Equivalent & Substitute Parts for C161PILFCAFXUMA1

Part Overview

The C161PILFCAFXUMA1 is a 16-bit C166 microcontroller from Infineon Technologies, featuring a ROMless architecture with 20MHz operation and 3K x 8 RAM. This device is classified as obsolete, necessitating identification of functionally compatible alternatives for ongoing system support and new designs. The part operates within a 4.5V to 5.5V supply range and includes integrated peripherals such as PWM, WDT, and a 4-channel 10-bit A/D converter across 76 I/O pins in a 100-pin LQFP package.

Substiute Parts

C161PILFCAFXUMA1
Infineon TechnologiesIn Stock: 940C161PILFCAFXUMA1 Datasheet
C161PILFCAFXUMA1
Current Part
XMC4400F100K512BAXQMA1
Infineon TechnologiesIn Stock: 1044XMC4400F100K512BAXQMA1 Datasheet
XMC4400F100K512BAXQMA1
MFR Recommended

Key Parameters

Parameter C161PILFCAFXUMA1
Manufacturer Infineon Technologies
Core Processor C166
Core Size 16-Bit
Speed 20MHz
Package / Case 100-LQFP
Program Memory Type ROMless
RAM Size 3K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V
Number of I/O 76
Data Converters A/D 4x10b
Connectivity EBI/EMI, I2C, SPI, UART/USART
Peripherals POR, PWM, WDT
Operating Temperature -40°C ~ 85°C (TA)
Product Status Obsolete
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

The XMC4400F100K512BAXQMA1 is identified as a manufacturer-recommended substitute for the C161PILFCAFXUMA1. Substitution eligibility is determined by the following criteria:

Package Compatibility: Both devices utilize the 100-pin LQFP package format, ensuring mechanical and electrical pin compatibility for PCB mounting and signal routing.

Mounting Type: Both parts are surface-mount devices, maintaining assembly process compatibility.

Connectivity Interfaces: The substitute retains core communication protocols (I2C, SPI, UART) present in the original part, with extended capability through additional interfaces (CANbus, Ethernet, LINbus, USB).

Peripheral Feature Set: The substitute includes all peripheral functions of the original (PWM, WDT, POR) with enhanced capabilities (DMA, I2S, LED control).

Supply Voltage Consideration: The substitute operates at 3.13V to 3.63V, requiring voltage regulation adjustment from the original 4.5V to 5.5V specification.

Compliance and Certification: Both parts maintain identical REACH and HTSUS classifications, with the substitute achieving ROHS3 compliance.

Parameter Comparison

Parameter C161PILFCAFXUMA1 XMC4400F100K512BAXQMA1
Manufacturer Infineon Technologies Infineon Technologies
Core Processor C166 ARM® Cortex®-M4
Core Size 16-Bit 32-Bit Single-Core
Speed 20MHz 120MHz
Package / Case 100-LQFP 100-LQFP Exposed Pad
Program Memory Type ROMless FLASH
Program Memory Size 512KB (512K x 8)
RAM Size 3K x 8 80K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 3.13V ~ 3.63V
Number of I/O 76 55
Data Converters A/D 4x10b A/D 24x12b; D/A 2x12b
Connectivity EBI/EMI, I2C, SPI, UART/USART CANbus, Ethernet, I2C, LINbus, SPI, UART, USB
Peripherals POR, PWM, WDT DMA, I2S, LED, POR, PWM, WDT
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Product Status Obsolete Active
Mounting Type Surface Mount Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
HTSUS 8542.31.0001 8542.31.0001

Engineering Selection Recommendations

The XMC4400F100K512BAXQMA1 is designated as the manufacturer-recommended substitute and is classified as an active product with current production support. This substitute maintains identical regulatory compliance (REACH Unaffected, HTSUS 8542.31.0001) and achieves ROHS3 compliance, exceeding the original part's environmental standards.

The substitute's 100-pin LQFP package with exposed pad provides enhanced thermal management compared to the original package configuration. Both devices share identical moisture sensitivity levels (MSL 3, 168 Hours), ensuring equivalent handling and storage requirements.

Selection of the XMC4400F100K512BAXQMA1 requires accommodation of the reduced I/O count (55 versus 76 pins) and modified supply voltage specification (3.13V to 3.63V versus 4.5V to 5.5V). The substitute's extended operating temperature range (-40°C to 125°C) provides broader environmental coverage than the original specification.

Frequently Asked Questions (FAQ)

Q: What is the primary reason for substituting the C161PILFCAFXUMA1?

A: The C161PILFCAFXUMA1 is classified as obsolete. The XMC4400F100K512BAXQMA1 is the manufacturer-recommended active alternative, ensuring continued availability and production support.

Q: Are the packages mechanically compatible?

A: Both devices use the 100-pin LQFP package format. The substitute features an exposed pad variant, which provides improved thermal performance. Pin-to-pin compatibility requires verification of signal assignments for your specific application.

Q: What voltage adjustment is required?

A: The original part operates at 4.5V to 5.5V, while the substitute requires 3.13V to 3.63V. Power supply redesign is necessary to accommodate this specification change.

Q: How do the I/O pin counts differ?

A: The original part provides 76 I/O pins, while the substitute provides 55 I/O pins. Applications requiring all 76 pins must evaluate whether the reduced I/O count is compatible with system requirements.

Q: What are the key performance improvements in the substitute?

A: The substitute features a 32-bit ARM Cortex-M4 processor operating at 120MHz (versus 16-bit C166 at 20MHz), 512KB FLASH memory, 80K x 8 RAM, and enhanced data conversion capabilities (24-channel 12-bit A/D, 2-channel 12-bit D/A). Extended connectivity includes CANbus, Ethernet, LINbus, and USB.

Q: Are compliance certifications equivalent?

A: Both parts maintain REACH Unaffected and identical HTSUS classifications. The substitute achieves ROHS3 compliance, providing enhanced environmental compliance compared to the original part.

Q: What is the operating temperature range difference?

A: The original part operates from -40°C to 85°C, while the substitute operates from -40°C to 125°C, providing extended high-temperature capability.

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