | 35V | JB | -25°C ~ 85°C | 0.057" (1.45mm) | Cut Tape | Last Time Buy |
| C2012X5R1C685K085AC | TDK | 6.8 µF | 16V | X5R | -55°C ~ 85°C | 0.039" (1.00mm) | Tape & Reel | Not For New Designs |
| C2012X5R1E685K125AC | TDK | 6.8 µF | 25V | X5R | -55°C ~ 85°C | 0.057" (1.45mm) | Cut Tape & Digi-Reel | Not For New Designs |
| C2012X5R1V685K125AC | TDK | 6.8 µF | 35V | X5R | -55°C ~ 85°C | 0.057" (1.45mm) | Tape & Reel | Not For New Designs |
| C2012X6S1C685K125AC | TDK | 6.8 µF | 16V | X6S | -55°C ~ 105°C | 0.057" (1.45mm) | Tape & Reel | Not For New Designs |
| C2012X7S1C685K125AC | TDK | 6.8 µF | 16V | X7S | -55°C ~ 125°C | 0.057" (1.45mm) | Tape & Reel | Not For New Designs |
Engineering Selection Recommendations
Direct Replacement (Same Voltage & Temperature Coefficient): C2012JB1C685K125AC serves as the direct substitute when packaging format change from Cut Tape to Tape & Reel is acceptable. Both parts maintain 16V rating and JB temperature coefficient with identical electrical performance.
Voltage Uprating Substitutes (JB Temperature Coefficient): C2012JB1E685K125AC (25V) and C2012JB1V685K125AC (35V) provide higher voltage ratings while maintaining JB temperature coefficient and -25°C ~ 85°C operating range. These are suitable for applications requiring voltage margin without temperature range expansion.
Extended Temperature Range Substitutes (X5R Coefficient): C2012X5R1C685K085AC, C2012X5R1E685K125AC, and C2012X5R1V685K125AC expand the operating temperature range to -55°C ~ 85°C. These parts are designated Not For New Designs but remain available for legacy system support.
Enhanced Temperature Range Substitutes (X6S & X7S Coefficients): C2012X6S1C685K125AC (-55°C ~ 105°C) and C2012X7S1C685K125AC (-55°C ~ 125°C) provide the widest temperature operating ranges. Selection depends on application thermal requirements and space constraints (0.057" thickness).
All substitute parts maintain ROHS3 compliance, MSL 1 rating, and identical 6.8 µF capacitance with ±10% tolerance in the 0805 package footprint.
Frequently Asked Questions (FAQ)
Q: Can C2012JB1C685K125AC replace C2012JB1C685K085AC directly? A: Yes. Both parts share identical electrical specifications (6.8 µF, ±10%, 16V, JB coefficient, -25°C ~ 85°C). The difference is packaging format (Cut Tape vs. Tape & Reel) and thickness (0.039" vs. 0.057"). Verify PCB assembly equipment compatibility with the thicker profile.
Q: What is the difference between JB and X5R temperature coefficients? A: JB coefficient specifies -25°C ~ 85°C operating range with tighter capacitance stability in this band. X5R coefficient extends the range to -55°C ~ 85°C with broader temperature compensation. Select based on application minimum operating temperature requirement.
Q: Can I use a 25V or 35V rated part instead of 16V? A: Yes. Voltage uprating is a standard substitution practice. C2012JB1E685K125AC (25V) and C2012JB1V685K125AC (35V) provide additional voltage margin while maintaining identical capacitance and temperature characteristics. Physical thickness increases to 0.057".
Q: Are X5R, X6S, and X7S parts suitable for new designs? A: These parts are marked Not For New Designs. They remain available for legacy system support and field replacements but should not be selected for new product development. Prioritize JB coefficient parts for new applications.
Q: What is the significance of MSL 1 rating? A: MSL 1 (Moisture Sensitivity Level 1) indicates unlimited shelf life without moisture baking requirements. All listed substitutes carry MSL 1, eliminating moisture-related handling constraints during assembly.
Q: Does package thickness affect PCB layout? A: Yes. The original part is 0.039" (1.00mm) thick. Most substitutes are 0.057" (1.45mm). Verify clearance above the component location for solder reflow and component placement equipment. Consult PCB assembly guidelines if space is constrained.
Alternative Parts
SJ6012L2TP
Littelfuse Inc.
6 Alternative Parts
JMK107BBJ476MA-RE
Taiyo Yuden
10 Alternative Parts
GMK107BBJ475MA-T
Taiyo Yuden
5 Alternative Parts
SJ6020N2ARP
Littelfuse Inc.
3 Alternative Parts
SJ6025R2ATP
Littelfuse Inc.
4 Alternative Parts
2474-05L
API Delevan Inc.
1 Alternative Parts
4590R-684K
API Delevan Inc.
1 Alternative Parts
CM6560R-334
API Delevan Inc.
1 Alternative Parts
CM6460-104
API Delevan Inc.
1 Alternative Parts
5526-12
API Delevan Inc.
1 Alternative Parts
