BZV55C33-TP Equivalent & Substitute Parts

Part Overview

The BZV55C33-TP is a 33 V, 500 mW Zener diode manufactured by Micro Commercial Co in a Surface Mount Mini MELF package (DO-213AC). This component is classified as obsolete, necessitating identification of equivalent and substitute parts for ongoing design requirements and procurement needs. Substitute parts must maintain the core electrical specifications while accommodating available packaging and manufacturer options.

Key Parameters

Parameter	Value
Voltage - Zener (Nom) (Vz)	33 V
Power - Max	500 mW
Tolerance	±6%
Impedance (Max) (Zzt)	80 Ohms
Current - Reverse Leakage @ Vr	100 nA @ 24 V
Mounting Type	Surface Mount
Package / Case	DO-213AC, MINI-MELF, SOD-80
Operating Temperature Range	-55°C ~ 150°C
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the BZV55C33-TP is determined by the following critical parameters:

Primary Electrical Criteria:

Zener voltage: 33 V nominal
Maximum power dissipation: 500 mW or greater
Voltage tolerance: ±6% or tighter
Impedance (Max): 80 Ohms
Reverse leakage current: 100 nA or lower at specified voltage

Secondary Criteria:

Surface Mount mounting type
Operating temperature range compatibility
RoHS3 compliance status
Package compatibility (DO-213AC/Mini MELF preferred; SOD-123 acceptable with power derating)

Substitute parts are grouped into two categories:

Category 1 - Direct Equivalents (500 mW, Mini MELF Package): Parts maintaining identical power rating and preferred package form factor. These include NXP Semiconductors BZV55-C33,115 and BZV55-C33,135, which offer improved specifications (±5% tolerance, lower reverse leakage) and extended temperature range.

Category 2 - Functional Substitutes (Reduced Power Rating): The BZT52C33-TP operates at 200 mW maximum power, requiring circuit-level power dissipation verification. This part is suitable only where thermal design accommodates the reduced power rating.

Category 3 - Alternative Packaging: The Microchip Technology BZV55C33 in DO-213AA package provides electrical equivalence with different mechanical form factor.

Parameter Comparison

Parameter	BZV55C33-TP (Main)	BZV55-C33,115 (NXP)	BZV55-C33,135 (Nexperia)	BZT52C33-TP (MCC)	BZV55C33 (Microchip)
Voltage - Zener (Nom)	33 V	33 V	33 V	33 V	33 V
Power - Max	500 mW	500 mW	500 mW	200 mW	Not specified
Tolerance	±6%	±5%	±5%	±6%	±6%
Impedance (Max)	80 Ohms	80 Ohms	80 Ohms	80 Ohms	Not specified
Current - Reverse Leakage @ Vr	100 nA @ 24 V	50 nA @ 23.1 V	50 nA @ 23.1 V	100 nA @ 23.1 V	50 nA @ 23.1 V
Operating Temperature Range	-55°C ~ 150°C	-65°C ~ 200°C	-65°C ~ 200°C	-65°C ~ 150°C	-65°C ~ 175°C
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Package / Case	DO-213AC, MINI-MELF, SOD-80	DO-213AC, MINI-MELF, SOD-80	DO-213AC, MINI-MELF, SOD-80	SOD-123	DO-213AA
RoHS Status	ROHS3 Compliant	Not specified	ROHS3 Compliant	ROHS3 Compliant	RoHS non-compliant
Product Status	Obsolete	Active	Active	Active	Active

Engineering Selection Recommendations

Preferred Substitutes (Direct Replacement):

BZV55-C33,115 (NXP Semiconductors) and BZV55-C33,135 (Nexperia USA Inc.) are the primary recommended substitutes. Both parts maintain the 33 V nominal voltage, 500 mW power rating, and Mini MELF package form factor. These parts offer superior specifications including ±5% tolerance (versus ±6%), lower reverse leakage current (50 nA versus 100 nA), and extended operating temperature range (-65°C to 200°C versus -55°C to 150°C). Both are ROHS3 compliant and currently in active production status with substantial inventory availability.

Alternative Substitute (Power Derating Required):

BZT52C33-TP (Micro Commercial Co) provides electrical equivalence at 33 V with ±6% tolerance and 80 Ohms impedance. However, the maximum power rating is 200 mW, requiring circuit-level thermal analysis to confirm suitability. This part is appropriate only where design power dissipation does not exceed 200 mW. The part is ROHS3 compliant and in active production.

Secondary Alternative (Package Variation):

BZV55C33 (Microchip Technology) in DO-213AA package provides 33 V nominal voltage with ±6% tolerance. This part is not ROHS3 compliant and lacks specified power rating and impedance parameters. Selection of this part requires confirmation of compliance requirements and thermal design compatibility.

Compliance Consideration:

For applications requiring ROHS3 compliance, BZV55-C33,115, BZV55-C33,135, and BZT52C33-TP are suitable. The Microchip Technology BZV55C33 is RoHS non-compliant and should not be selected for regulated applications.

Frequently Asked Questions (FAQ)

Q: Can BZT52C33-TP replace BZV55C33-TP in all applications?

A: BZT52C33-TP is electrically equivalent at 33 V with matching tolerance and impedance specifications. However, the maximum power rating is 200 mW versus 500 mW. Substitution is valid only where circuit design ensures power dissipation does not exceed 200 mW. Thermal analysis of the specific application is required before selection.

Q: What is the difference between BZV55-C33,115 and BZV55-C33,135?

A: Both parts are manufactured by NXP/Nexperia with identical electrical specifications: 33 V nominal voltage, 500 mW power rating, ±5% tolerance, 80 Ohms impedance, and Mini MELF package. The primary difference is packaging format: BZV55-C33,115 is supplied in standard packaging, while BZV55-C33,135 is supplied in Tape & Reel (TR) format. Electrical performance and compatibility are identical.

Q: Are the NXP parts pin-compatible with the original BZV55C33-TP?

A: Yes. BZV55-C33,115 and BZV55-C33,135 are supplied in DO-213AC Mini MELF package, identical to the original BZV55C33-TP. Pin configuration and mechanical dimensions are compatible for direct board-level substitution.

Q: Does the extended temperature range of NXP parts affect compatibility?

A: No. The extended operating temperature range (-65°C to 200°C for NXP parts versus -55°C to 150°C for the original) represents an improvement. Applications operating within the original temperature range are fully compatible. Applications requiring extended temperature operation benefit from the NXP alternatives.

Q: Why is the Microchip BZV55C33 not recommended as a primary substitute?

A: The Microchip part is RoHS non-compliant, which disqualifies it for regulated applications. Additionally, critical parameters including maximum power rating and impedance are not specified in available documentation, preventing complete electrical verification. The NXP and Nexperia alternatives provide superior specification documentation and compliance status.

Q: Can BZV55C33 in DO-213AA package be used instead of Mini MELF?

A: DO-213AA and Mini MELF (DO-213AC) are different package forms with different mechanical dimensions and land patterns. Direct substitution on existing PCBs is not possible without board redesign. Selection of DO-213AA requires PCB layout modification and re-qualification.

Q: What inventory status should influence part selection?

A: All recommended substitutes (BZV55-C33,115, BZV55-C33,135, BZT52C33-TP) are in active production with substantial inventory availability (10,828 to 22,600 pieces). The original BZV55C33-TP is obsolete with limited remaining stock (1,021 pieces). For new designs and ongoing procurement, selection of active production parts is required.

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