BZV55C10-TP Equivalent & Substitute Parts

Part Overview

The BZV55C10-TP is a Zener diode rated at 10 V nominal voltage with 500 mW maximum power dissipation, manufactured by Micro Commercial Co in a Mini MELF surface mount package. This component is classified as obsolete, necessitating identification of active equivalent parts that maintain electrical and mechanical compatibility for ongoing production and repair applications. Substitute parts must satisfy identical or superior electrical specifications while accommodating available packaging options.

Key Parameters

Parameter	Value	Unit
Voltage - Zener (Nom)	10	V
Tolerance	±6%	-
Power - Max	500	mW
Impedance (Max)	15	Ohms
Current - Reverse Leakage @ Vr	100 nA @ 7.5 V	-
Voltage - Forward (Vf) (Max) @ If	1.5 V @ 200 mA	-
Operating Temperature Range	-55°C to 150°C	-
Mounting Type	Surface Mount	-
Package / Case	DO-213AC, MINI-MELF, SOD-80	-
RoHS Status	ROHS3 Compliant	-

Substitute Part Grouping Explanation

Substitution eligibility is determined by the following critical parameters:

Zener Voltage (Vz): Must equal 10 V nominal
Power Rating: Must equal or exceed 500 mW
Tolerance: ±6% or better (±5% acceptable)
Mounting Type: Surface mount only
Package Compatibility: DO-213AC, MINI-MELF, or SOD-80 packages
Regulatory Compliance: ROHS3 compliance required for new designs

All identified substitute parts maintain the 10 V zener voltage specification and 500 mW power rating. Substitutes are grouped by package type and manufacturer, with variations in impedance, reverse leakage current, and forward voltage characteristics noted. Temperature range extensions in substitute parts do not disqualify them from substitution, as they represent enhanced capability within the operating envelope of the original specification.

Parameter Comparison

Part Number	Manufacturer	Vz (Nom)	Tolerance	Power (Max)	Zzt (Max)	Reverse Leakage	Vf (Max) @ If	Temp Range	Package	Status
BZV55C10-TP	Micro Commercial Co	10 V	±6%	500 mW	15 Ω	100 nA @ 7.5 V	1.5 V @ 200 mA	-55°C to 150°C	Mini MELF	Obsolete
BZT52C10-TP	Micro Commercial Co	10 V	±6%	500 mW	20 Ω	200 nA @ 7 V	900 mV @ 10 mA	-65°C to 150°C	SOD-123	Active
BZV55-C10,115	Nexperia USA Inc.	10 V	±5%	500 mW	20 Ω	200 nA @ 7 V	900 mV @ 10 mA	-65°C to 200°C	Mini MELF	Active
BZV55-C10,135	NXP Semiconductors	10 V	±5%	500 mW	20 Ω	200 nA @ 7 V	900 mV @ 10 mA	-65°C to 200°C	Mini MELF	Active
BZV55C10	Microchip Technology	10 V	±6%	500 mW	-	200 nA @ 7 V	1.1 V @ 200 mA	-65°C to 175°C	DO-213AA	Active
CLL5240B BK PBFREE	Central Semiconductor Corp	10 V	±5%	500 mW	17 Ω	3 µA @ 8 V	1.25 V @ 200 mA	-65°C to 200°C	SOD-80	Active
CLL5240B TR PBFREE	Central Semiconductor Corp	10 V	±5%	500 mW	17 Ω	3 µA @ 8 V	1.25 V @ 200 mA	-65°C to 200°C	SOD-80	Active

Engineering Selection Recommendations

Primary Substitutes (Mini MELF Package Compatibility)

BZV55-C10,115 and BZV55-C10,135 are direct functional equivalents in the Mini MELF package format. Both parts are manufactured by Nexperia/NXP and maintain the identical package footprint as the original BZV55C10-TP. These parts feature improved tolerance (±5% versus ±6%), extended temperature range to 200°C, and active product status. Both are ROHS3 compliant and suitable for new designs.

Secondary Substitutes (Alternative Package Options)

BZT52C10-TP provides electrical equivalence in SOD-123 package format. This part is active and ROHS3 compliant but requires PCB layout modification due to different package geometry. The SOD-123 package is smaller than Mini MELF, enabling space optimization in constrained designs.

CLL5240B (both BK and TR variants) offers substitution in SOD-80 package format. These parts are ROHS3 compliant and active. The SOD-80 package is mechanically compatible with Mini MELF footprints. Higher reverse leakage current (3 µA versus 100 nA) may impact applications with stringent leakage requirements.

BZV55C10 (Microchip) provides substitution in DO-213AA package. This part is active but RoHS non-compliant, limiting use in new designs subject to RoHS regulations. The DO-213AA package differs from Mini MELF and requires layout verification.

Compliance Considerations

All recommended substitutes except BZV55C10 (Microchip) are ROHS3 compliant. For applications requiring regulatory compliance, select from Nexperia, NXP, or Central Semiconductor options. All substitute parts maintain REACH unaffected status and EAR99 export classification consistent with the original part.

Frequently Asked Questions (FAQ)

Q: Can BZT52C10-TP replace BZV55C10-TP directly on the PCB?

A: BZT52C10-TP is electrically equivalent but uses SOD-123 package instead of Mini MELF. Direct PCB substitution is not possible without layout modification. The SOD-123 package has different lead spacing and footprint dimensions.

Q: What is the difference between BZV55-C10,115 and BZV55-C10,135?

A: Both parts are functionally identical 10 V zener diodes in Mini MELF packages with ±5% tolerance. The suffix designations (,115 and ,135) indicate different packaging formats from Nexperia and NXP respectively. Electrical specifications are equivalent.

Q: Is the BZV55C10 from Microchip a suitable replacement?

A: BZV55C10 (Microchip) meets electrical requirements but uses DO-213AA package instead of Mini MELF, requiring PCB layout changes. Additionally, this part is RoHS non-compliant, making it unsuitable for new designs subject to RoHS regulations.

Q: Why do some substitutes have higher reverse leakage current?

A: CLL5240B parts specify 3 µA reverse leakage at 8 V, compared to 100 nA in the original BZV55C10-TP. This difference reflects manufacturing process variations between manufacturers. Applications sensitive to leakage current should verify compatibility with the higher specification.

Q: Can I use CLL5240B in place of BZV55C10-TP?

A: CLL5240B is electrically compatible with 10 V nominal voltage and 500 mW power rating. Both BK (bulk) and TR (tape & reel) variants are available. The SOD-80 package is mechanically compatible with Mini MELF footprints. Verify reverse leakage current tolerance for your specific application.

Q: What is the temperature range advantage of substitute parts?

A: BZV55-C10,115, BZV55-C10,135, CLL5240B variants, and BZT52C10-TP extend the upper operating temperature to 200°C compared to 150°C in the original BZV55C10-TP. This provides enhanced thermal margin in high-temperature applications without compromising performance at lower temperatures.

Q: Are all substitute parts RoHS compliant?

A: All substitute parts except BZV55C10 (Microchip) are ROHS3 compliant. For applications requiring RoHS certification, select from Nexperia, NXP, Micro Commercial Co, or Central Semiconductor options.

Q: What packaging options are available for 10 V 500 mW zener diodes?

A: Substitute parts are available in Mini MELF (BZV55-C10,115 and BZV55-C10,135), SOD-123 (BZT52C10-TP), SOD-80 (CLL5240B variants), and DO-213AA (BZV55C10 Microchip) packages. Select based on PCB layout requirements and available footprint space.

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