BZX584B33 Equivalent & Substitute Parts

Part Overview

The BZX584B33 is an active-status Zener diode manufactured by Taiwan Semiconductor Corporation, designed for surface mount applications in the SOD-523F package. This component provides voltage regulation and transient protection in electronic circuits. The part is specified for 33 V nominal Zener voltage with 150 mW maximum power dissipation and ±2% tolerance. Substitute parts are identified to address packaging format variations and inventory availability while maintaining identical electrical and mechanical specifications.

Substiute Parts

BZX584B33

Taiwan Semiconductor CorporationIn Stock: 1128BZX584B33 Datasheet

Current PartRFQ

BZX584B33 RSG

Taiwan Semiconductor CorporationIn Stock: 9086BZX584B33 RSG Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the BZX584B33 is determined by equivalence across the following critical parameters:

• Voltage - Zener (Nom) (Vz): 33 V
• Tolerance: ±2%
• Power - Max: 150 mW
• Impedance (Max) (Zzt): 80 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 23.1 V
• Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
• Operating Temperature Range: -55°C ~ 150°C (TJ)
• Package / Case: SC-79, SOD-523
• Mounting Type: Surface Mount

The identified substitute part BZX584B33 RSG differs only in packaging format (Cut Tape & Digi-Reel® versus Tape & Reel) and moisture sensitivity level specification. All electrical characteristics, thermal performance, and mechanical dimensions remain identical. Both parts are manufactured by Taiwan Semiconductor Corporation and maintain active product status with full regulatory compliance.

Parameter Comparison

Engineering Selection Recommendations

Both BZX584B33 and BZX584B33 RSG are active-status components manufactured by Taiwan Semiconductor Corporation with identical electrical and thermal specifications. Selection between these parts is determined by packaging and supply chain requirements rather than functional performance.

BZX584B33 (Tape & Reel): Suitable for high-volume automated assembly operations requiring continuous reel-fed component delivery.

BZX584B33 RSG (Cut Tape & Digi-Reel®): Suitable for mixed-volume production, prototyping, and applications requiring flexible packaging formats. This variant includes specified Moisture Sensitivity Level (MSL) rating of 1 (Unlimited), indicating no moisture sensitivity constraints during storage and handling.

Both parts maintain ROHS3 compliance and REACH Unaffected status, satisfying regulatory requirements for industrial and commercial applications. The SOD-523F package provides compact form factor suitable for space-constrained surface mount designs with operating temperature range of -55°C to 150°C (TJ).

Frequently Asked Questions (FAQ)

Q: Can BZX584B33 RSG be used as a direct replacement for BZX584B33?

A: Yes. Both parts are electrically and mechanically identical. The difference is packaging format: BZX584B33 uses Tape & Reel (TR) packaging, while BZX584B33 RSG uses Cut Tape (CT) & Digi-Reel® packaging. Direct substitution is valid for circuit design and performance.

Q: What is the difference between Tape & Reel and Cut Tape packaging?

A: Tape & Reel (TR) packaging delivers components on continuous reels suitable for high-speed automated pick-and-place assembly. Cut Tape (CT) & Digi-Reel® packaging provides components in tape segments or alternative reel formats, offering flexibility for lower-volume production and manual assembly operations.

Q: Are there moisture sensitivity differences between the two parts?

A: BZX584B33 RSG specifies Moisture Sensitivity Level (MSL) 1 (Unlimited), indicating no moisture-related storage or handling restrictions. The main part BZX584B33 does not include MSL specification in the provided data. Both parts are suitable for standard industrial storage and handling conditions.

Q: Do both parts meet regulatory compliance requirements?

A: Yes. Both BZX584B33 and BZX584B33 RSG are ROHS3 Compliant and REACH Unaffected, satisfying regulatory requirements for industrial, commercial, and consumer applications.

Q: What is the operating temperature range for these Zener diodes?

A: Both parts operate across -55°C to 150°C junction temperature (TJ) range, suitable for industrial and extended-temperature applications.

Q: Can these parts be used interchangeably in PCB assembly?

A: Yes. Both parts use identical SOD-523F package (SC-79, SOD-523) with surface mount configuration. PCB footprints, solder reflow profiles, and assembly processes are identical. Selection depends on component supply format and production volume requirements.