BZX584B3V9-TP Equivalent & Substitute Parts

Part Overview

The BZX584B3V9-TP is a surface mount Zener diode manufactured by Micro Commercial Co, rated at 3.9 V nominal Zener voltage with 150 mW maximum power dissipation in the SOD-523 package. This component is classified as Active product status and is RoHS3 compliant. Substitute parts are identified when equivalent electrical performance and mechanical compatibility are required due to inventory constraints, supply chain considerations, or design flexibility needs.

Key Parameters

Parameter	Value	Unit
Voltage - Zener (Nom)	3.9	V
Power - Max	150	mW
Impedance (Max)	90	Ohms
Current - Reverse Leakage @ Vr	3	µA @ 1 V
Voltage - Forward (Vf) (Max) @ If	900	mV @ 10 mA
Operating Temperature Range	-55 to 150	°C (TJ)
Package / Case	SOD-523	—
Mounting Type	Surface Mount	—

Substitute Part Grouping Explanation

Substitution eligibility for the BZX584B3V9-TP is determined by the following critical parameters:

Zener Voltage (Vz): Must be 3.9 V nominal
Power Rating: Must be 150 mW maximum
Package Type: Must be SOD-523 surface mount
Impedance (Zzt): Must be 90 Ohms maximum
Reverse Leakage Current: Must be 3 µA @ 1 V
Forward Voltage: Must be 900 mV @ 10 mA maximum
Operating Temperature Range: Must support -55°C to 150°C
RoHS Compliance: Must be RoHS3 compliant

All identified substitute parts meet these electrical and mechanical specifications. Tolerance variations and packaging format differences (Tape & Reel versus Cut Tape) do not affect functional equivalence in circuit applications.

Parameter Comparison

Parameter	BZX584B3V9-TP	BZX584B3V9HE3-TP	BZX584B3V9 RSG
Manufacturer	Micro Commercial Co	Micro Commercial Co	Taiwan Semiconductor Corporation
Voltage - Zener (Nom)	3.9 V	3.9 V	3.9 V
Tolerance	±2.05%	±2%	±2%
Power - Max	150 mW	150 mW	150 mW
Impedance (Max)	90 Ohms	90 Ohms	90 Ohms
Current - Reverse Leakage @ Vr	3 µA @ 1 V	3 µA @ 1 V	3 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If	900 mV @ 10 mA	900 mV @ 10 mA	900 mV @ 10 mA
Operating Temperature	-55°C ~ 150°C	-55°C ~ 150°C	-55°C ~ 150°C
Package / Case	SOD-523	SOD-523	SOD-523
Mounting Type	Surface Mount	Surface Mount	Surface Mount
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Product Status	Active	Active	Active

Engineering Selection Recommendations

BZX584B3V9HE3-TP (Micro Commercial Co): This substitute is qualified to AEC-Q101 automotive standards and carries automotive-grade designation. Selection of this part is appropriate for applications requiring automotive qualification or enhanced reliability documentation. Tolerance specification is ±2%, which is tighter than the primary part's ±2.05%.

BZX584B3V9 RSG (Taiwan Semiconductor Corporation): This substitute is supplied in Cut Tape and Digi-Reel packaging format, contrasting with the primary part's Tape & Reel packaging. Electrical specifications are identical to the primary part. Selection is appropriate when alternative packaging formats align with assembly line requirements or inventory management protocols.

Both substitute parts maintain full electrical equivalence and RoHS3 compliance with the primary BZX584B3V9-TP component. Product status is Active for all three parts, ensuring continued availability and support.

Frequently Asked Questions (FAQ)

Q: Can BZX584B3V9HE3-TP be used as a direct replacement for BZX584B3V9-TP?

A: Yes. Both parts share identical electrical specifications: 3.9 V Zener voltage, 150 mW power rating, 90 Ohms impedance, and SOD-523 surface mount package. The BZX584B3V9HE3-TP features tighter tolerance (±2% versus ±2.05%) and automotive qualification, making it functionally equivalent and suitable for direct substitution.

Q: What is the difference between BZX584B3V9 RSG and the primary part?

A: The BZX584B3V9 RSG is manufactured by Taiwan Semiconductor Corporation and supplied in Cut Tape and Digi-Reel packaging, whereas the primary part uses Tape & Reel packaging. All electrical parameters are identical. The packaging difference does not affect circuit performance and is relevant only to assembly and handling procedures.

Q: Are all three parts compatible with the same PCB footprint?

A: Yes. All three parts use the SOD-523 surface mount package, which defines identical land pattern and solder pad geometry. PCB layout and reflow soldering parameters remain unchanged across all three parts.

Q: Does the tolerance difference between ±2.05% and ±2% affect circuit design?

A: Tolerance differences do not affect circuit design when the application is designed to accommodate the specified tolerance range of the primary part. The tighter tolerance of substitute parts provides additional margin but does not introduce incompatibility.

Q: Are there any compliance or certification differences between the three parts?

A: The BZX584B3V9HE3-TP carries AEC-Q101 automotive qualification, whereas the primary part and BZX584B3V9 RSG do not list this certification. All three parts are RoHS3 compliant and REACH unaffected. Selection based on certification requirements depends on application-specific standards.

Q: Can these parts be intermixed in production?

A: Yes, provided that design specifications and assembly procedures accommodate the packaging format differences. Tape & Reel and Cut Tape formats require different feeder configurations on automated assembly equipment but produce identical solder joint quality and electrical performance.

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