BZX584B56 Equivalent & Substitute Parts

Part Overview

The BZX584B56 is an active-status Zener diode manufactured by Taiwan Semiconductor Corporation, designed for surface mount applications in the SOD-523F package. This component provides voltage regulation and transient protection in electronic circuits. The part is specified for 56 V nominal Zener voltage with 150 mW maximum power dissipation and ±2% tolerance. Substitute parts are identified to provide equivalent electrical and mechanical performance for applications requiring alternative packaging formats or inventory availability.

Substiute Parts

BZX584B56

Taiwan Semiconductor CorporationIn Stock: 1010BZX584B56 Datasheet

Current PartRFQ

BZX584B56 RSG

Taiwan Semiconductor CorporationIn Stock: 8697BZX584B56 RSG Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the BZX584B56 is determined by equivalence across the following critical parameters:

• Voltage - Zener (Nom) (Vz): 56 V
• Tolerance: ±2%
• Power - Max: 150 mW
• Impedance (Max) (Zzt): 200 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 43 V
• Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
• Operating Temperature Range: -55°C ~ 150°C (TJ)
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523F

The identified substitute part maintains identical electrical specifications and thermal operating range. The primary distinction between the main part and substitute is the packaging format: the main part is supplied in Tape & Reel (TR) format, while the substitute is available in Cut Tape (CT) & Digi-Reel® format. Both parts are manufactured by Taiwan Semiconductor Corporation and carry identical compliance certifications.

Parameter Comparison

Engineering Selection Recommendations

Both the BZX584B56 and BZX584B56 RSG are active-status components manufactured by Taiwan Semiconductor Corporation with identical electrical and thermal specifications. Selection between these parts is based on packaging and supply chain requirements rather than functional performance.

The BZX584B56 in Tape & Reel format is suitable for high-volume automated assembly operations. The BZX584B56 RSG in Cut Tape & Digi-Reel® format provides flexibility for lower-volume applications, prototype development, or mixed-component pick-and-place operations.

Both parts maintain ROHS3 compliance and REACH Unaffected status, ensuring regulatory compatibility across manufacturing environments. The identical electrical parameters, impedance characteristics, and thermal operating range (-55°C ~ 150°C) ensure functional interchangeability in circuit applications.

Frequently Asked Questions (FAQ)

Q: Are the BZX584B56 and BZX584B56 RSG electrically identical?

A: Yes. Both parts share identical Zener voltage (56 V), tolerance (±2%), maximum power (150 mW), impedance (200 Ohms maximum), reverse leakage current (100 nA @ 43 V), forward voltage (900 mV @ 10 mA), and operating temperature range (-55°C ~ 150°C).

Q: What is the difference between these two parts?

A: The primary difference is packaging format. The BZX584B56 is supplied in Tape & Reel (TR) format, while the BZX584B56 RSG is supplied in Cut Tape (CT) & Digi-Reel® format. Both use the SOD-523F package.

Q: Can I use BZX584B56 RSG as a direct replacement for BZX584B56?

A: Yes, for circuit functionality. The electrical and thermal specifications are identical. Packaging format differences affect assembly processes and supply chain logistics, not component performance.

Q: Are both parts RoHS and REACH compliant?

A: Yes. Both the BZX584B56 and BZX584B56 RSG are ROHS3 Compliant and REACH Unaffected.

Q: Which part should I select for high-volume production?

A: The BZX584B56 in Tape & Reel format is optimized for high-volume automated assembly. The BZX584B56 RSG in Cut Tape & Digi-Reel® format is suitable for lower-volume or mixed-component applications.

Q: Do these parts have the same thermal operating range?

A: Yes. Both parts operate across -55°C to 150°C junction temperature range.