BZD27C82P Equivalent & Substitute Parts

Part Overview

The BZD27C82P is a Zener diode rated at 82 V, 1 W with ±6.09% tolerance in Sub SMA surface mount packaging (DO-219AB). This component is classified as "Not For New Designs" by the manufacturer, indicating it has reached end-of-life status. The part operates across a temperature range of -55°C to 175°C and is ROHS3 compliant with unlimited moisture sensitivity level (MSL 1).

Due to its discontinued status, equivalent and substitute parts are necessary for ongoing production support, maintenance applications, and legacy system repairs. Substitute options include both parametric equivalents in the same package and a manufacturer-recommended alternative in a different package configuration.

Key Parameters

Parameter	Value	Unit
Voltage - Zener (Nominal)	82	V
Power - Maximum	1	W
Tolerance	±6.09%	%
Impedance (Maximum)	200	Ohms
Current - Reverse Leakage @ 62 V	1	µA
Voltage - Forward (Maximum) @ 200 mA	1.2	V
Operating Temperature Range	-55 to 175	°C
Mounting Type	Surface Mount
Package / Case	DO-219AB

Substitute Part Grouping Explanation

Substitution of the BZD27C82P is determined by the following critical parameters:

Electrical Parameters (Must Match):

Zener voltage: 82 V nominal
Power rating: 1 W maximum
Impedance: 200 Ohms maximum
Reverse leakage current: 1 µA @ 62 V
Operating temperature range: -55°C to 175°C

Mechanical Parameters (Package Compatibility):

Mounting type: Surface Mount
Package / Case: DO-219AB (Sub SMA)

Substitute parts are grouped into two categories:

Category 1: Parametric Equivalents (Same Package) Parts BZD27C82P M2G, BZD27C82P MHG, BZD27C82P MTG, BZD27C82P R3G, BZD27C82P RFG, BZD27C82P RHG, BZD27C82P RQG, BZD27C82P RTG, and BZD27C82P RUG maintain identical electrical specifications and the same DO-219AB Sub SMA package. These parts differ only in manufacturing date codes or tape reel configurations and are direct functional replacements.

Category 2: Manufacturer-Recommended Alternative (Different Package) Part BZD27C82PW is the manufacturer-recommended substitute with identical electrical specifications (82 V, 1 W) but uses SOD-123W packaging instead of Sub SMA. This part features improved forward voltage characteristics (1 V @ 200 mA versus 1.2 V @ 200 mA) and tighter tolerance (±5% versus ±6.09%). PCB layout and footprint modifications are required for this substitution.

Parameter Comparison

Parameter	BZD27C82P	BZD27C82P M2G	BZD27C82P MHG	BZD27C82P MTG	BZD27C82P R3G	BZD27C82P RFG	BZD27C82P RHG	BZD27C82P RQG	BZD27C82P RTG	BZD27C82P RUG	BZD27C82PW
Voltage - Zener (Nom)	82 V	82 V	82 V	82 V	82 V	82 V	82 V	82 V	82 V	82 V	82 V
Tolerance	±6.09%	±6.09%	±6.09%	±6.09%	±6.09%	±6.09%	±6.09%	±6.09%	±6.09%	±6.09%	±5%
Power - Max	1 W	1 W	1 W	1 W	1 W	1 W	1 W	1 W	1 W	1 W	1 W
Impedance (Max)	200 Ω	200 Ω	200 Ω	200 Ω	200 Ω	200 Ω	200 Ω	200 Ω	200 Ω	200 Ω	200 Ω
Current - Reverse Leakage @ 62 V	1 µA	1 µA	1 µA	1 µA	1 µA	1 µA	1 µA	1 µA	1 µA	1 µA	1 µA
Voltage - Forward (Max) @ 200 mA	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1 V
Operating Temperature	-55 to 175°C	-55 to 175°C	-55 to 175°C	-55 to 175°C	-55 to 175°C	-55 to 175°C	-55 to 175°C	-55 to 175°C	-55 to 175°C	-55 to 175°C	-55 to 175°C
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Package / Case	DO-219AB	DO-219AB	DO-219AB	DO-219AB	DO-219AB	DO-219AB	DO-219AB	DO-219AB	DO-219AB	DO-219AB	SOD-123W
Product Status	Not For New Designs	Active	Active	Active	Active	Active	Active	Active	Active	Active	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant

Engineering Selection Recommendations

For Direct Replacement (Same Footprint): Select any of the parametric equivalent parts (BZD27C82P M2G, BZD27C82P MHG, BZD27C82P MTG, BZD27C82P R3G, BZD27C82P RFG, BZD27C82P RHG, BZD27C82P RQG, BZD27C82P RTG, or BZD27C82P RUG) when maintaining the existing DO-219AB Sub SMA footprint is required. All these parts are in Active product status and carry identical electrical specifications to the original BZD27C82P. They are ROHS3 compliant and REACH unaffected, meeting current regulatory requirements for production and maintenance applications.

For Optimized Performance with Layout Modification: The BZD27C82PW is the manufacturer-recommended substitute and is the preferred choice when PCB redesign is feasible. This part offers superior electrical characteristics with tighter tolerance (±5% versus ±6.09%) and lower forward voltage (1 V @ 200 mA versus 1.2 V @ 200 mA), resulting in reduced power dissipation. The SOD-123W package requires footprint modification but provides improved thermal performance. This part is in Active status and fully compliant with ROHS3 and REACH requirements.

Compliance Considerations: All substitute parts maintain ROHS3 compliance and REACH unaffected status, ensuring compatibility with current manufacturing and environmental regulations. Moisture sensitivity level remains at MSL 1 (Unlimited) across all options, eliminating special handling requirements during assembly.

Frequently Asked Questions (FAQ)

Q: Can I use BZD27C82P M2G, MHG, MTG, R3G, RFG, RHG, RQG, RTG, or RUG as direct replacements for BZD27C82P?

A: Yes. These nine parametric equivalent parts maintain identical electrical specifications (82 V, 1 W, ±6.09% tolerance, 200 Ω impedance) and use the same DO-219AB Sub SMA package. They are direct functional replacements requiring no PCB modifications. All are in Active product status.

Q: What is the difference between the parametric equivalents and BZD27C82PW?

A: The parametric equivalents (M2G, MHG, MTG, R3G, RFG, RHG, RQG, RTG, RUG) use the DO-219AB Sub SMA package identical to the original BZD27C82P. The BZD27C82PW uses SOD-123W packaging and offers improved specifications: tighter tolerance (±5% versus ±6.09%) and lower forward voltage (1 V @ 200 mA versus 1.2 V @ 200 mA). PCB layout changes are required for BZD27C82PW substitution.

Q: Why is the original BZD27C82P marked "Not For New Designs"?

A: This designation indicates the part has reached end-of-life status. Existing inventory remains available for support of legacy systems and ongoing production, but new designs should utilize active alternatives such as BZD27C82P RUG or BZD27C82PW.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. All substitute parts listed (BZD27C82P M2G, MHG, MTG, R3G, RFG, RHG, RQG, RTG, RUG, and BZD27C82PW) are ROHS3 compliant and REACH unaffected, meeting current regulatory requirements.

Q: Do the parametric equivalents have different tape reel configurations?

A: The parametric equivalents may differ in manufacturing date codes and tape reel specifications, but these differences do not affect electrical performance or functional compatibility. All are supplied in Tape & Reel (TR) packaging suitable for automated assembly.

Q: What is the operating temperature range for all substitute parts?

A: All substitute parts operate across the same temperature range as the original BZD27C82P: -55°C to 175°C (TJ). This ensures thermal compatibility in existing circuit designs.

Q: If I select BZD27C82PW, what PCB modifications are necessary?

A: The BZD27C82PW uses SOD-123W packaging instead of DO-219AB Sub SMA. The footprint dimensions differ, requiring PCB layout modifications to accommodate the new package geometry. Consult the SOD-123W package drawing for specific pad dimensions and placement requirements.

Q: Can I mix parametric equivalents in the same production batch?

A: Yes. All parametric equivalents (M2G, MHG, MTG, R3G, RFG, RHG, RQG, RTG, RUG) are electrically and mechanically identical and can be used interchangeably within the same assembly without functional impact.

Q: What is the moisture sensitivity level (MSL) for all substitute parts?

A: All substitute parts carry MSL 1 (Unlimited), indicating no special moisture control or baking procedures are required during storage or assembly. This matches the original BZD27C82P specification.

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