BZV55C22-TP Equivalent & Substitute Parts

Part Overview

The BZV55C22-TP is a Zener diode rated at 22 V nominal voltage with 500 mW maximum power dissipation, manufactured by Micro Commercial Co in a Surface Mount Mini MELF package (DO-213AC). This component is classified as obsolete, necessitating identification of equivalent and substitute parts for ongoing design requirements and procurement needs. Substitute parts maintain the core electrical specifications while offering alternative packaging formats or active product status from current manufacturers.

Substiute Parts

BZV55C22-TP

Micro Commercial CoIn Stock: 952BZV55C22-TP Datasheet

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BZT52C22-TP

Micro Commercial CoIn Stock: 3646BZT52C22-TP Datasheet

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BZV55C22

Microchip TechnologyIn Stock: 942BZV55C22 Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the BZV55C22-TP is determined by the following critical parameters:

Electrical Equivalence Criteria:

• Zener voltage (Vz) must equal 22 V nominal
• Tolerance must be ±6%
• Impedance (Zzt) must not exceed 55 Ohms
• Reverse leakage current specifications must be compatible with circuit requirements
• Forward voltage characteristics must support intended application current levels

Mechanical & Packaging Criteria:

• Surface Mount mounting type is required
• Package format may differ (Mini MELF, SOD-123, or DO-213AA acceptable)
• Operating temperature range must encompass application requirements

Compliance & Status Criteria:

• RoHS3 compliance preferred for new designs
• Active product status recommended for long-term availability
• REACH and ECCN classifications must remain consistent

The substitute parts listed maintain electrical equivalence at the 22 V zener voltage specification while offering alternative package formats and current manufacturer availability.

Parameter Comparison

Engineering Selection Recommendations

BZT52C22-TP Selection Criteria:

The BZT52C22-TP is an active product from Micro Commercial Co with ROHS3 compliance. This substitute maintains the 22 V zener voltage and ±6% tolerance specification. The primary design consideration is the reduced maximum power rating of 200 mW compared to the 500 mW of the main part. Selection of this substitute is appropriate for applications where power dissipation does not exceed 200 mW. The SOD-123 package format differs from the Mini MELF package of the original part and requires PCB layout modification. Operating temperature range extends to -65°C, providing improved low-temperature performance. This substitute is recommended for new designs requiring active product status and RoHS3 compliance.

BZV55C22 (Microchip Technology) Selection Criteria:

The Microchip Technology BZV55C22 maintains the 22 V zener voltage and ±6% tolerance. This part is active and offers an extended operating temperature range to 175°C. The DO-213AA package format differs from the Mini MELF original. This substitute is RoHS non-compliant, limiting its use in applications with RoHS compliance requirements. The reverse leakage current specification of 50 nA at 15.4 V is superior to the main part specification. Maximum power dissipation is not specified in the provided data. This substitute is suitable for applications where RoHS compliance is not mandated and extended high-temperature operation is required.

Frequently Asked Questions (FAQ)

Q: Can the BZT52C22-TP directly replace the BZV55C22-TP in all applications?

A: The BZT52C22-TP maintains electrical equivalence at the 22 V zener voltage specification. However, the reduced maximum power rating of 200 mW versus 500 mW requires verification that circuit power dissipation does not exceed 200 mW. The SOD-123 package differs from the Mini MELF package, requiring PCB layout modification. Both parts maintain ±6% tolerance and 55 Ohm impedance specifications.

Q: What is the primary difference between the Mini MELF and SOD-123 packages?

A: Mini MELF (DO-213AC) and SOD-123 are distinct surface mount package formats with different physical dimensions and PCB footprints. Component selection between these packages requires PCB layout compatibility verification. Both packages are surface mount types suitable for automated assembly.

Q: Is the Microchip BZV55C22 suitable for RoHS-compliant applications?

A: No. The Microchip Technology BZV55C22 is classified as RoHS non-compliant. For applications requiring RoHS compliance, the BZT52C22-TP from Micro Commercial Co is ROHS3 compliant and is the appropriate selection.

Q: How do the operating temperature ranges compare?

A: The BZV55C22-TP operates from -55°C to 150°C. The BZT52C22-TP extends the lower limit to -65°C while maintaining 150°C upper limit. The Microchip BZV55C22 extends the upper limit to 175°C with a lower limit of -65°C. Application temperature requirements determine which substitute is appropriate.

Q: What is the significance of the reverse leakage current specification?

A: Reverse leakage current indicates the small current flowing through the zener diode when reverse biased below the zener voltage. Lower leakage current values indicate better diode quality and reduced power loss in standby conditions. The Microchip part specifies 50 nA at 15.4 V, superior to the main part specification of 100 nA at 16 V.

Q: Can I use the BZT52C22-TP in a circuit designed for 500 mW power dissipation?

A: No. The BZT52C22-TP is rated for maximum 200 mW power dissipation. Using this part in a circuit requiring 500 mW operation will exceed the component's power rating and result in device failure. Circuit power dissipation must be verified to remain below 200 mW for this substitute.

Q: Are all three parts surface mount components?

A: Yes. The BZV55C22-TP, BZT52C22-TP, and Microchip BZV55C22 are all surface mount zener diodes. Package formats differ (Mini MELF, SOD-123, and DO-213AA respectively), but all are suitable for automated PCB assembly processes.