BZX284-C16,115 Equivalent & Substitute Parts

Part Overview

The BZX284-C16,115 is a Zener diode rated at 16 V nominal voltage with 400 mW maximum power dissipation, manufactured by NXP USA Inc. in SOD-110 surface mount package. This component is classified as obsolete, necessitating identification of active equivalent parts for new designs and ongoing production requirements. The part maintains ROHS3 compliance and unlimited moisture sensitivity rating (MSL 1), making it suitable for industrial and commercial applications across the specified operating temperature range of -65°C to 150°C.

Substiute Parts

BZX284-C16,115

NXP USA Inc.In Stock: 741BZX284-C16,115 Datasheet

Current PartRFQ

BZX384-B16,115

Nexperia USA Inc.In Stock: 95401BZX384-B16,115 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the BZX284-C16,115 is determined by the following critical electrical and mechanical parameters:

Electrical Compatibility Criteria:

• Zener voltage (Nom): 16 V (exact match required)
• Reverse leakage current: 50 nA @ 11.2 V (matching specification)
• Forward voltage: 1.1 V @ 100 mA (matching specification)
• Operating temperature range: -65°C to 150°C (minimum coverage required)

Mechanical Compatibility Criteria:

• Surface mount technology (required)
• Package compatibility with circuit board layout

Regulatory Compliance:

• ROHS3 compliance (mandatory for equivalent parts)
• REACH unaffected status (maintained across substitutes)

The BZX384-B16,115 qualifies as a functional equivalent based on matching zener voltage, reverse leakage current, forward voltage characteristics, and operating temperature range. Differences in power rating, impedance, tolerance, and package form factor are noted in the parameter comparison table below.

Parameter Comparison

Engineering Selection Recommendations

The BZX384-B16,115 is an active equivalent for the obsolete BZX284-C16,115 based on matching electrical performance in zener voltage, reverse leakage current, and forward voltage characteristics across the identical operating temperature range. Both parts maintain ROHS3 compliance and REACH unaffected status.

Selection Considerations:

The substitute part exhibits a lower maximum power dissipation rating (300 mW versus 400 mW). Circuit designs must confirm that thermal requirements do not exceed 300 mW under worst-case operating conditions. The substitute also features higher impedance (40 Ohms versus 20 Ohms) and tighter voltage tolerance (±2% versus ±5%), which may affect circuit performance in applications sensitive to impedance or voltage regulation precision.

The package transition from SOD-110 to SOD-323 requires physical board layout modification. The SOD-323 package is smaller and uses different pin spacing, necessitating PCB redesign for footprint compatibility.

The BZX384-B16,115 is currently in active production status with substantial inventory availability (95,378 pieces), ensuring supply chain continuity for new designs and production runs.

Frequently Asked Questions (FAQ)

Q: Can the BZX384-B16,115 directly replace the BZX284-C16,115 without circuit modification?

A: Electrical substitution is valid based on matching zener voltage (16 V), reverse leakage current (50 nA @ 11.2 V), and forward voltage (1.1 V @ 100 mA). However, physical board layout modification is required due to package change from SOD-110 to SOD-323. Thermal design review is necessary to confirm that circuit power dissipation does not exceed the substitute's 300 mW maximum rating.

Q: What is the impact of the impedance difference between these parts?

A: The BZX384-B16,115 has maximum impedance of 40 Ohms compared to 20 Ohms for the BZX284-C16,115. Higher impedance affects voltage regulation characteristics and transient response. Applications requiring precise voltage regulation or fast transient suppression should evaluate circuit performance with the higher impedance value.

Q: Does the tighter tolerance of the substitute part affect compatibility?

A: The BZX384-B16,115 features ±2% tolerance versus ±5% for the main part. Tighter tolerance represents improved specification and does not create compatibility issues. Circuits designed for ±5% tolerance will operate within specification with the ±2% substitute.

Q: What are the package footprint differences?

A: The BZX284-C16,115 uses SOD-110 package while the BZX384-B16,115 uses SOD-323 (SC-76) package. SOD-323 is a smaller package with different pin spacing and orientation. PCB footprint redesign is required for physical compatibility.

Q: Are there regulatory or compliance differences between these parts?

A: Both parts maintain ROHS3 compliance and REACH unaffected status. No regulatory barriers exist for substitution from a compliance perspective.

Q: What is the availability status of each part?

A: The BZX284-C16,115 is classified as obsolete with 637 pieces in current inventory. The BZX384-B16,115 is active production status with 95,378 pieces available, ensuring long-term supply continuity.