BZX584B3V3-TP Equivalent & Substitute Parts

Part Overview

The BZX584B3V3-TP is a surface mount Zener diode manufactured by Micro Commercial Co, rated at 3.3 V nominal with 150 mW maximum power dissipation. This component is classified as Active and is ROHS3 compliant. Substitute parts are identified when equivalent electrical performance and mechanical compatibility are required due to inventory constraints, supply chain considerations, or design flexibility needs.

Key Parameters

Parameter	Value	Unit
Voltage - Zener (Nom)	3.3	V
Power - Max	150	mW
Tolerance	±2.12%	%
Impedance (Max)	95	Ohms
Current - Reverse Leakage @ Vr	5	µA @ 1 V
Voltage - Forward (Vf) (Max) @ If	900	mV @ 10 mA
Operating Temperature Range	-55 to 150	°C (TJ)
Mounting Type	Surface Mount	—
Package / Case	SC-79, SOD-523	—
RoHS Status	ROHS3 Compliant	—
Moisture Sensitivity Level	1 (Unlimited)	—

Substitute Part Grouping Explanation

Substitution of the BZX584B3V3-TP is permissible when the replacement component maintains the following critical electrical and mechanical parameters:

Electrical Equivalence Criteria:

Zener voltage: 3.3 V nominal
Maximum power dissipation: 150 mW
Impedance (Max): 95 Ohms
Reverse leakage current: 5 µA @ 1 V
Forward voltage: 900 mV @ 10 mA (Max)
Operating temperature range: -55°C to 150°C (TJ)

Mechanical Compatibility Criteria:

Mounting type: Surface Mount
Package designation: SOD-523 or equivalent footprint (SC-79)

Compliance Requirements:

RoHS3 compliance
Moisture Sensitivity Level: 1 (Unlimited)

The BZX584B3V3 RSG from Taiwan Semiconductor Corporation satisfies all specified parameters and is classified as a parametric equivalent.

Parameter Comparison

Parameter	BZX584B3V3-TP (Micro Commercial Co)	BZX584B3V3 RSG (Taiwan Semiconductor)	Match Status
Voltage - Zener (Nom)	3.3 V	3.3 V	Equivalent
Power - Max	150 mW	150 mW	Equivalent
Tolerance	±2.12%	±2%	Compatible
Impedance (Max)	95 Ohms	95 Ohms	Equivalent
Current - Reverse Leakage @ Vr	5 µA @ 1 V	5 µA @ 1 V	Equivalent
Voltage - Forward (Vf) (Max) @ If	900 mV @ 10 mA	900 mV @ 10 mA	Equivalent
Operating Temperature Range	-55°C to 150°C (TJ)	-55°C to 150°C (TJ)	Equivalent
Mounting Type	Surface Mount	Surface Mount	Equivalent
Package / Case	SC-79, SOD-523	SC-79, SOD-523	Equivalent
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	Equivalent
Moisture Sensitivity Level	1 (Unlimited)	1 (Unlimited)	Equivalent

Engineering Selection Recommendations

The BZX584B3V3 RSG manufactured by Taiwan Semiconductor Corporation is a direct parametric equivalent to the BZX584B3V3-TP. Both components are Active products with ROHS3 compliance and identical electrical specifications across all critical parameters. The tolerance specification of the substitute (±2%) is tighter than the main part (±2.12%), providing equivalent or superior performance in voltage regulation applications.

Selection between these components should be based on availability, packaging format preference (Tape & Reel versus Cut Tape & Digi-Reel), and supply chain requirements. Both components are suitable for applications requiring 3.3 V Zener regulation in surface mount SOD-523 packages with 150 mW power handling capability.

Frequently Asked Questions (FAQ)

Q: Can the BZX584B3V3 RSG be used as a direct replacement for the BZX584B3V3-TP?

A: Yes. Both components share identical electrical specifications including Zener voltage (3.3 V), maximum power dissipation (150 mW), impedance (95 Ohms), reverse leakage current (5 µA @ 1 V), forward voltage (900 mV @ 10 mA), and operating temperature range (-55°C to 150°C). Both are surface mount devices in SOD-523 packages with ROHS3 compliance and MSL 1 rating.

Q: Are there differences in tolerance specifications between these parts?

A: The BZX584B3V3-TP specifies ±2.12% tolerance, while the BZX584B3V3 RSG specifies ±2% tolerance. The substitute part has a tighter tolerance specification, which is compatible with applications designed for the main part.

Q: What is the difference between Tape & Reel and Cut Tape & Digi-Reel packaging?

A: Tape & Reel (TR) packaging supplies components on continuous carrier tape wound on reels, suitable for high-volume automated assembly. Cut Tape (CT) & Digi-Reel packaging provides the same components in shorter tape segments or alternative reel formats, suitable for lower-volume or mixed-component assembly operations. Both formats contain identical components.

Q: Are both parts suitable for the same PCB assembly process?

A: Yes. Both components are surface mount devices in SOD-523 packages with identical footprints (SC-79). They are compatible with standard surface mount assembly equipment and reflow soldering processes.

Q: Do both parts meet the same regulatory and compliance standards?

A: Yes. Both the BZX584B3V3-TP and BZX584B3V3 RSG are ROHS3 compliant, REACH unaffected, and classified under ECCN EAR99 with identical HTSUS coding (8541.10.0050). Both have Moisture Sensitivity Level 1 (Unlimited).

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