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BZX55F10-TAP Equivalent & Substitute Parts
Part Overview
The BZX55F10-TAP is a 10 V, 500 mW Zener diode manufactured by Vishay General Semiconductor - Diodes Division in a through-hole DO-35 package. This component is classified as obsolete, though 1112 pieces remain in stock as new original inventory. The part meets automotive-grade specifications with AEC-Q101 qualification and maintains ROHS3 compliance.
Due to the obsolete product status, equivalent and substitute parts are necessary for ongoing design support, production continuity, and long-term component availability. Active alternatives with identical or compatible electrical characteristics are available from multiple manufacturers.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - Zener (Nom) | 10 | V |
| Tolerance | ±1% | - |
| Power - Max | 500 | mW |
| Impedance (Max) | 15 | Ohms |
| Current - Reverse Leakage @ Vr | 100 nA @ 7.5 V | - |
| Voltage - Forward (Vf) (Max) @ If | 1.5 V @ 200 mA | - |
| Operating Temperature | 175 | °C |
| Mounting Type | Through Hole | - |
| Package / Case | DO-204AH, DO-35, Axial | - |
| Grade | Automotive | - |
| Qualification | AEC-Q101 | - |
| RoHS Status | ROHS3 Compliant | - |
Substitute Part Grouping Explanation
Substitution of the BZX55F10-TAP is determined by the following critical parameters:
Primary Matching Criteria:
- Zener voltage: 10 V nominal
- Power dissipation: 500 mW maximum
- Package type: DO-35 through-hole axial configuration
- Mounting: Through-hole compatible
Secondary Compatibility Factors:
- Voltage tolerance (±1% preferred, ±2% to ±5% acceptable with design margin verification)
- Impedance characteristics (15–20 Ohms acceptable range)
- Reverse leakage current (100 nA to 200 nA @ specified voltage)
- Forward voltage drop (0.9 V to 1.5 V @ 200 mA or 10 mA)
- Operating temperature range (-65°C to 175°C minimum)
Compliance Considerations:
- RoHS3 compliance preferred for new designs
- AEC-Q101 automotive qualification for grade-critical applications
- REACH compliance status
Substitute parts are grouped into two categories: direct equivalents (matching tolerance and impedance) and functional alternatives (meeting electrical performance within acceptable design margins).
Parameter Comparison
| Part Number | Manufacturer | Vz (V) | Tolerance | Power (mW) | Zzt (Ohms) | Vf @ If | Temp Range (°C) | Status | RoHS |
|---|---|---|---|---|---|---|---|---|---|
| BZX55F10-TAP | Vishay | 10 | ±1% | 500 | 15 | 1.5 V @ 200 mA | -65 to 175 | Obsolete | ROHS3 |
| BZX55B10-TAP | Vishay | 10 | ±2% | 500 | 15 | 1.5 V @ 200 mA | -65 to 175 | Active | ROHS3 |
| 1N4104 TR PBFREE | Central Semiconductor | 10 | ±5% | 250 | 200 | 1.1 V @ 200 mA | -65 to 200 | Active | ROHS3 |
| 1N5240BTR | Fairchild Semiconductor | 10 | ±5% | 500 | 17 | 1.2 V @ 200 mA | -65 to 200 | Active | Not specified |
| 1N5736B | Microchip Technology | 10 | ±5% | 500 | 20 | 0.9 V @ 10 mA | -65 to 175 | Active | Non-compliant |
| 1N5736D | Microchip Technology | 10 | ±1% | 500 | 20 | 0.9 V @ 10 mA | -65 to 175 | Active | Non-compliant |
| 1N6000B | Microchip Technology | 10 | ±5% | 500 | 15 | 1.1 V @ 200 mA | -65 to 175 | Active | Non-compliant |
| 1N758A BK PBFREE | Central Semiconductor | 10 | ±5% | 500 | 17 | 1.5 V @ 200 mA | -65 to 200 | Active | ROHS3 |
| 1N758A TR TIN/LEAD | Central Semiconductor | 10 | ±5% | 500 | 17 | 1.5 V @ 200 mA | -65 to 200 | Active | Non-compliant |
| BZX79C10-T50A | onsemi | 10 | ±5% | 500 | 20 | 1.5 V @ 100 mA | -65 to 200 | Active | ROHS3 |
Engineering Selection Recommendations
Tier 1 - Direct Replacement (Preferred):
BZX55B10-TAP is the primary substitute for BZX55F10-TAP. Both parts are manufactured by Vishay, share identical electrical performance (10 V, 500 mW, DO-35), and maintain ROHS3 compliance. The tolerance difference (±2% versus ±1%) is acceptable for most applications. BZX55B10-TAP is active with 33,996 pieces in stock, ensuring long-term availability.
Tier 2 - Functional Equivalents (Active Status, Full Power Rating):
1N5240BTR (Fairchild Semiconductor), 1N758A BK PBFREE (Central Semiconductor), and BZX79C10-T50A (onsemi) all deliver 10 V, 500 mW performance in DO-35 packages with active product status. These parts accommodate ±5% tolerance and extended operating temperature ranges (-65°C to 200°C). 1N758A BK PBFREE and BZX79C10-T50A maintain ROHS3 compliance.
Tier 3 - Functional Alternatives (Reduced Power or Tolerance Trade-offs):
1N5736D (Microchip Technology) matches the ±1% tolerance of the original part with 500 mW power rating but carries RoHS non-compliance status. 1N6000B (Microchip Technology) provides identical impedance (15 Ohms) to the original but with ±5% tolerance and RoHS non-compliance. 1N4104 TR PBFREE (Central Semiconductor) operates at reduced power (250 mW) and is suitable only for applications with lower power dissipation requirements.
Compliance Considerations:
For new designs requiring RoHS3 compliance, select from: BZX55B10-TAP, 1N758A BK PBFREE, BZX79C10-T50A, or 1N4104 TR PBFREE. For automotive-grade applications, BZX55B10-TAP maintains AEC-Q101 qualification. Parts with RoHS non-compliance status (1N5736B, 1N5736D, 1N6000B, 1N758A TR TIN/LEAD) are suitable for legacy designs or applications where RoHS exemptions apply.
Frequently Asked Questions (FAQ)
Q: Can BZX55B10-TAP directly replace BZX55F10-TAP?
A: Yes. BZX55B10-TAP is a direct substitute. Both parts share the same manufacturer (Vishay), identical electrical specifications (10 V, 500 mW, DO-35), and equivalent impedance (15 Ohms). The tolerance difference (±2% versus ±1%) does not prevent substitution in standard applications. BZX55B10-TAP is active with substantial inventory availability.
Q: What is the difference between ±1% and ±5% tolerance specifications?
A: Tolerance defines the acceptable deviation from the nominal 10 V zener voltage. ±1% tolerance allows ±0.1 V deviation (9.9 V to 10.1 V), while ±5% tolerance allows ±0.5 V deviation (9.5 V to 10.5 V). Applications requiring precise voltage regulation benefit from ±1% parts. Applications with wider design margins accept ±5% alternatives.
Q: Are all substitute parts available in the same DO-35 package?
A: Yes. All listed substitute parts are packaged in DO-35 (DO-204AH) through-hole axial configuration, ensuring mechanical and electrical compatibility with existing PCB layouts and mounting methods.
Q: Which substitute parts maintain RoHS3 compliance?
A: BZX55B10-TAP, 1N4104 TR PBFREE, 1N758A BK PBFREE, and BZX79C10-T50A are ROHS3 compliant. These parts are suitable for applications subject to RoHS regulations. Parts marked as RoHS non-compliant (1N5736B, 1N5736D, 1N6000B, 1N758A TR TIN/LEAD) are restricted to legacy designs or applications with documented RoHS exemptions.
Q: What is the significance of impedance (Zzt) differences?
A: Impedance affects the dynamic resistance of the zener diode during regulation. The original part specifies 15 Ohms maximum. Substitute parts range from 15 to 20 Ohms. Higher impedance results in slightly greater voltage variation under load changes. For applications with stringent voltage regulation requirements, select substitutes with impedance closest to 15 Ohms (BZX55B10-TAP, 1N6000B).
Q: Can 1N4104 TR PBFREE replace BZX55F10-TAP?
A: 1N4104 TR PBFREE is a functional alternative only for applications with reduced power dissipation requirements. This part is rated at 250 mW maximum, half the original 500 mW specification. Use this substitute only when circuit design confirms power dissipation does not exceed 250 mW.
Q: What is the impact of operating temperature range differences?
A: The original part operates to 175°C maximum. Several substitutes extend to 200°C (1N4104 TR PBFREE, 1N5240BTR, 1N758A variants, BZX79C10-T50A). Extended temperature range provides design margin for high-temperature environments but does not affect performance in standard operating conditions (-65°C to 175°C).
Q: Are Microchip 1N5736 series parts suitable for new designs?
A: 1N5736D and 1N5736B are active parts with matching electrical specifications but carry RoHS non-compliance status. These parts are suitable for legacy design support or applications with documented RoHS exemptions. For new designs, prioritize ROHS3-compliant alternatives.
Q: What is the difference between cut tape (CT) and bulk packaging?
A: Cut tape (CT) packaging provides components on continuous tape suitable for automated pick-and-place assembly. Bulk packaging supplies loose components. Both packaging formats are mechanically and electrically identical. Selection depends on assembly process requirements and inventory management practices.
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