BZT52C36 Equivalent & Substitute Parts

Part Overview

The BZT52C36 is an active-status Zener diode manufactured by Taiwan Semiconductor Corporation, designed for voltage regulation and protection applications. This surface-mount component operates at a nominal Zener voltage of 36 V with a maximum power dissipation of 500 mW in the SOD-123F package. The part is RoHS3 compliant and REACH unaffected, making it suitable for modern electronic assemblies. Substitute parts are identified to provide design flexibility, supply chain alternatives, and equivalent functional performance across manufacturing batches and supplier inventories.

Substiute Parts

BZT52C36

Taiwan Semiconductor CorporationIn Stock: 26500BZT52C36 Datasheet

Current PartRFQ

BZT52C36 RHG

Taiwan Semiconductor CorporationIn Stock: 7225BZT52C36 RHG Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the BZT52C36 are identified based on strict electrical and mechanical parameter equivalence. The substitution criteria are:

• Zener Voltage (Nominal): 36 V
• Power Dissipation (Maximum): 500 mW
• Voltage Tolerance: ±5%
• Package / Case: SOD-123F
• Mounting Type: Surface Mount
• Impedance (Maximum): 90 Ohms
• Reverse Leakage Current @ Vr: 45 nA @ 25.2 V
• Forward Voltage (Maximum) @ If: 1 V @ 10 mA
• Operating Temperature Range: -65°C to 150°C (TJ)
• RoHS Compliance: ROHS3 Compliant
• REACH Status: REACH Unaffected

Parts meeting all these parameters are classified as parametric equivalents and direct substitutes. The BZT52C36 RHG variant from Taiwan Semiconductor Corporation satisfies all specified electrical and mechanical requirements.

Parameter Comparison

Engineering Selection Recommendations

Both the BZT52C36 and BZT52C36 RHG are active-status components from Taiwan Semiconductor Corporation with identical electrical specifications and mechanical packaging. Selection between these parts is based on inventory availability and supply chain requirements rather than functional differences.

The BZT52C36 maintains 26,400 pieces in current inventory, while the BZT52C36 RHG variant maintains 7,121 pieces. Both parts carry ROHS3 compliance and REACH unaffected status, confirming suitability for regulated manufacturing environments and end-use applications.

The SOD-123F surface-mount package ensures compatibility with automated assembly processes and high-density PCB layouts. The ±5% voltage tolerance and 90-ohm maximum impedance specification support precision voltage regulation circuits within the stated operating temperature range of -65°C to 150°C.

Frequently Asked Questions (FAQ)

Q: Can BZT52C36 RHG be used as a direct replacement for BZT52C36?

A: Yes. The BZT52C36 RHG is a parametric equivalent with identical electrical characteristics, including 36 V nominal Zener voltage, 500 mW maximum power dissipation, ±5% tolerance, and SOD-123F surface-mount packaging. Both parts meet the same compliance standards.

Q: What determines substitutability between these Zener diode parts?

A: Substitutability is determined by matching Zener voltage (36 V), power rating (500 mW), voltage tolerance (±5%), impedance (90 Ohms maximum), reverse leakage current (45 nA @ 25.2 V), forward voltage (1 V @ 10 mA), operating temperature range (-65°C to 150°C), and package type (SOD-123F surface mount).

Q: Are there any differences in moisture sensitivity or handling between these parts?

A: The BZT52C36 RHG specifies Moisture Sensitivity Level (MSL) 1 (Unlimited), indicating no moisture-related handling restrictions. The BZT52C36 does not specify MSL in the provided data. Both parts are supplied in Tape & Reel packaging suitable for automated assembly.

Q: Do both parts support the same operating temperature range?

A: Yes. Both the BZT52C36 and BZT52C36 RHG operate across -65°C to 150°C junction temperature (TJ), supporting applications requiring extended temperature performance.

Q: Are there any compliance or regulatory differences between these parts?

A: No. Both parts are ROHS3 compliant and REACH unaffected, meeting current regulatory requirements for electronic component manufacturing and end-use applications.