Equivalent & Substitute Parts for C161PILF3VCABXUMA1

Part Overview

The C161PILF3VCABXUMA1 is a 16-bit microcontroller from Infineon Technologies' C16xx series, featuring a C166 core processor operating at 20MHz with ROMless architecture. This device is classified as obsolete, making substitute components necessary for new designs and production continuity. The part is designed for embedded applications requiring moderate processing capability with integrated connectivity interfaces and peripheral support.

Substiute Parts

C161PILF3VCABXUMA1
Infineon TechnologiesIn Stock: 1178C161PILF3VCABXUMA1 Datasheet
C161PILF3VCABXUMA1
Current Part
XMC4400F100K512BAXQMA1
Infineon TechnologiesIn Stock: 1044XMC4400F100K512BAXQMA1 Datasheet
XMC4400F100K512BAXQMA1
MFR Recommended

Key Parameters

Parameter C161PILF3VCABXUMA1
Manufacturer Infineon Technologies
Core Processor C166
Core Size 16-Bit
Speed 20MHz
Program Memory Type ROMless
RAM Size 3K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 3.6V
Package / Case 100-LQFP
Mounting Type Surface Mount
Operating Temperature 0°C ~ 70°C
Product Status Obsolete

Substitute Part Grouping Explanation

The XMC4400F100K512BAXQMA1 is identified as a manufacturer-recommended substitute for the C161PILF3VCABXUMA1. Substitution eligibility is determined by the following parameters:

  • Package Compatibility: Both devices use 100-LQFP surface mount packaging, enabling direct PCB footprint compatibility
  • Voltage Supply Range: The substitute operates within 3.13V ~ 3.63V, which overlaps the original part's 3V ~ 3.6V specification
  • Connectivity Interfaces: Both parts support I2C, SPI, and UART/USART protocols, ensuring functional compatibility for communication-dependent applications
  • Peripheral Support: Both include PWM and WDT (Watchdog Timer) functionality
  • Mounting Type: Both are surface mount devices suitable for automated assembly processes

The substitute represents a significant architectural upgrade from 16-bit to 32-bit processing with enhanced memory capacity and extended operating temperature range, while maintaining package and core connectivity compatibility.

Parameter Comparison

Parameter C161PILF3VCABXUMA1 XMC4400F100K512BAXQMA1
Manufacturer Infineon Technologies Infineon Technologies
Core Processor C166 ARM® Cortex®-M4
Core Size 16-Bit 32-Bit Single-Core
Speed 20MHz 120MHz
Program Memory Type ROMless FLASH (512KB)
RAM Size 3K x 8 80K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 3.6V 3.13V ~ 3.63V
Connectivity EBI/EMI, I2C, SPI, UART/USART CANbus, Ethernet, I2C, LINbus, SPI, UART, USB
Peripherals POR, PWM, WDT DMA, I2S, LED, POR, PWM, WDT
Number of I/O 76 55
Data Converters A/D 4x10b A/D 24x12b, D/A 2x12b
Operating Temperature 0°C ~ 70°C -40°C ~ 125°C
Package / Case 100-LQFP 100-LQFP Exposed Pad
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

The XMC4400F100K512BAXQMA1 is the manufacturer-recommended substitute and is classified as Active product status, ensuring long-term availability and supply chain continuity. The original C161PILF3VCABXUMA1 is obsolete, making the substitute necessary for ongoing production and new designs.

Both devices maintain REACH Unaffected compliance status and identical Moisture Sensitivity Level (MSL) ratings, supporting equivalent handling and storage requirements. The substitute's RoHS3 compliance provides enhanced environmental regulatory alignment compared to the original part.

The substitute's extended operating temperature range (-40°C ~ 125°C) accommodates broader industrial and automotive applications beyond the original specification (0°C ~ 70°C). The 100-LQFP Exposed Pad package variant of the substitute provides improved thermal management characteristics suitable for higher-performance applications.

Frequently Asked Questions (FAQ)

Q: Can the XMC4400F100K512BAXQMA1 directly replace the C161PILF3VCABXUMA1 on existing PCBs?

A: Both devices use 100-LQFP surface mount packaging with compatible footprints. However, the substitute features an exposed pad variant, which may require PCB layout modifications for thermal via placement. Electrical compatibility is supported through overlapping voltage supply ranges and shared connectivity protocols (I2C, SPI, UART).

Q: What are the key differences in memory architecture?

A: The original part uses ROMless architecture with 3K x 8 RAM. The substitute provides 512KB FLASH program memory and 80K x 8 RAM, representing a significant increase in available memory resources. Applications requiring external program memory with the original part can utilize internal FLASH with the substitute.

Q: Are the I/O pin counts compatible?

A: The original part provides 76 I/O pins while the substitute provides 55 I/O pins. Applications utilizing more than 55 I/O pins require design modification or alternative component selection.

Q: What compliance certifications apply to both parts?

A: Both devices maintain REACH Unaffected status and MSL 3 (168 Hours) moisture sensitivity ratings. The substitute additionally provides RoHS3 compliance, supporting enhanced environmental regulatory requirements.

Q: How do the operating temperature ranges differ?

A: The original part operates within 0°C ~ 70°C. The substitute extends this range to -40°C ~ 125°C, enabling deployment in extended temperature environments including automotive and industrial applications.

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