BZX584B39 Equivalent & Substitute Parts

Part Overview

The BZX584B39 is an active-status Zener diode manufactured by Taiwan Semiconductor Corporation, designed for surface mount applications in the SOD-523F package. This component provides voltage regulation and transient protection in electronic circuits. The part is specified for 39 V nominal Zener voltage with 150 mW maximum power dissipation and ±2% tolerance. Substitute parts are identified to provide equivalent electrical and mechanical performance for applications requiring alternative packaging configurations or inventory availability.

Substiute Parts

BZX584B39

Taiwan Semiconductor CorporationIn Stock: 1037BZX584B39 Datasheet

Current PartRFQ

BZX584B39 RSG

Taiwan Semiconductor CorporationIn Stock: 9179BZX584B39 RSG Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the BZX584B39 is determined by electrical parameter equivalence and mechanical compatibility. The substitute part BZX584B39 RSG maintains identical electrical specifications across all critical parameters: 39 V nominal Zener voltage, ±2% tolerance, 150 mW maximum power, 130 Ohms maximum impedance, 100 nA reverse leakage current at 27.3 V, and 900 mV forward voltage at 10 mA. Both parts operate across the same temperature range (-55°C to 150°C junction temperature) and utilize the identical SOD-523F package with SC-79 case designation.

The primary distinction between the main part and substitute is the packaging configuration: the BZX584B39 is supplied in Tape & Reel (TR) format, while the BZX584B39 RSG is supplied in Cut Tape (CT) and Digi-Reel® format. Both configurations are compatible with standard surface mount assembly processes. Compliance certifications remain equivalent, with both parts meeting ROHS3 requirements and REACH Unaffected status.

Parameter Comparison

Engineering Selection Recommendations

Both the BZX584B39 and BZX584B39 RSG are active-status components from Taiwan Semiconductor Corporation with full ROHS3 compliance and REACH Unaffected designation. Selection between these parts is based on packaging and supply chain requirements rather than electrical performance.

The BZX584B39 in Tape & Reel format is suitable for high-volume automated assembly operations where continuous reel feeding is standard. The BZX584B39 RSG in Cut Tape and Digi-Reel® format accommodates lower-volume production runs, manual assembly processes, or applications requiring smaller quantity increments. Both parts are electrically and mechanically interchangeable within the SOD-523F package footprint.

Compliance certifications are equivalent across both variants. No additional qualification or testing is required when transitioning between these packaging configurations, provided the assembly process is compatible with the selected format.

Frequently Asked Questions (FAQ)

Q: Are the BZX584B39 and BZX584B39 RSG electrically identical?

A: Yes. Both parts are specified with identical electrical parameters: 39 V nominal Zener voltage, ±2% tolerance, 150 mW maximum power dissipation, 130 Ohms maximum impedance, 100 nA reverse leakage current at 27.3 V, and 900 mV forward voltage at 10 mA. Operating temperature range is -55°C to 150°C for both variants.

Q: What is the difference between Tape & Reel and Cut Tape packaging?

A: Tape & Reel (TR) packaging supplies components on a continuous reel suitable for automated pick-and-place assembly. Cut Tape (CT) and Digi-Reel® packaging provides components in smaller tape segments or alternative reel formats, accommodating lower-volume production or manual assembly processes. Both formats use the same SOD-523F package and are compatible with standard surface mount assembly equipment.

Q: Can I substitute BZX584B39 RSG for BZX584B39 in my circuit design?

A: Yes. The BZX584B39 RSG is a direct substitute for the BZX584B39. All electrical specifications, mechanical dimensions, and compliance certifications are identical. The only difference is the packaging format.

Q: Are both parts RoHS compliant?

A: Yes. Both the BZX584B39 and BZX584B39 RSG are ROHS3 compliant and REACH Unaffected, meeting current environmental and regulatory requirements.

Q: What is the SOD-523F package?

A: SOD-523F is a surface mount package designation for small signal diodes. The SC-79 case style defines the physical dimensions and lead configuration. This package is standard for miniature Zener diodes in high-density circuit applications.

Q: Does packaging format affect circuit performance?

A: No. Packaging format affects only supply chain logistics and assembly process compatibility. Electrical performance and reliability are identical between Tape & Reel and Cut Tape formats of the same component.