BZT52B13 Equivalent & Substitute Parts

Part Overview

The BZT52B13 is an active-status zener diode manufactured by Taiwan Semiconductor Corporation, designed for voltage regulation and protection applications in surface mount configurations. This component operates at a nominal zener voltage of 13 V with a maximum power dissipation of 500 mW in the SOD-123F package. The part is RoHS3 compliant and REACH unaffected, making it suitable for modern electronic assemblies. Substitute parts are identified when equivalent electrical and mechanical parameters are required due to inventory constraints, supply chain considerations, or design flexibility needs.

Substiute Parts

BZT52B13
Taiwan Semiconductor CorporationIn Stock: 30247BZT52B13 Datasheet
BZT52B13
Current Part
BZT52B13 RHG
Taiwan Semiconductor CorporationIn Stock: 6386BZT52B13 RHG Datasheet
BZT52B13 RHG
Parametric Equivalent

Key Parameters

Parameter Value Unit
Voltage - Zener (Nominal) 13 V
Tolerance ±2 %
Power - Maximum 500 mW
Impedance (Maximum) 30 Ohms
Current - Reverse Leakage @ 8 V 90 nA
Voltage - Forward (Maximum) @ 10 mA 1 V
Operating Temperature (Junction) 150 °C
Package / Case SOD-123F
Mounting Type Surface Mount

Substitute Part Grouping Explanation

Substitute parts for the BZT52B13 are identified based on strict electrical and mechanical parameter equivalence. The substitution criteria are:

  • Zener Voltage (Vz): Must be 13 V nominal
  • Tolerance: Must be ±2%
  • Maximum Power Dissipation: Must be 500 mW
  • Impedance (Zzt): Must be 30 Ohms maximum
  • Reverse Leakage Current: Must be 90 nA @ 8 V
  • Forward Voltage: Must be 1 V maximum @ 10 mA
  • Operating Temperature: Must support 150°C junction temperature
  • Package: Must be SOD-123F
  • Mounting Type: Must be Surface Mount

Parts meeting all these parameters are classified as parametric equivalents and are directly interchangeable in circuit applications without design modification.

Parameter Comparison

Parameter BZT52B13 BZT52B13 RHG Match
Manufacturer Taiwan Semiconductor Corporation Taiwan Semiconductor Corporation Yes
Category Diodes, Zener Diodes, Zener Yes
Voltage - Zener (Nom) 13 V 13 V Yes
Tolerance ±2% ±2% Yes
Power - Max 500 mW 500 mW Yes
Impedance (Max) 30 Ohms 30 Ohms Yes
Current - Reverse Leakage @ 8 V 90 nA 90 nA Yes
Voltage - Forward (Max) @ 10 mA 1 V 1 V Yes
Operating Temperature 150°C (TJ) 150°C (TJ) Yes
Package / Case SOD-123F SOD-123F Yes
Mounting Type Surface Mount Surface Mount Yes
RoHS Status ROHS3 Compliant ROHS3 Compliant Yes
REACH Status REACH Unaffected REACH Unaffected Yes

Engineering Selection Recommendations

The BZT52B13 RHG is a direct parametric equivalent to the BZT52B13. Both parts are manufactured by Taiwan Semiconductor Corporation and share identical electrical specifications, package configuration, and regulatory compliance status. Selection between these parts is based on availability and supply chain requirements rather than technical performance differences.

Both parts maintain active product status and full RoHS3 compliance with REACH unaffected designation, confirming suitability for current manufacturing standards. The SOD-123F surface mount package is consistent across both parts, ensuring compatibility with existing PCB layouts and assembly processes.

Frequently Asked Questions (FAQ)

Q: Can BZT52B13 RHG be used as a direct replacement for BZT52B13?

A: Yes. The BZT52B13 RHG meets all electrical and mechanical parameters of the BZT52B13, including zener voltage, power rating, impedance, leakage current, forward voltage, operating temperature, and package specification. No circuit design changes are required.

Q: Are there any differences in compliance or certifications between these parts?

A: No. Both parts carry identical RoHS3 compliance and REACH unaffected status, confirming equivalent regulatory standing for use in regulated applications.

Q: What is the significance of the "RHG" suffix in the part number?

A: The "RHG" suffix indicates a variant designation from Taiwan Semiconductor Corporation. This designation does not alter the electrical performance or package specification; it reflects internal manufacturing or distribution tracking.

Q: Can these parts be mixed in the same production batch?

A: Yes. Since both parts are parametrically identical and share the same package, they can be used interchangeably within the same assembly without affecting circuit performance or reliability.

Q: What should be verified when substituting between these parts?

A: Verify that the PCB footprint matches the SOD-123F package specification and that the circuit design operates within the specified zener voltage tolerance of ±2% at 13 V nominal.

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